MPC860PZQ66D4 vs MPC860TZQ66D4 比較
詳細並排比較 MPC860PZQ66D4 由 NXP Semiconductors 與 MPC860TZQ66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860PZQ66D4 | MPC860TZQ66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 停產終止 |
| Processor Family | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit PowerPC | PowerPC, 32-bit |
| Core Count | 1 | 1 |
| Maximum CPU Clock | 66 MHz | — |
| 工作電源電壓 | 3.3 V | — |
| 封裝 | 357-PBGA (25x25 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Lead Status | Contains Lead (non-RoHS) | — |
| RoHS 狀態 | Non-Compliant (Contains Lead) | RoHS non-compliant (Contains Lead) |
| Packaging | Tray | Tray |
| On-chip Communications Module | CPM with SCCs, SMCs, Ethernet, HDLC | — |
| Memory Controller | DRAM, SRAM, Flash, EPROM | — |
| Timers | 4 x 16-bit | — |
| Process Technology | 0.32 um CMOS | — |
| 工作溫度 | -40C to +95C (industrial, per D4 revision) | 0 °C to +70 °C |
| MSL 等級 | 3 | — |
| Series | PowerQUICC | — |
| Manufacturer | — | NXP Semiconductors |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 66 MHz |
| 供應電壓 | — | 3.3 V |
| 封裝 / 外殼 | — | 357-PBGA (25x25 mm) |
| Lead Free Status | — | Contains Lead |
| Communications Module | — | CPM (QUICC Engine) |
| 生命週期狀態 | — | End of Life (per NXP) |
| 類別 | — | Microprocessors - MPU |