MT40A1G8SA-062E vs H5AN8G8NDJR Perbandingan

Perbandingan bersamaan detil MT40A1G8SA-062E dari Micron Technology dan H5AN8G8NDJR dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Micron Technology
MT40A1G8SA-062E MT40A1G8SA-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A1G8SA-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A1G8SA-062E ✓ Aktif
SK hynix
H5AN8G8NDJR H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MT40A1G8SA-062E H5AN8G8NDJR
Merek Micron Technology SK hynix
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Tipe Memori DDR4 SDRAM DDR4 SDRAM
Density 8 Gbit 8 Gb
Organisasi 1G x 8 1G x 8
Laju Data 3200 MT/s (DDR4-3200) 3200 MT/s
Clock Frequency 1.6 GHz —
Access Time (CAS Latency) CL22 at 3200 MT/s —
Row Access Time 19 ns —
VDD / VDDQ 1.2 V +/-60 mV —
VPP 2.5 V, -125 mV, +250 mV 2.5 V
Internal Banks 16 banks (4 bank groups x 4 banks) —
Refresh 8192-cycle; 64 ms (0-85C), 32 ms (85-95C), 16 ms (>95C) —
Suhu Kerja 0C to +95C (CT range; IT: -40C to +95C) 0°C to +95°C (Tc)
I/O Type 1.2 V pseudo open-drain —
Burst Length BL8, BC4 (burst chop) 8 and 4 (with burst chop)
Paket 78-ball FBGA (7.5 x 11 mm) FBGA-78 (7.5x11 mm)
Tipe Mounting Surface Mount —
Fitur Auto self-refresh, write leveling, dynamic ODT, CRC, auto precharge, ZQ calibration, on-die adjustable VREFDQ —
Supply Voltage (VDD) — 1.2 V (1.14V to 1.26V)
VDDQ — 1.2 V
Latensi CAS — 22 (typical)
tRCD — 22 ns
tRP — 22 ns
Self-Refresh Current — 30 mA (typical)
Active Standby Current — 60 mA (typical)
RoHS — Compliant
Lead-Free — Yes

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