S9S08DZ60F2MLHR vs MC9S08DN60ACLH Perbandingan
Perbandingan bersamaan detil S9S08DZ60F2MLHR dari NXP Semiconductors dan MC9S08DN60ACLH dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | S9S08DZ60F2MLHR | MC9S08DN60ACLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (S08) 8-bit CISC | — |
| Maximum CPU Frequency | 40 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | 60 KB (60K x 8) |
| RAM | 2 KB [DATA_NEEDED: exact value] | — |
| EEPROM | [DATA_NEEDED: exact value] | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| Paket | 64-LQFP (10x10 mm) | — |
| Jumlah Pin | 64 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Rentang Suhu Kerja | -40C to +125C (automotive) | — |
| CAN Controller | 1 x CAN 2.0 A/B (MSCAN) | — |
| ADC | 12-bit SAR [DATA_NEEDED: channel count] | 16-channel, 12-bit, 2.5 us conversion |
| LCD Driver | Yes, integrated segment LCD driver | — |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED] | — |
| Core | — | HCS08 (S08 core) |
| Lebar Bus Data | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| RAM Size | — | 2 KB (2K x 8) |
| Number of I/O | — | 53 |
| Paket / Case | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| Suhu Kerja | — | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Packaging | — | Tray |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |