MC9S12D32MFUE vs MC9S12D64MFUER 比較

詳細並排比較 MC9S12D32MFUE 由 NXP Semiconductors 與 MC9S12D64MFUER 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12D32MFUE MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE - 16-Bit 25MHz HCS12 MCU | NXP | Automotive

MC9S12D32MFUE Nrnd

規格比較

參數 MC9S12D32MFUE MC9S12D64MFUER
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Processor Core HCS12 —
Processor Series S12D —
資料匯流排寬度 16 bit —
最大時脈頻率 25 MHz —
Program Memory Size 32 KB (32K x 8) 64 KB (64K x 8)
Program Memory Type Flash Flash
RAM Size 4K x 8 bytes —
EEPROM Size 1K x 8 bytes —
Number of I/O 59 59
Connectivity CANbus, I2C, SCI, SPI —
Peripherals PWM, WDT —
Operating Voltage 2.5 V / 5 V —
封裝 80-QFP (14 x 14 mm) 80-QFP (14 x 14 mm), also called PQFP-80
腳位數 80 pins —
安裝類型 Surface Mount Surface Mount (SMD/SMT)
生命週期狀態 NRND —
RoHS Not stated in verified data —
Core Architecture — HCS12 (16-bit CISC)
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
供應電壓 — 2.5 V / 5 V
ADC — 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
工作溫度範圍 — -40 C to +125 C
Automotive Qualification — AEC-Q100
RoHS 狀態 — Compliant
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

資料表與資源

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