MC9S12D32MFUE vs MC9S12D64MFUER Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12D32MFUE disebabkan oleh NXP Semiconductors dan MC9S12D64MFUER disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12D32MFUE MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE Nrnd

Pengandingan Spesifikasi

Parametr MC9S12D32MFUE MC9S12D64MFUER
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Processor Core HCS12 —
Processor Series S12D —
Lebar Bus Data 16 bit —
Frekuensi Klock Maksimum 25 MHz —
Program Memory Size 32 KB (32K x 8) 64 KB (64K x 8)
Program Memory Type Flash Flash
RAM Size 4K x 8 bytes —
EEPROM Size 1K x 8 bytes —
Number of I/O 59 59
Connectivity CANbus, I2C, SCI, SPI —
Peripherals PWM, WDT —
Operating Voltage 2.5 V / 5 V —
Kemasan 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
Kiraan Pin 80 pins —
Jenis Pemasangan Surface Mount Surface Mount (SMD/SMT)
Status Lingkungan Hidup NRND —
RoHS Not stated in verified data —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Tegangan Pemberi Arus — 2.5 V / 5 V
ADC — 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Gambaran Suhu Operasi — -40 C to +125 C
Automotive Qualification — AEC-Q100
Status RoHS — Compliant
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

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