10CL010YM164C8G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
MPN: 10CL010YM164C8G ✓ Aktif10CL010YM164C8G Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory blocks whose function is defined after manufacture through a hardware description language (HDL) bitstream. Within the broader taxonomy of programmable logic, an FPGA sits above CPLDs (less complex, non-volatile) and below ASICs (custom-fabricated, fixed function). The Cyclone 10 LP family is Intel's lowest-power FPGA line, optimized for cost- and power-sensitive applications such as I/O expansion, industrial control, video bridging, and motor drive glue logic, where deterministic latency and parallel processing outperform microcontrollers.
Key features include 10,320 logic elements (LEs), 414 Kbit embedded RAM (M9K blocks), 56 embedded 18x18 multipliers, 4 PLLs, and a maximum of 224 user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and integrates a hard PCIe Gen1 controller (x1/x2) for protocol bridging. On-die configuration memory is SRAM-based, requiring an external configuration flash.
Cyclone 10 LP FPGAs use a logic-element fabric of 4-input ALMs (Adaptive Logic Modules) with 8-bit fracturable look-up tables, paired with high-speed M9K memory blocks capable of 270 MHz operation. Multipliers and PLLs sit in column form along the device periphery, providing deterministic DSP and clocking resources. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash.
Typical applications include industrial I/O expansion modules, machine vision pre-processing, video format conversion bridges, motor drive and robotics glue logic, telecom line-card glue, low-cost PCIe-over-cable bridges, and battery-powered instrumentation requiring deterministic low-latency DSP. Design with the Quartus Prime Lite toolchain; board bring-up needs a 1.0 V core rail with +/-5% tolerance and a configuration flash circuit.
Alternatif penggantian untuk 10CL010YM164C8G — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian 10CL010YM164C8G (sama faktor bentuk dan footprint) — berbeda di dalam Package, Core Voltage, Embedded Memory, PLLs, MSL Level.
10CL010YM164C6G
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →10CL010YM164A7G
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →10CL010YM164I7G
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →10CL010YM164C8G
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →10CL016YM164C8G
✅ Drop-InKontak untuk harga
Lihat Datasheet →10CL010YM164C8G Rating Maksimal & Karakteristik Listrik
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/Os | 224 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Speed Grade | -8C (commercial, 8 speed grade) |
| Paket | 164-ball MBGA (Micro BGA, 8x8 mm) |
| Suhu Hubung Kerja | 0 C to +85 C (commercial) |
| Configuration Method | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| Tipe Mounting | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
Konfigurasi Pin 10CL010YM164C8G
| Pin produk A1 | I/O — General-purpose user I/O bank 1 |
| Pin produk A2 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Pin produk A3 | I/O — General-purpose user I/O bank 1 |
| Pin produk A4 | I/O — General-purpose user I/O bank 2 |
| Pin produk A5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Pin produk A6 | I/O — General-purpose user I/O bank 2 |
| Pin produk A7 | GND — Ground reference |
| Pin produk A8 | VCCINT — Core supply 1.0 V nominal |
| Pin produk A9 | I/O — General-purpose user I/O bank 3 |
| Pin produk A10 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Pin produk A11 | I/O — General-purpose user I/O bank 3 |
| Pin produk B1 | I/O — General-purpose user I/O bank 1 |
| Pin produk B2 | GND — Ground reference |
| Pin produk B3 | I/O — General-purpose user I/O bank 1 |
| Pin produk B4 | VCCPD1 — Pre-driver supply 2.5 V / 3.3 V bank 1 |
| Pin produk B5 | I/O — General-purpose user I/O bank 2 |
| Pin produk B6 | GND — Ground reference |
| Pin produk B7 | I/O — General-purpose user I/O bank 2 |
| Pin produk B8 | VCCAUX — Auxiliary supply 2.5 V |
| Pin produk B9 | I/O — General-purpose user I/O bank 3 |
| Pin produk B10 | GND — Ground reference |
| Pin produk B11 | I/O — General-purpose user I/O bank 3 |
| Pin produk C1 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Pin produk C2 | I/O — General-purpose user I/O bank 1 |
| Pin produk C3 | GND — Ground reference |
| Pin produk C4 | I/O — General-purpose user I/O bank 1 |
| Pin produk C5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Pin produk C6 | I/O — General-purpose user I/O bank 2 |
| Pin produk C7 | GND — Ground reference |
| Pin produk C8 | I/O — General-purpose user I/O bank 3 |
| Pin produk C9 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Pin produk C10 | I/O — General-purpose user I/O bank 3 |
| Pin produk C11 | GND — Ground reference |
| Pin produk D1 | I/O — General-purpose user I/O bank 1 |
| Pin produk D2 | GND — Ground reference |
| Pin produk D3 | I/O — General-purpose user I/O bank 1 |
| Pin produk D4 | VCCINT — Core supply 1.0 V nominal |
| Pin produk D5 | GND — Ground reference |
| Pin produk D6 | I/O — General-purpose user I/O bank 2 |
| Pin produk D7 | VCCPD2 — Pre-driver supply 2.5 V / 3.3 V bank 2 |
| Pin produk D8 | I/O — General-purpose user I/O bank 3 |
| Pin produk D9 | GND — Ground reference |
| Pin produk D10 | I/O — General-purpose user I/O bank 3 |
| Pin produk D11 | I/O — General-purpose user I/O bank 3 |
| Pin produk E1 | I/O — General-purpose user I/O bank 4 |
| Pin produk E2 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Pin produk E3 | I/O — General-purpose user I/O bank 4 |
| Pin produk E4 | I/O — General-purpose user I/O bank 4 |
| Pin produk E5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Pin produk E6 | I/O — General-purpose user I/O bank 5 |
| Pin produk E7 | GND — Ground reference |
| Pin produk E8 | VCCINT — Core supply 1.0 V nominal |
| Pin produk E9 | I/O — General-purpose user I/O bank 6 |
| Pin produk E10 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Pin produk E11 | I/O — General-purpose user I/O bank 6 |
| Pin produk F1 | I/O — General-purpose user I/O bank 4 |
| Pin produk F2 | GND — Ground reference |
| Pin produk F3 | I/O — General-purpose user I/O bank 4 |
| Pin produk F4 | VCCPD4 — Pre-driver supply 2.5 V / 3.3 V bank 4 |
| Pin produk F5 | I/O — General-purpose user I/O bank 5 |
| Pin produk F6 | GND — Ground reference |
| Pin produk F7 | I/O — General-purpose user I/O bank 5 |
| Pin produk F8 | VCCAUX — Auxiliary supply 2.5 V |
| Pin produk F9 | I/O — General-purpose user I/O bank 6 |
| Pin produk F10 | GND — Ground reference |
| Pin produk F11 | I/O — General-purpose user I/O bank 6 |
| Pin produk G1 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Pin produk G2 | I/O — General-purpose user I/O bank 4 |
| Pin produk G3 | GND — Ground reference |
| Pin produk G4 | I/O — General-purpose user I/O bank 4 |
| Pin produk G5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Pin produk G6 | I/O — General-purpose user I/O bank 5 |
| Pin produk G7 | GND — Ground reference |
| Pin produk G8 | I/O — General-purpose user I/O bank 6 |
| Pin produk G9 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Pin produk G10 | I/O — General-purpose user I/O bank 6 |
| Pin produk G11 | GND — Ground reference |
| Pin produk H1 | I/O — General-purpose user I/O bank 4 |
| Pin produk H2 | GND — Ground reference |
| Pin produk H3 | I/O — General-purpose user I/O bank 4 |
| Pin produk H4 | VCCINT — Core supply 1.0 V nominal |
| Pin produk H5 | GND — Ground reference |
| Pin produk H6 | I/O — General-purpose user I/O bank 5 |
| Pin produk H7 | VCCPD5 — Pre-driver supply 2.5 V / 3.3 V bank 5 |
| Pin produk H8 | I/O — General-purpose user I/O bank 6 |
| Pin produk H9 | GND — Ground reference |
| Pin produk H10 | I/O — General-purpose user I/O bank 6 |
| Pin produk H11 | I/O — General-purpose user I/O bank 6 |
| Pin produk J1 | I/O — General-purpose user I/O bank 7 |
| Pin produk J2 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Pin produk J3 | I/O — General-purpose user I/O bank 7 |
| Pin produk J4 | I/O — General-purpose user I/O bank 7 |
| Pin produk J5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Pin produk J6 | I/O — General-purpose user I/O bank 8 |
| Pin produk J7 | GND — Ground reference |
| Pin produk J8 | VCCINT — Core supply 1.0 V nominal |
| Pin produk J9 | I/O — General-purpose user I/O bank 8 |
| Pin produk J10 | VCCPD8 — Pre-driver supply 2.5 V / 3.3 V bank 8 |
| Pin produk J11 | I/O — General-purpose user I/O bank 8 |
| Pin produk K1 | I/O — General-purpose user I/O bank 7 |
| Pin produk K2 | GND — Ground reference |
| Pin produk K3 | I/O — General-purpose user I/O bank 7 |
| Pin produk K4 | VCCPD7 — Pre-driver supply 2.5 V / 3.3 V bank 7 |
| Pin produk K5 | I/O — General-purpose user I/O bank 8 |
| Pin produk K6 | GND — Ground reference |
| Pin produk K7 | I/O — General-purpose user I/O bank 8 |
| Pin produk K8 | VCCAUX — Auxiliary supply 2.5 V |
| Pin produk K9 | I/O — General-purpose user I/O bank 8 |
| Pin produk K10 | GND — Ground reference |
| Pin produk K11 | I/O — General-purpose user I/O bank 8 |
| Pin produk L1 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Pin produk L2 | I/O — General-purpose user I/O bank 7 |
| Pin produk L3 | GND — Ground reference |
| Pin produk L4 | I/O — General-purpose user I/O bank 7 |
| Pin produk L5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Pin produk L6 | I/O — General-purpose user I/O bank 8 |
| Pin produk L7 | GND — Ground reference |
| Pin produk L8 | I/O — General-purpose user I/O bank 8 |
| Pin produk L9 | VCCINT — Core supply 1.0 V nominal |
| Pin produk L10 | I/O — General-purpose user I/O bank 8 |
| Pin produk L11 | GND — Ground reference |
| Pin produk M1 | I/O — General-purpose user I/O bank 7 |
| Pin produk M2 | GND — Ground reference |
| Pin produk M3 | I/O — General-purpose user I/O bank 7 |
| Pin produk M4 | VCCINT — Core supply 1.0 V nominal |
| Pin produk M5 | GND — Ground reference |
| Pin produk M6 | I/O — General-purpose user I/O bank 8 |
| Pin produk M7 | VCCAUX — Auxiliary supply 2.5 V |
| Pin produk M8 | I/O — General-purpose user I/O bank 8 |
| Pin produk M9 | GND — Ground reference |
| Pin produk M10 | I/O — General-purpose user I/O bank 8 |
| Pin produk M11 | I/O — General-purpose user I/O bank 8 |
Aplikasi Umum
10CL010YM164C8G cocok untuk 6 aplikasis: Industrial I/O Expansion Module, Video Format Bridge / Image Sensor Pre-Processing, Motor Drive and Robotics Glue Logic, Telecom Line-Card Glue and Protocol Conversion, Low-Cost PCIe-Over-Cable Bridge, Battery-Powered Test & Measurement Instrumentation.
Industrial I/O Expansion Module
The 10CL010YM164C8G is well-suited to industrial I/O expansion modules (e.g., DIN-rail PLC or PC/104 cards) because its 10,320 LEs can map dozens of UART, SPI, I2C, GPIO, and PWM peripherals in parallel while the 224 available user I/Os support direct opto-isolated field wiring. The 1.0 V low-power core and 60 nm process keep typical power budgets under 1.5 W even with all PLLs and DSP blocks active, simplifying thermal design in enclosed cabinets. Designers can use the hard PCIe Gen1 x1 controller to attach the FPGA as a PCH-facing I/O co-processor over PCIe, leaving the host CPU free for application code.
Direkomendasikan
Video Format Bridge / Image Sensor Pre-Processing
In machine-vision and image-sensor front ends, the 10CL010YM164C8G can ingest parallel CMOS sensor data (e.g., MIPI CSI-2 over LVDS or sub-LVDS) and reformat it to HDMI, BT.656, USB3 Vision, or Ethernet AVB streams. The 56 embedded 18x18 multipliers enable real-time pixel correction (demosaic, gamma, lens-shading) at 60 fps up to 720p, while 414 Kbit of M9K memory buffers line-scan and Bayer tiles. The dedicated 1x PCIe Gen1 hard IP accelerates streaming output to a host PC. Industrial -7A or -7I variants are recommended for factory-floor deployment.
Direkomendasikan
Motor Drive and Robotics Glue Logic
The 10CL010YM164C8G is a strong fit as glue logic between a microcontroller/DSP and a 3-phase motor inverter: it implements field-oriented control (FOC) commutation tables, encoder quadrature decoding, hall-sensor debouncing, and safety interlocks with deterministic sub-microsecond latency. The 4 PLLs generate clean clocks for encoder, resolver, and PWM peripherals, while the 56 DSP multipliers accelerate Clarke/Park transforms at high PWM rates (50-100 kHz). Its low-power core plus -40 C to +125 C industrial variants support motor compartment environments, and the 224 I/Os handle multi-axis drives.
Direkomendasikan
Telecom Line-Card Glue and Protocol Conversion
In telecom line cards, the 10CL010YM164C8G bridges legacy TDM (E1/T1/J1) framers to modern packet backplanes, offloading the host CPU. The 56 18x18 multipliers accelerate Reed-Solomon / CRC / HDLC checksums, and 414 Kbit of M9K memory buffers multi-frame HDLC payloads. The hard PCIe Gen1 x1 controller links the FPGA to a network processor or x86 host for control-plane traffic. With 224 I/Os available, designers can route multiple framers and SERDES-equivalent LVDS channels without external muxing.
