MSC8157ETAG1000A vs MSC8157SVT1000A Perbandingan
Perbandingan bersamaan detil MSC8157ETAG1000A dari NXP Semiconductors dan MSC8157SVT1000A dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors
MSC8157ETAG1000A NrndNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoletePerbandingan Spesifikasi
| Parameter Umum | MSC8157ETAG1000A | MSC8157SVT1000A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | NRND | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore MSC815x | — |
| Core Architecture | SC3850 (six-core) | — |
| Number of Cores | 6 | — |
| Core Clock Frequency | 1 GHz | — |
| Aggregate Throughput | >24 GMACS (16-bit fixed point) | — |
| Per-Core MMACS | 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit | — |
| Accelerator Engine | MAPLE-B baseband coprocessor (Turbo/Viterbi) | — |
| Memory Controllers | Dual DDR2/DDR3 with ECC | — |
| High-Speed I/O | 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 | — |
| Paket | 783-FCBGA (29x29 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Suhu Kerja | -40C to +105C | -40C to +105C |
| Supply Voltages | 1.0 V core, 1.5 V DDR, 3.3 V I/O | — |
| Level MSL | 4 (per JEDEC J-STD-020 for large FCBGA) | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Node | [DATA_NEEDED: process node] | — |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Lebar Bus Data | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Tegangan Pemuat | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Jumlah Pin | — | 783 |
| Lead Free | — | Yes |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |