MPC860SRVR66D4 vs MPC860SRZQ66D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860SRVR66D4 disebabkan oleh NXP Semiconductors dan MPC860SRZQ66D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC860SRZQ66D4 - PowerQUICC MPC8xx MPU 66MHz 357-BGA | NXP
MPC860SRZQ66D4 ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC860SRVR66D4 | MPC860SRZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | PowerPC 32-bit | — |
| Number of Cores | 1 | — |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | 3.3 V |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes | — |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Suhu Operasi | -40C to +95C | — |
| Kemasan / Case | 357-PBGA (25 mm x 25 mm) | 357-BBGA (PBGA 25x25 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | Contains Lead |
| Status RoHS | RoHS Compliant | RoHS |
| Core | — | PowerPC, 1 Core |
| Core Speed | — | 66 MHz |
| Lebar Bus Data | — | 32-Bit |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |
| Family | — | PowerQUICC |
| Kiraan Pin | — | 357 |
| On-chip Peripherals | — | CPM (SCC/SMC), Timers, Memory Controller |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |