MCF5329CVM240 vs MCF5327CVM240J Perbandingan
Perbandingan bersamaan detil MCF5329CVM240 dari NXP Semiconductors dan MCF5327CVM240J dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MCF5329CVM240 | MCF5327CVM240J |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Architecture | ColdFire V3 (VLRISC) | ColdFire V3 (32-bit RISC, variable-length) |
| Core Bit Width | 32-bit | — |
| Frekuensi Bawah Maximum | 240 MHz | 240 MHz |
| On-chip SRAM | 32 KB | — |
| Unified Cache | 16 KB write-back | — |
| Program Memory Type | ROMless (external memory bus required) | — |
| Number of I/O Lines | 94 | 94 |
| Paket | 256-LBGA (MAPBGA) | 196-LBGA (MAPBGA) 15x15 mm |
| Tipe Mounting | Surface Mount | Surface Mount |
| Tegangan Pemuat | 1.5 V core / 3.3 V I/O (typical, refer to datasheet) | — |
| Suhu Kerja | -40C to +85C (industrial) | — |
| Oscillator Type | External | External |
| LCD Controller | Integrated (TFT/STN, first integrated LCD on ColdFire) | — |
| Ethernet | 10/100 MAC integrated | — |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Debug Interface | JTAG/BDM/OnCE | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | Compliant |
| Performance | — | 211 MIPS |
| Internal SRAM | — | 32 KB |
| Program Memory | — | ROMless (external memory interface) |
| Operating Temperature Grade | — | Industrial |
| Integrated LCD Controller | — | Yes (TFT, up to 800x600) |
| Ethernet MAC | — | Yes (10/100) |
| CAN | — | Yes |
| JTAG / BDM Debug | — | Yes |