MC9S08DN60AMLH vs MC9S08DN60ACLH Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DN60AMLH disebabkan oleh NXP Semiconductors dan MC9S08DN60ACLH disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S08DN60AMLH MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH Nrnd
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Pengandingan Spesifikasi

Parametr MC9S08DN60AMLH MC9S08DN60ACLH
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Product Type 8-bit microcontroller —
CPU Core Enhanced HCS08 core —
Maximum CPU Frequency 40 MHz —
System Bus Frequency 20 MHz —
Flash Memory 60 KB —
Flash Organization 60K x 8 bits —
RAM 2 KB —
ADC 10-bit 16-channel, 12-bit, 2.5 us conversion
Serial Interface Multiple serial interfaces —
LIN Capability LIN master —
LCD Support LCD driver —
Kemasan 64-LQFP, 10 x 10 mm —
Jenis Pemasangan Surface mount Surface Mount
Embedded Emulation and Debug Supported by HCS08 family documentation —
Instruction Set HCS08 instruction set HC08 + BGND instruction
Status RoHS [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Suhu Operasi [DATA_NEEDED: operating temperature range] -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Core — HCS08 (S08 core)
Lebar Bus Data — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
RAM Size — 2 KB (2K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
Kemasan / Case — 64-LQFP (10x10 mm)
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Oscillator Type — External
Interrupt Sources — Up to 32
Packaging — Tray
On-Chip Debug — BDM (Background Debug Mode)

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