10CL010YM164C8G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
MPN: 10CL010YM164C8G ✓ Hoạt động10CL010YM164C8G Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory blocks whose function is defined after manufacture through a hardware description language (HDL) bitstream. Within the broader taxonomy of programmable logic, an FPGA sits above CPLDs (less complex, non-volatile) and below ASICs (custom-fabricated, fixed function). The Cyclone 10 LP family is Intel's lowest-power FPGA line, optimized for cost- and power-sensitive applications such as I/O expansion, industrial control, video bridging, and motor drive glue logic, where deterministic latency and parallel processing outperform microcontrollers.
Key features include 10,320 logic elements (LEs), 414 Kbit embedded RAM (M9K blocks), 56 embedded 18x18 multipliers, 4 PLLs, and a maximum of 224 user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and integrates a hard PCIe Gen1 controller (x1/x2) for protocol bridging. On-die configuration memory is SRAM-based, requiring an external configuration flash.
Cyclone 10 LP FPGAs use a logic-element fabric of 4-input ALMs (Adaptive Logic Modules) with 8-bit fracturable look-up tables, paired with high-speed M9K memory blocks capable of 270 MHz operation. Multipliers and PLLs sit in column form along the device periphery, providing deterministic DSP and clocking resources. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash.
Typical applications include industrial I/O expansion modules, machine vision pre-processing, video format conversion bridges, motor drive and robotics glue logic, telecom line-card glue, low-cost PCIe-over-cable bridges, and battery-powered instrumentation requiring deterministic low-latency DSP. Design with the Quartus Prime Lite toolchain; board bring-up needs a 1.0 V core rail with +/-5% tolerance and a configuration flash circuit.
Bộ thay thế dễ dàng lắp đặt cho 10CL010YM164C8G — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10CL010YM164C8G (cùng hình factor và footprint) — khác nhau ở Package, Core Voltage, Embedded Memory, PLLs, MSL Level.
10CL010YM164C6G
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Xem tài liệu →10CL010YM164A7G
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Xem tài liệu →10CL010YM164I7G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CL010YM164C8G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10CL016YM164C8G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10CL010YM164C8G Tỷ lệ tối đa & tính chất điện
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/Os | 224 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Speed Grade | -8C (commercial, 8 speed grade) |
| Hộp | 164-ball MBGA (Micro BGA, 8x8 mm) |
| Nhiệt độ mối nối hoạt động | 0 C to +85 C (commercial) |
| Configuration Method | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
Cấu hình chân 10CL010YM164C8G
| Chân A1 | I/O — General-purpose user I/O bank 1 |
| Chân A2 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Chân A3 | I/O — General-purpose user I/O bank 1 |
| Chân A4 | I/O — General-purpose user I/O bank 2 |
| Chân A5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Chân A6 | I/O — General-purpose user I/O bank 2 |
| Chân A7 | GND — Ground reference |
| Chân A8 | VCCINT — Core supply 1.0 V nominal |
| Chân A9 | I/O — General-purpose user I/O bank 3 |
| Chân A10 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Chân A11 | I/O — General-purpose user I/O bank 3 |
| Chân B1 | I/O — General-purpose user I/O bank 1 |
| Chân B2 | GND — Ground reference |
| Chân B3 | I/O — General-purpose user I/O bank 1 |
| Chân B4 | VCCPD1 — Pre-driver supply 2.5 V / 3.3 V bank 1 |
| Chân B5 | I/O — General-purpose user I/O bank 2 |
| Chân B6 | GND — Ground reference |
| Chân B7 | I/O — General-purpose user I/O bank 2 |
| Chân B8 | VCCAUX — Auxiliary supply 2.5 V |
| Chân B9 | I/O — General-purpose user I/O bank 3 |
| Chân B10 | GND — Ground reference |
| Chân B11 | I/O — General-purpose user I/O bank 3 |
