MPC860PZQ66D4 vs MPC860TZQ66D4 Perbandingan

Perbandingan bersamaan detil MPC860PZQ66D4 dari NXP Semiconductors dan MPC860TZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC860PZQ66D4 MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860PZQ66D4 ✗ Akhir Hidup
NXP Semiconductors
MPC860TZQ66D4 MPC860TZQ66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TZQ66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TZQ66D4 ✗ Akhir Hidup

Perbandingan Spesifikasi

Parameter Umum MPC860PZQ66D4 MPC860TZQ66D4
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Akhir Hidup
Processor Family PowerQUICC MPC8xx —
Core Architecture 32-bit PowerPC PowerPC, 32-bit
Core Count 1 1
Maximum CPU Clock 66 MHz —
Tegangan Pemuat Kerja 3.3 V —
Paket 357-PBGA (25x25 mm) —
Tipe Mounting Surface Mount Surface Mount
Lead Status Contains Lead (non-RoHS) —
Status RoHS Non-Compliant (Contains Lead) RoHS non-compliant (Contains Lead)
Packaging Tray Tray
On-chip Communications Module CPM with SCCs, SMCs, Ethernet, HDLC —
Memory Controller DRAM, SRAM, Flash, EPROM —
Timers 4 x 16-bit —
Process Technology 0.32 um CMOS —
Suhu Kerja -40C to +95C (industrial, per D4 revision) 0 °C to +70 °C
Level MSL 3 —
Series PowerQUICC —
Manufacturer — NXP Semiconductors
Part Family — MPC8xx PowerQUICC
Core Frequency — 66 MHz
Tegangan Pemuat — 3.3 V
Paket / Case — 357-PBGA (25x25 mm)
Lead Free Status — Contains Lead
Communications Module — CPM (QUICC Engine)
Status Lingkungan Hidup — End of Life (per NXP)
Kategori — Microprocessors - MPU

Spek dan Sumber

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