MPC885ZP66 vs MPC885CZP66 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC885ZP66 disebabkan oleh NXP Semiconductors dan MPC885CZP66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC885ZP66 | MPC885CZP66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture | Power Architecture, 32-bit |
| Core Count | 1 | 1 |
| Lebar Bus Data | 32 bit | 32 bit |
| Frekuensi Klock Maksimum | 66 MHz | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Kemasan | 357-ball PBGA, 25 mm x 25 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0 C to +95 C (commercial) | -40C to +100C |
| I/O Supply Voltage | 3.3 V | — |
| Core Supply Voltage | 1.8 V | — |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART | — |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM | — |
| Status RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS compliance status] |
| Series | — | PowerQUICC, MPC8xx |
| Core Clock Speed | — | 66 MHz |
| Process Technology | — | 0.18 micrometer CMOS |
| Tegangan Pemberi Arus | — | 3.3 V (typical) |
| Package Type | — | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |