MC68HC11E0CFN2R2 vs MC68HC11E1CFNE3R Perbandingan

Perbandingan bersamaan detil MC68HC11E0CFN2R2 dari NXP Semiconductors dan MC68HC11E1CFNE3R dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC68HC11E0CFN2R2 MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 Nrnd
NXP Semiconductors
MC68HC11E1CFNE3R MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum MC68HC11E0CFN2R2 MC68HC11E1CFNE3R
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Core Architecture M68HC11 8-bit CISC CISC
Bus Frequency 2 MHz —
Program Memory ROMless (0 bytes on-chip) —
RAM 256 bytes —
On-chip ROM 0 bytes (ROMless) —
On-chip EEPROM 0 bytes —
Tegangan Pemuat 3.0 V to 5.5 V (4.5 V to 5.5 V for full speed) 5 V
A/D Converter 8 channels x 8-bit —
Serial Interfaces 1x SCI (async NRZ), 1x SPI —
Timer 16-bit with IC/OC + pulse accumulator —
I/O Pins Up to 38 bidirectional —
Paket 52-PLCC (FN package), 19.13 x 19.13 mm 52-PLCC (FN) 19.1 x 19.1 mm
Lead Style J-bend (PLCC) —
Suhu Kerja -40C to +85C (industrial) -40C to +85C (industrial)
Tipe Mounting Surface Mount Surface Mount
Level MSL [DATA_NEEDED: MSL level per J-STD-020] —
Status RoHS unknown - legacy part —
Core Processor — HC11
Core Size — 8-Bit
Maximum Clock Speed — 3 MHz
Program Memory Size — ROMless (none on-chip)
Program Memory Type — ROMless
EEPROM Size — 512 x 8 bytes
RAM Size — 512 x 8 bytes
Number of I/O — 38
Connectivity — SCI, SPI
Peripherals — POR, WDT
Lebar Bus Data — 8-Bit
Packaging — Tape & Reel (R suffix)

Spek dan Sumber

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