MPC885ZP66 vs MPC885CZP66 Karşılaştırma

Ayrıntılı yan yana karşılaştırma MPC885ZP66 tarafından NXP Semiconductors ve MPC885CZP66 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MPC885ZP66 MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC885ZP66 ✓ Aktif
NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd

Özellik Karşılaştırması

Parametre MPC885ZP66 MPC885CZP66
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Aktif NRND
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors
Product Category Microprocessors (MPU) —
Processor Series PowerQUICC MPC8xx —
Core Architecture Power Architecture Power Architecture, 32-bit
Core Count 1 1
Veri Bus Genişliği 32 bit 32 bit
Azami Saat Hızı 66 MHz —
Instruction Cache 4 KB —
Data Cache 4 KB —
Paket 357-ball PBGA, 25 mm x 25 mm —
Montaj Türü Surface Mount Surface Mount
İşletim Sıcaklığı 0 C to +95 C (commercial) -40C to +100C
I/O Supply Voltage 3.3 V —
Core Supply Voltage 1.8 V —
Integrated Peripherals Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART —
Memory Controller SDRAM, DRAM, SRAM, Flash, ROM —
RoHS Durumu Non-Compliant (legacy part) [DATA_NEEDED: RoHS compliance status]
Series — PowerQUICC, MPC8xx
Core Clock Speed — 66 MHz
Process Technology — 0.18 micrometer CMOS
Besleme Gerilimi — 3.3 V (typical)
Package Type — PBGA (Plastic Ball Grid Array)
Package Pin Count — 357
Package Size — 25 x 25 mm
Moisture Sensitivity Level — MSL 3
Terminal Form — Ball
Package Code — BGA
Package Shape — Square
Lead-Free — [DATA_NEEDED: lead-free status]

Dökümanlar & Kaynaklar

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