MPC5554MVR132 vs MPC5554MVR80 Perbandingan

Perbandingan bersamaan detil MPC5554MVR132 dari NXP Semiconductors dan MPC5554MVR80 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

Perbandingan Spesifikasi

Parameter Umum MPC5554MVR132 MPC5554MVR80
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Architecture Power Architecture e200z6 —
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Paket 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-ball PBGA, 27 mm x 27 mm, 1 mm pitch
Tipe Mounting Surface Mount Surface Mount
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Rentang Suhu Kerja -40 C to +125 C (junction) —
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
Status RoHS Compliant Lead-Free (MS-034AAL-1 TEPBGA-416)
Level MSL 3 (per JEDEC J-STD-020) —
Core — e200z6 (Power Architecture)
CPU Architecture — 32-bit RISC, 7-stage pipeline
Maximum CPU Frequency — 80 MHz
Program Flash Memory — 2 MB (2M x 8)
Suhu Kerja — -40C to +125C (Automotive Grade)
Tegangan Pemuat — 1.8 V / 2.5 V / 3.3 V / 5 V (per datasheet)
Series — MPC55xx Qorivva
RAM Size — [DATA_NEEDED: RAM size]
Data Converters — [DATA_NEEDED: ADC/DAC channels]
Number of I/O — [DATA_NEEDED: I/O count]
Connectivity — CAN, FlexRay, eMIOS, eTPU
Lifecycle Stage — NRND (Not Recommended for New Designs)

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon