P1022NXN2LFB vs P1013NXN2LFB Perbandingan
Perbandingan bersamaan detil P1022NXN2LFB dari NXP Semiconductors dan P1013NXN2LFB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
P1022NXN2LFB ⚠ Waktu Beli TerakhirNXP Semiconductors
P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP
P1013NXN2LFB ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | P1022NXN2LFB | P1013NXN2LFB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Architecture | Power Architecture e500 dual-core (RISC, 32-bit) | — |
| Clock Speed (Core) | 1.067 GHz | — |
| Platform Version | 1067/533/667 ET NE r1.1 | — |
| Core Count | 2 | — |
| Package Type | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) | — |
| Package Dimensions | 31 x 31 mm, 2.23 mm height | — |
| Jumlah Pin | 689 | — |
| Suhu Kerja | -40 °C to +125 °C (industrial) | -40C to +125C (junction) |
| Tegangan Pemuat | 3.13 V to 3.47 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | DDR2/DDR3 with ECC support, up to 32-bit | DDR2/DDR3 with ECC, 64-bit data bus |
| Ethernet MACs | 3 x 10/100/1000 Mbps Gigabit | 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII) |
| PCIe Interfaces | 3 x PCIe Gen1 | — |
| USB | USB 2.0 host/device | 1 x USB 2.0 with integrated PHY |
| Display Controller | 32-bit LCD controller | — |
| Security Engine | Integrated (symmetric/asymmetric crypto acceleration) | — |
| RoHS Compliance | Yes (halogen-free) | — |
| Tipe Mounting | Surface Mount (BGA, requires thermal via array under die) | Surface Mount (BGA) |
| Family | — | QorIQ P1022 (P1 series) |
| Core Architecture | — | 32-bit Power Architecture e500v2 |
| Number of Cores | — | 1 |
| Core Frequency | — | 1.067 GHz |
| L1 Cache (per core) | — | 32 KB instruction + 32 KB data |
| L2 Cache | — | 256 KB platform cache |
| PCI Express | — | 2 x PCIe Gen 1.1 (x4 / x1) |
| Other Interfaces | — | eSDHC, eSPI, I2C, UART, eLBC, LCD controller |
| Paket | — | 689-ball TEPBGA II (31 mm x 31 mm) |
| Process | — | 45 nm SOI |
| Security | — | SEC 4.0 (optional crypto accelerator) on die variant |
| Status RoHS | — | Compliant (Pb-free ball finish) |