MPC860SRVR66D4 vs MPC860SRZQ66D4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC860SRVR66D4 sa pamamagitan ng NXP Semiconductors at MPC860SRZQ66D4 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Huling PagbiliNXP Semiconductors
MPC860SRZQ66D4 - PowerQUICC MPC8xx MPU 66MHz 357-BGA | NXP
MPC860SRZQ66D4 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC860SRVR66D4 | MPC860SRZQ66D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Huling Pagbili | Tapus ng Buhay |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | PowerPC 32-bit | — |
| Number of Cores | 1 | — |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | 3.3 V |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes | — |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Temperature na Operasyon | -40C to +95C | — |
| Packhaging / Kaso | 357-PBGA (25 mm x 25 mm) | 357-BBGA (PBGA 25x25 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | Contains Lead |
| Tindminan RoHS | RoHS Compliant | RoHS |
| Core | — | PowerPC, 1 Core |
| Core Speed | — | 66 MHz |
| Width ng Data Bus | — | 32-Bit |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |
| Family | — | PowerQUICC |
| Bilang ng Pin | — | 357 |
| On-chip Peripherals | — | CPM (SCC/SMC), Timers, Memory Controller |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |