P1022NXN2LFB vs P1013NXN2LFB Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci P1022NXN2LFB disebabkan oleh NXP Semiconductors dan P1013NXN2LFB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Bahagian terakhir untuk beli
NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr P1022NXN2LFB P1013NXN2LFB
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Masa Terakhir Dibeli Masa Terakhir Dibeli
Architecture Power Architecture e500 dual-core (RISC, 32-bit) —
Clock Speed (Core) 1.067 GHz —
Platform Version 1067/533/667 ET NE r1.1 —
Core Count 2 —
Package Type TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) —
Package Dimensions 31 x 31 mm, 2.23 mm height —
Kiraan Pin 689 —
Suhu Operasi -40 °C to +125 °C (industrial) -40C to +125C (junction)
Tegangan Pemberi Arus 3.13 V to 3.47 V 1.5 V / 1.8 V / 2.5 V / 3.3 V
Memory Controller DDR2/DDR3 with ECC support, up to 32-bit DDR2/DDR3 with ECC, 64-bit data bus
Ethernet MACs 3 x 10/100/1000 Mbps Gigabit 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII)
PCIe Interfaces 3 x PCIe Gen1 —
USB USB 2.0 host/device 1 x USB 2.0 with integrated PHY
Display Controller 32-bit LCD controller —
Security Engine Integrated (symmetric/asymmetric crypto acceleration) —
RoHS Compliance Yes (halogen-free) —
Jenis Pemasangan Surface Mount (BGA, requires thermal via array under die) Surface Mount (BGA)
Family — QorIQ P1022 (P1 series)
Core Architecture — 32-bit Power Architecture e500v2
Number of Cores — 1
Core Frequency — 1.067 GHz
L1 Cache (per core) — 32 KB instruction + 32 KB data
L2 Cache — 256 KB platform cache
PCI Express — 2 x PCIe Gen 1.1 (x4 / x1)
Other Interfaces — eSDHC, eSPI, I2C, UART, eLBC, LCD controller
Kemasan — 689-ball TEPBGA II (31 mm x 31 mm)
Process — 45 nm SOI
Security — SEC 4.0 (optional crypto accelerator) on die variant
Status RoHS — Compliant (Pb-free ball finish)

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