MSC8157ETAG1000A vs MSC8157SVT1000A Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MSC8157ETAG1000A disebabkan oleh NXP Semiconductors dan MSC8157SVT1000A disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MSC8157ETAG1000A MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors

MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors

MSC8157ETAG1000A Nrnd
NXP Semiconductors
MSC8157SVT1000A MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP

MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP

MSC8157SVT1000A Obsolete

Pengandingan Spesifikasi

Parametr MSC8157ETAG1000A MSC8157SVT1000A
Merek NXP Semiconductors NXP Semiconductors
Kategori DSP DSP
Status Lingkungan Hidup NRND Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) —
Series StarCore MSC815x —
Core Architecture SC3850 (six-core) —
Number of Cores 6 —
Core Clock Frequency 1 GHz —
Aggregate Throughput >24 GMACS (16-bit fixed point) —
Per-Core MMACS 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit —
Accelerator Engine MAPLE-B baseband coprocessor (Turbo/Viterbi) —
Memory Controllers Dual DDR2/DDR3 with ECC —
High-Speed I/O 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 —
Kemasan 783-FCBGA (29x29 mm) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Suhu Operasi -40C to +105C -40C to +105C
Supply Voltages 1.0 V core, 1.5 V DDR, 3.3 V I/O —
Aras MSL 4 (per JEDEC J-STD-020 for large FCBGA) [DATA_NEEDED: MSL rating]
Status RoHS Compliant Compliant
Lead-Free Yes —
Process Node [DATA_NEEDED: process node] —
Product Type — Multi-core Digital Signal Processor (DSP SoC)
Architecture — StarCore SC3850, six cores
Lebar Bus Data — 64-bit
Maximum Clock Speed — 1 GHz
Performance — 1000 MIPS per core, up to 6000 MIPS aggregate
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
L2 Cache (unified) — Shared KB-scale unified L2
Tegangan Pemberi Arus — 1 V (core) + I/O rails
Package Type — FCBGA-783 (Flip-Chip BGA)
Package Size — 29 mm x 29 mm
Kiraan Pin — 783
Lead Free — Yes
Memory Interface — External DDR2/DDR3 SDRAM controller
Serial Interfaces — SerDes, Ethernet MAC, I2C, UART

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