MC34903CP5EK vs MC34903CP3EK Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC34903CP5EK disebabkan oleh NXP Semiconductors dan MC34903CP3EK disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP
MC34903CP5EK ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP
MC34903CP3EK ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MC34903CP5EK | MC34903CP3EK |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Specialized PMIC | Power Management |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Product Type | System Basis Chip (SBC) with dual LDO + HS-CAN | — |
| Number of LDOs | 2 | — |
| LDO Output Voltage | 5.0 V (typ) | 3.3 V (x2) |
| LDO Output Current (each) | 400 mA | — |
| Gambaran Tegangan Masukan | 5.5 V to 28 V | — |
| Load Dump Tolerance | 40 V (max) | — |
| Quiescent Current (standby) | 2 mA (typ) | — |
| Number of Wake-up Inputs | 3 | — |
| CAN Interface | High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud | 1 Mbps, ISO 11898 compliant |
| Communication Interface | SPI (control/status) | — |
| Gambaran Suhu Operasi | -40 °C to +125 °C | — |
| Package Type | SOIC-32 (exposed pad, 7.5 mm body) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Automotive Qualification | AEC-Q100 qualified | — |
| Status RoHS | Compliant | Compliant |
| Fungsi | — | System Basis Chip (SBC) - PMIC + CAN + LIN |
| Tetstruktur | — | Dual LDO + high-side switches + CAN/LIN transceivers |
| Bilangan Output | — | 2 LDOs + multiple high-side drivers |
| LDO Output Current | — | 400 mA per LDO |
| LIN Interface | — | LIN 2.0 slave |
| Wake-up Inputs | — | 3 (cyclic and edge-triggered) |
| Supply Voltage Range | — | 9 V to 18 V nominal (5.5 V to 40 V transient) |
| Suhu Operasi | — | -40C to +125C |
| Kemasan | — | 32-SOIC-EP (exposed pad) |
| Configuration Interface | — | SPI / SCI |
| Pengumpasan Panas | — | Integrated |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |