MC68HC11E0CFN2R2 vs MC68HC11E1CFNE3R 比較

詳細並排比較 MC68HC11E0CFN2R2 由 NXP Semiconductors 與 MC68HC11E1CFNE3R 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC68HC11E0CFN2R2 MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 Nrnd
NXP Semiconductors
MC68HC11E1CFNE3R MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R ⚠ 最後購買機會

規格比較

參數 MC68HC11E0CFN2R2 MC68HC11E1CFNE3R
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 最後購買
Core Architecture M68HC11 8-bit CISC CISC
Bus Frequency 2 MHz —
Program Memory ROMless (0 bytes on-chip) —
RAM 256 bytes —
On-chip ROM 0 bytes (ROMless) —
On-chip EEPROM 0 bytes —
供應電壓 3.0 V to 5.5 V (4.5 V to 5.5 V for full speed) 5 V
A/D Converter 8 channels x 8-bit —
Serial Interfaces 1x SCI (async NRZ), 1x SPI —
Timer 16-bit with IC/OC + pulse accumulator —
I/O Pins Up to 38 bidirectional —
封裝 52-PLCC (FN package), 19.13 x 19.13 mm 52-PLCC (FN) 19.1 x 19.1 mm
Lead Style J-bend (PLCC) —
工作溫度 -40C to +85C (industrial) -40C to +85C (industrial)
安裝類型 Surface Mount Surface Mount
MSL 等級 [DATA_NEEDED: MSL level per J-STD-020] —
RoHS 狀態 unknown - legacy part —
Core Processor — HC11
Core Size — 8-Bit
Maximum Clock Speed — 3 MHz
Program Memory Size — ROMless (none on-chip)
Program Memory Type — ROMless
EEPROM Size — 512 x 8 bytes
RAM Size — 512 x 8 bytes
Number of I/O — 38
Connectivity — SCI, SPI
Peripherals — POR, WDT
資料匯流排寬度 — 8-Bit
Packaging — Tape & Reel (R suffix)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價