S9S08DZ60F2MLHR vs MC9S08DN60ACLH 比較
詳細並排比較 S9S08DZ60F2MLHR 由 NXP Semiconductors 與 MC9S08DN60ACLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | S9S08DZ60F2MLHR | MC9S08DN60ACLH |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Architecture | HCS08 (S08) 8-bit CISC | — |
| Maximum CPU Frequency | 40 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | 60 KB (60K x 8) |
| RAM | 2 KB [DATA_NEEDED: exact value] | — |
| EEPROM | [DATA_NEEDED: exact value] | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| 封裝 | 64-LQFP (10x10 mm) | — |
| 腳位數 | 64 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度範圍 | -40C to +125C (automotive) | — |
| CAN Controller | 1 x CAN 2.0 A/B (MSCAN) | — |
| ADC | 12-bit SAR [DATA_NEEDED: channel count] | 16-channel, 12-bit, 2.5 us conversion |
| LCD Driver | Yes, integrated segment LCD driver | — |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| RoHS 狀態 | Compliant (per distributor listings) | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED] | — |
| Core | — | HCS08 (S08 core) |
| 資料匯流排寬度 | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| RAM Size | — | 2 KB (2K x 8) |
| Number of I/O | — | 53 |
| 封裝 / 外殼 | — | 64-LQFP (10x10 mm) |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | — | External |
| Interrupt Sources | — | Up to 32 |
| 工作溫度 | — | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Packaging | — | Tray |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |