MPC860PCZQ50D4 vs MPC860ENCVR50D4 Perbandingan
Perbandingan bersamaan detil MPC860PCZQ50D4 dari NXP Semiconductors dan MPC860ENCVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ Akhir Hidup
Perbandingan Spesifikasi
| Parameter Umum | MPC860PCZQ50D4 | MPC860ENCVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPU PowerQUICC MPC8xx |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | 32-Bit PowerPC |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 (CPU + CPM RISC engine) | — |
| Operating Voltage - I/O | 3.3 V | — |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) | — |
| Process Technology | 0.32 micron CMOS | 0.32 um CMOS |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| MMU | Yes (32-bit virtual addressing) | — |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) | — |
| Paket | 357-PBGA (25x25 mm) | — |
| Rentang Suhu Kerja | -40C to +85C (industrial, 'PC' suffix) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead | — |
| Status RoHS | Non-Compliant (contains lead) | RoHS Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status Lingkungan Hidup | End of Life | — |
| Core Count | — | 1 |
| Frekuensi Bawah Maximum | — | 50 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Paket / Case | — | 357-BBGA (PBGA, 25 x 25 mm) |
| On-chip Peripherals | — | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Series | — | MPC8xx PowerQUICC |