MSC8157ETAG1000A vs MSC8157SVT1000A Karşılaştırma

Ayrıntılı yan yana karşılaştırma MSC8157ETAG1000A tarafından NXP Semiconductors ve MSC8157SVT1000A tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MSC8157ETAG1000A MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors

MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors

MSC8157ETAG1000A Nrnd
NXP Semiconductors
MSC8157SVT1000A MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP

MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP

MSC8157SVT1000A Obsolete

Özellik Karşılaştırması

Parametre MSC8157ETAG1000A MSC8157SVT1000A
Marka NXP Semiconductors NXP Semiconductors
Kategori DSP DSP
Yaşam Döngüsü Durumu NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) —
Series StarCore MSC815x —
Core Architecture SC3850 (six-core) —
Number of Cores 6 —
Core Clock Frequency 1 GHz —
Aggregate Throughput >24 GMACS (16-bit fixed point) —
Per-Core MMACS 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit —
Accelerator Engine MAPLE-B baseband coprocessor (Turbo/Viterbi) —
Memory Controllers Dual DDR2/DDR3 with ECC —
High-Speed I/O 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 —
Paket 783-FCBGA (29x29 mm) —
Montaj Türü Surface Mount (BGA) Surface Mount
İşletim Sıcaklığı -40C to +105C -40C to +105C
Supply Voltages 1.0 V core, 1.5 V DDR, 3.3 V I/O —
MSL Seviyesi 4 (per JEDEC J-STD-020 for large FCBGA) [DATA_NEEDED: MSL rating]
RoHS Durumu Compliant Compliant
Lead-Free Yes —
Process Node [DATA_NEEDED: process node] —
Product Type — Multi-core Digital Signal Processor (DSP SoC)
Architecture — StarCore SC3850, six cores
Veri Bus Genişliği — 64-bit
Maximum Clock Speed — 1 GHz
Performance — 1000 MIPS per core, up to 6000 MIPS aggregate
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
L2 Cache (unified) — Shared KB-scale unified L2
Besleme Gerilimi — 1 V (core) + I/O rails
Package Type — FCBGA-783 (Flip-Chip BGA)
Package Size — 29 mm x 29 mm
Pin Sayısı — 783
Lead Free — Yes
Memory Interface — External DDR2/DDR3 SDRAM controller
Serial Interfaces — SerDes, Ethernet MAC, I2C, UART

Dökümanlar & Kaynaklar

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