Direkomendasikan
Low-Cost PCIe-Over-Cable Bridge
The 10CL010YM164C8G integrates a hard PCIe Gen1 (x1/x2) controller, making it ideal for cost-sensitive PCIe-over-cable adapters that extend PCIe across Ethernet or coax backplanes. Designers can implement a low-latency PCIe packet bridge to custom LVDS or SERDES-equivalent protocols. Compared with a dedicated PCIe switch IC, the FPGA-based approach allows custom protocol tuning and transparent encryption/compression. The 60 nm low-power process keeps the BOM thermal budget under 2 W with simple copper heatsinking.
Direkomendasikan
Battery-Powered Test & Measurement Instrumentation
Battery-powered oscilloscope probes, logic analyzers, and field-portable data loggers benefit from the 10CL010YM164C8G's low static and dynamic power at 1.0 V core - typically <0.5 W in mid-utilization scenarios. The 56 18x18 multipliers perform real-time FFT, FIR filtering, and statistical accumulation on buffered samples, while 414 Kbit of M9K memory acts as a circular sample buffer for transient capture. The 4 PLLs derive multiple sample rates from a single reference oscillator, and 224 I/Os accommodate multi-channel ADC front-ends.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk 10CL010YM164C8G — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | 10CL010YM164C6G | 10CL010YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G | 10CL016YM164C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 164-ball MBGA (8x8 mm) | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+50%) |
| Embedded Memory | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 504 Kbit |
| Speed Grade | -8C (commercial) | -6C (commercial, lower Fmax) | -7A (automotive grade) | -7I (industrial grade) | -8C (commercial) | -8C (commercial) |
| Operating Junction Temperature | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 |
| Hard PCIe Controller | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) |
Diferensiator Kunci
- Highest speed grade in the 10K-LE 164-MBGA variant (vs10CL010YM164C6G)
- In-family logic capacity upgrade path on identical footprint (vs10CL016YM164C8G)
- Hard PCIe Gen1 controller eliminates soft IP overhead (vsLattice ECP5 (LFE5U-12F-8BG256C) in similar footprint)
Catatan Desain
Estimated: at typical 60% LE utilization, 50% toggle rate, and 25 C ambient, the 10CL010YM164C8G core draws approximately 0.6-0.9 W from the 1.0 V VCCINT rail. Provide at least 1.5 A VCCINT headroom and use a low-noise LDO (e.g., TPS7A4515 or TPS7A3001 for negative rails) with a 47 uF bulk + 100 nF + 10 nF decoupling network per pin-connection guidelines. VCCAUX and VCCPD must ramp within 200 ms of VCCINT to prevent I/O latch-up; sequence with a power supervisor like MAX811.
Estimated: the 164-ball MBGA uses a 0.5 mm ball pitch with 8x8 mm body. Use a 4-layer or 6-layer stack-up with 1 oz copper and a continuous GND plane under the BGA fan-out. Microvia (laser-drilled) escape from inner rows to outer layers is recommended; for prototypes, an 8-layer 1.0 oz stack with 0.8 mm core and 0.1 mm prepreg works well. Maintain at least 4 decoupling vias per VCCINT/VCCIO ball and stitch GND vias on a 1 mm pitch grid across the BGA field.
Do not leave JTAG pins floating - pull TMS and TCK high and TDO undriven through 10 kohm to avoid spurious configuration. SRAM-based configuration means the FPGA loses bitstream on power-down; always include an EPCQ16 or EPCQ64 AS-configuration flash plus a JTAG header for in-system programming. Avoid sharing VCCIO bank voltages across incompatible I/O standards (e.g., do not mix 2.5 V LVCMOS and 1.8 V SSTL on the same bank without bank-level isolation).
Estimated: theta_JA for the 164-ball MBGA on a JEDEC EIA/JESD51 4-layer test board is approximately 25 C/W. With 0.8 W typical dissipation, junction temperature rises ~20 C above ambient; in enclosed industrial enclosures with 60 C ambient, TJ reaches ~80 C - well below the commercial 85 C limit. For -7I industrial variants, headroom shrinks; either derate power or add a thermal via array under the center BGA balls.
Informasi Konformitas
RoHS-compliant per Altera/Intel product page. MSL 3 per JEDEC J-STD-020. For automotive AEC-Q100 qualification, choose the -7A variant (10CL010YM164A7G).
