MC34903CP5EK vs MC34903CP3EK Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC34903CP5EK sa pamamagitan ng NXP Semiconductors at MC34903CP3EK sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC34903CP5EK MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP

MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP

MC34903CP5EK ⚠ Huling Pagbili
NXP Semiconductors
MC34903CP3EK MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP

MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP

MC34903CP3EK ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro MC34903CP5EK MC34903CP3EK
Brand NXP Semiconductors NXP Semiconductors
Kategorya Specialized PMIC Power Management
Katayuan ng Lifecycle Huling Pagbili Tapus ng Buhay
Product Type System Basis Chip (SBC) with dual LDO + HS-CAN —
Number of LDOs 2 —
LDO Output Voltage 5.0 V (typ) 3.3 V (x2)
LDO Output Current (each) 400 mA —
Hanay ng Voltage ng Input 5.5 V to 28 V —
Load Dump Tolerance 40 V (max) —
Quiescent Current (standby) 2 mA (typ) —
Number of Wake-up Inputs 3 —
CAN Interface High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud 1 Mbps, ISO 11898 compliant
Communication Interface SPI (control/status) —
Hanay ng Temperature na Operasyon -40 °C to +125 °C —
Package Type SOIC-32 (exposed pad, 7.5 mm body) —
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng MSL 3 (per JEDEC J-STD-020) 3 (168 hours)
Automotive Qualification AEC-Q100 qualified —
Tindminan RoHS Compliant Compliant
Fungsi — System Basis Chip (SBC) - PMIC + CAN + LIN
Topolohiya — Dual LDO + high-side switches + CAN/LIN transceivers
Bilang ng Outputs — 2 LDOs + multiple high-side drivers
LDO Output Current — 400 mA per LDO
LIN Interface — LIN 2.0 slave
Wake-up Inputs — 3 (cyclic and edge-triggered)
Supply Voltage Range — 9 V to 18 V nominal (5.5 V to 40 V transient)
Temperature na Operasyon — -40C to +125C
Packhaging — 32-SOIC-EP (exposed pad)
Configuration Interface — SPI / SCI
Thermal Shutdown — Integrated
Katayuan ng Lifecycle — End of Life (per NXP product page)

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