MC9S12D32MFUE vs MC9S12D64MFUER Perbandingan

Perbandingan bersamaan detil MC9S12D32MFUE dari NXP Semiconductors dan MC9S12D64MFUER dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S12D32MFUE MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE Nrnd

Perbandingan Spesifikasi

Parameter Umum MC9S12D32MFUE MC9S12D64MFUER
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Processor Core HCS12 —
Processor Series S12D —
Lebar Bus Data 16 bit —
Frekuensi Bawah Maximum 25 MHz —
Program Memory Size 32 KB (32K x 8) 64 KB (64K x 8)
Program Memory Type Flash Flash
RAM Size 4K x 8 bytes —
EEPROM Size 1K x 8 bytes —
Number of I/O 59 59
Connectivity CANbus, I2C, SCI, SPI —
Peripherals PWM, WDT —
Operating Voltage 2.5 V / 5 V —
Paket 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
Jumlah Pin 80 pins —
Tipe Mounting Surface Mount Surface Mount (SMD/SMT)
Status Lingkungan Hidup NRND —
RoHS Not stated in verified data —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Tegangan Pemuat — 2.5 V / 5 V
ADC — 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Rentang Suhu Kerja — -40 C to +125 C
Automotive Qualification — AEC-Q100
Status RoHS — Compliant
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

Spek dan Sumber

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