MC9S08DN60AMLH vs MC9S08DN60ACLH Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DN60AMLH sa pamamagitan ng NXP Semiconductors at MC9S08DN60ACLH sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08DN60AMLH MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH Nrnd
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Pagsanggunian na paghahambing

Parametro MC9S08DN60AMLH MC9S08DN60ACLH
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle NRND NRND
Product Type 8-bit microcontroller —
CPU Core Enhanced HCS08 core —
Maximum CPU Frequency 40 MHz —
System Bus Frequency 20 MHz —
Flash Memory 60 KB —
Flash Organization 60K x 8 bits —
RAM 2 KB —
ADC 10-bit 16-channel, 12-bit, 2.5 us conversion
Serial Interface Multiple serial interfaces —
LIN Capability LIN master —
LCD Support LCD driver —
Packhaging 64-LQFP, 10 x 10 mm —
Uri ng Pagpapasok Surface mount Surface Mount
Embedded Emulation and Debug Supported by HCS08 family documentation —
Instruction Set HCS08 instruction set HC08 + BGND instruction
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Core — HCS08 (S08 core)
Width ng Data Bus — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
RAM Size — 2 KB (2K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
Packhaging / Kaso — 64-LQFP (10x10 mm)
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Oscillator Type — External
Interrupt Sources — Up to 32
Packaging — Tray
On-Chip Debug — BDM (Background Debug Mode)

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