MC9S08DN60AMLH vs MC9S08DN60ACLH Perbandingan

Perbandingan bersamaan detil MC9S08DN60AMLH dari NXP Semiconductors dan MC9S08DN60ACLH dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S08DN60AMLH MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH Nrnd
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S08DN60AMLH MC9S08DN60ACLH
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Product Type 8-bit microcontroller —
CPU Core Enhanced HCS08 core —
Maximum CPU Frequency 40 MHz —
System Bus Frequency 20 MHz —
Flash Memory 60 KB —
Flash Organization 60K x 8 bits —
RAM 2 KB —
ADC 10-bit 16-channel, 12-bit, 2.5 us conversion
Serial Interface Multiple serial interfaces —
LIN Capability LIN master —
LCD Support LCD driver —
Paket 64-LQFP, 10 x 10 mm —
Tipe Mounting Surface mount Surface Mount
Embedded Emulation and Debug Supported by HCS08 family documentation —
Instruction Set HCS08 instruction set HC08 + BGND instruction
Status RoHS [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Suhu Kerja [DATA_NEEDED: operating temperature range] -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Core — HCS08 (S08 core)
Lebar Bus Data — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
RAM Size — 2 KB (2K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
Paket / Case — 64-LQFP (10x10 mm)
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Oscillator Type — External
Interrupt Sources — Up to 32
Packaging — Tray
On-Chip Debug — BDM (Background Debug Mode)

Spek dan Sumber

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