MPC860PCZQ50D4 vs MPC860ENCVR50D4 比較
詳細並排比較 MPC860PCZQ50D4 由 NXP Semiconductors 與 MPC860ENCVR50D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ 停產
規格比較
| 參數 | MPC860PCZQ50D4 | MPC860ENCVR50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | NRND |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPU PowerQUICC MPC8xx |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | 32-Bit PowerPC |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 (CPU + CPM RISC engine) | — |
| Operating Voltage - I/O | 3.3 V | — |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) | — |
| Process Technology | 0.32 micron CMOS | 0.32 um CMOS |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| MMU | Yes (32-bit virtual addressing) | — |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) | — |
| 封裝 | 357-PBGA (25x25 mm) | — |
| 工作溫度範圍 | -40C to +85C (industrial, 'PC' suffix) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead | — |
| RoHS 狀態 | Non-Compliant (contains lead) | RoHS Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 生命週期狀態 | End of Life | — |
| Core Count | — | 1 |
| 最大時脈頻率 | — | 50 MHz |
| 工作電源電壓 | — | 3.3 V |
| 封裝 / 外殼 | — | 357-BBGA (PBGA, 25 x 25 mm) |
| On-chip Peripherals | — | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Series | — | MPC8xx PowerQUICC |