MCF5372LCVM240J vs SCF5250VM120 Perbandingan
Perbandingan bersamaan detil MCF5372LCVM240J dari NXP Semiconductors dan SCF5250VM120 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
MCF5372LCVM240J NrndPerbandingan Spesifikasi
| Parameter Umum | MCF5372LCVM240J | SCF5250VM120 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Unknown |
| Core | ColdFire V3 (MCF537x) | — |
| Lebar Bus Data | 32-bit | — |
| Frekuensi Bawah Maximum | 240 MHz | — |
| Architecture | Variable-length RISC (ColdFire) | RISC 32-bit |
| Program Memory Type | ROMless (external boot memory required) | — |
| Paket / Case | 196-LBGA (MAP-BGA, 15x15 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Suhu Kerja | [DATA_NEEDED: industrial temperature grade confirmed by 'J' suffix; full range not in provided web data] | [DATA_NEEDED: operating temperature range] |
| Number of I/O | [DATA_NEEDED: number of GPIO pins not in provided web data] | — |
| Tegangan Pemuat | [DATA_NEEDED: core and I/O voltage not in provided web data] | 3.3 V |
| Peripherals | Ethernet MAC, USB, UART, timers (per MCF5372 family) | — |
| External Memory Interface | External SDRAM/NOR Flash bus | — |
| Status RoHS | [DATA_NEEDED: explicit RoHS statement not in provided web data] | [DATA_NEEDED: RoHS compliance] |
| Level MSL | [DATA_NEEDED: MSL rating not in provided web data] | — |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Program Memory | — | ROMless |
| Number of I/O Pins | — | 57 |
| Process Technology | — | 0.13 um |
| Paket | — | 196-LBGA (15 x 15 mm) |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |