P1022NXN2LFB vs P1013NXN2LFB Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng P1022NXN2LFB sa pamamagitan ng NXP Semiconductors at P1013NXN2LFB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Huling Pagbili
NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro P1022NXN2LFB P1013NXN2LFB
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Architecture Power Architecture e500 dual-core (RISC, 32-bit) —
Clock Speed (Core) 1.067 GHz —
Platform Version 1067/533/667 ET NE r1.1 —
Core Count 2 —
Package Type TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) —
Package Dimensions 31 x 31 mm, 2.23 mm height —
Bilang ng Pin 689 —
Temperature na Operasyon -40 °C to +125 °C (industrial) -40C to +125C (junction)
Volte ng Pagbibigay 3.13 V to 3.47 V 1.5 V / 1.8 V / 2.5 V / 3.3 V
Memory Controller DDR2/DDR3 with ECC support, up to 32-bit DDR2/DDR3 with ECC, 64-bit data bus
Ethernet MACs 3 x 10/100/1000 Mbps Gigabit 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII)
PCIe Interfaces 3 x PCIe Gen1 —
USB USB 2.0 host/device 1 x USB 2.0 with integrated PHY
Display Controller 32-bit LCD controller —
Security Engine Integrated (symmetric/asymmetric crypto acceleration) —
RoHS Compliance Yes (halogen-free) —
Uri ng Pagpapasok Surface Mount (BGA, requires thermal via array under die) Surface Mount (BGA)
Family — QorIQ P1022 (P1 series)
Core Architecture — 32-bit Power Architecture e500v2
Number of Cores — 1
Core Frequency — 1.067 GHz
L1 Cache (per core) — 32 KB instruction + 32 KB data
L2 Cache — 256 KB platform cache
PCI Express — 2 x PCIe Gen 1.1 (x4 / x1)
Other Interfaces — eSDHC, eSPI, I2C, UART, eLBC, LCD controller
Packhaging — 689-ball TEPBGA II (31 mm x 31 mm)
Process — 45 nm SOI
Security — SEC 4.0 (optional crypto accelerator) on die variant
Tindminan RoHS — Compliant (Pb-free ball finish)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita