MPC885ZP66 vs MPC885CZP66 Perbandingan
Perbandingan bersamaan detil MPC885ZP66 dari NXP Semiconductors dan MPC885CZP66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC885ZP66 | MPC885CZP66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture | Power Architecture, 32-bit |
| Core Count | 1 | 1 |
| Lebar Bus Data | 32 bit | 32 bit |
| Frekuensi Bawah Maximum | 66 MHz | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Paket | 357-ball PBGA, 25 mm x 25 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0 C to +95 C (commercial) | -40C to +100C |
| I/O Supply Voltage | 3.3 V | — |
| Core Supply Voltage | 1.8 V | — |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART | — |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM | — |
| Status RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS compliance status] |
| Series | — | PowerQUICC, MPC8xx |
| Core Clock Speed | — | 66 MHz |
| Process Technology | — | 0.18 micrometer CMOS |
| Tegangan Pemuat | — | 3.3 V (typical) |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |