MPC860SRVR66D4 vs MPC860SRZQ66D4 Perbandingan
Perbandingan bersamaan detil MPC860SRVR66D4 dari NXP Semiconductors dan MPC860SRZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Waktu Beli TerakhirNXP Semiconductors
MPC860SRZQ66D4 - PowerQUICC MPC8xx MPU 66MHz 357-BGA | NXP
MPC860SRZQ66D4 ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MPC860SRVR66D4 | MPC860SRZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | PowerPC 32-bit | — |
| Number of Cores | 1 | — |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | 3.3 V |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes | — |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Suhu Kerja | -40C to +95C | — |
| Paket / Case | 357-PBGA (25 mm x 25 mm) | 357-BBGA (PBGA 25x25 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | Contains Lead |
| Status RoHS | RoHS Compliant | RoHS |
| Core | — | PowerPC, 1 Core |
| Core Speed | — | 66 MHz |
| Lebar Bus Data | — | 32-Bit |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |
| Family | — | PowerQUICC |
| Jumlah Pin | — | 357 |
| On-chip Peripherals | — | CPM (SCC/SMC), Timers, Memory Controller |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |