MT40A256M16LY-062E vs K4A4G165WG-BCWE Perbandingan
Perbandingan bersamaan detil MT40A256M16LY-062E dari Micron Technology dan K4A4G165WG-BCWE dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4A4G165WG-BCWE - 4Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4A4G165WG-BCWE ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MT40A256M16LY-062E | K4A4G165WG-BCWE |
|---|---|---|
| Merek | Micron Technology | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | — | $16,90 |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM (volatile DRAM) |
| Ukuran Memori | 4 Gbit | 4 Gbit |
| Organisasi | 256M x16 | — |
| Antarmuka | Parallel | Parallel |
| Clock Frequency | 1.6 GHz | [DATA_NEEDED: clock frequency / tCK range] |
| Access Time (tAA) | 19 ns | — |
| Supply Voltage (VDD) | 1.2 V | — |
| Data Rate Class | DDR4-2666 (062E speed grade) | — |
| Paket | 96-FBGA (7.5 x 13.5 mm) | FBGA-96 |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Temperature (IT variant) | -40C to +95C | — |
| Auto Self-Refresh | Yes | — |
| Auto Precharge | Yes | — |
| Write Leveling | Yes | — |
| CRC (Command/Address) | Yes | — |
| Data Mask (DM) | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| FBGA Code | D9XSG (AUT variant) | — |
| Status RoHS | Compliant (F = RoHS/lead-free finish) | Compliant (per JLCPCB listing) |
| Memory Organization | — | 256M x 16 |
| Laju Data | — | 3200 Mbps |
| Access Time | — | 19 ns |
| Tegangan Pemuat | — | 1.2 V |
| Suhu Kerja | — | 0C to +85C |
| Memory Format | — | DRAM |
| Technology | — | DDR4 |
| Product Status | — | Active |
| Latensi CAS | — | [DATA_NEEDED: CAS latency] |
| Refresh Rate | — | [DATA_NEEDED: refresh interval] |