| Chân C1 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| Chân C2 | I/O — General-purpose user I/O bank 1 |
| Chân C3 | GND — Ground reference |
| Chân C4 | I/O — General-purpose user I/O bank 1 |
| Chân C5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| Chân C6 | I/O — General-purpose user I/O bank 2 |
| Chân C7 | GND — Ground reference |
| Chân C8 | I/O — General-purpose user I/O bank 3 |
| Chân C9 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| Chân C10 | I/O — General-purpose user I/O bank 3 |
| Chân C11 | GND — Ground reference |
| Chân D1 | I/O — General-purpose user I/O bank 1 |
| Chân D2 | GND — Ground reference |
| Chân D3 | I/O — General-purpose user I/O bank 1 |
| Chân D4 | VCCINT — Core supply 1.0 V nominal |
| Chân D5 | GND — Ground reference |
| Chân D6 | I/O — General-purpose user I/O bank 2 |
| Chân D7 | VCCPD2 — Pre-driver supply 2.5 V / 3.3 V bank 2 |
| Chân D8 | I/O — General-purpose user I/O bank 3 |
| Chân D9 | GND — Ground reference |
| Chân D10 | I/O — General-purpose user I/O bank 3 |
| Chân D11 | I/O — General-purpose user I/O bank 3 |
| Chân E1 | I/O — General-purpose user I/O bank 4 |
| Chân E2 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Chân E3 | I/O — General-purpose user I/O bank 4 |
| Chân E4 | I/O — General-purpose user I/O bank 4 |
| Chân E5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Chân E6 | I/O — General-purpose user I/O bank 5 |
| Chân E7 | GND — Ground reference |
| Chân E8 | VCCINT — Core supply 1.0 V nominal |
| Chân E9 | I/O — General-purpose user I/O bank 6 |
| Chân E10 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Chân E11 | I/O — General-purpose user I/O bank 6 |
| Chân F1 | I/O — General-purpose user I/O bank 4 |
| Chân F2 | GND — Ground reference |
| Chân F3 | I/O — General-purpose user I/O bank 4 |
| Chân F4 | VCCPD4 — Pre-driver supply 2.5 V / 3.3 V bank 4 |
| Chân F5 | I/O — General-purpose user I/O bank 5 |
| Chân F6 | GND — Ground reference |
| Chân F7 | I/O — General-purpose user I/O bank 5 |
| Chân F8 | VCCAUX — Auxiliary supply 2.5 V |
| Chân F9 | I/O — General-purpose user I/O bank 6 |
| Chân F10 | GND — Ground reference |
| Chân F11 | I/O — General-purpose user I/O bank 6 |
| Chân G1 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| Chân G2 | I/O — General-purpose user I/O bank 4 |
| Chân G3 | GND — Ground reference |
| Chân G4 | I/O — General-purpose user I/O bank 4 |
| Chân G5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| Chân G6 | I/O — General-purpose user I/O bank 5 |
| Chân G7 | GND — Ground reference |
| Chân G8 | I/O — General-purpose user I/O bank 6 |
| Chân G9 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| Chân G10 | I/O — General-purpose user I/O bank 6 |
| Chân G11 | GND — Ground reference |
| Chân H1 | I/O — General-purpose user I/O bank 4 |
| Chân H2 | GND — Ground reference |
| Chân H3 | I/O — General-purpose user I/O bank 4 |
| Chân H4 | VCCINT — Core supply 1.0 V nominal |
| Chân H5 | GND — Ground reference |
| Chân H6 | I/O — General-purpose user I/O bank 5 |
| Chân H7 | VCCPD5 — Pre-driver supply 2.5 V / 3.3 V bank 5 |
| Chân H8 | I/O — General-purpose user I/O bank 6 |
| Chân H9 | GND — Ground reference |
| Chân H10 | I/O — General-purpose user I/O bank 6 |
| Chân H11 | I/O — General-purpose user I/O bank 6 |
| Chân J1 | I/O — General-purpose user I/O bank 7 |
| Chân J2 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Chân J3 | I/O — General-purpose user I/O bank 7 |
| Chân J4 | I/O — General-purpose user I/O bank 7 |
| Chân J5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Chân J6 | I/O — General-purpose user I/O bank 8 |
| Chân J7 | GND — Ground reference |
| Chân J8 | VCCINT — Core supply 1.0 V nominal |
| Chân J9 | I/O — General-purpose user I/O bank 8 |
| Chân J10 | VCCPD8 — Pre-driver supply 2.5 V / 3.3 V bank 8 |
| Chân J11 | I/O — General-purpose user I/O bank 8 |
| Chân K1 | I/O — General-purpose user I/O bank 7 |
| Chân K2 | GND — Ground reference |
| Chân K3 | I/O — General-purpose user I/O bank 7 |
| Chân K4 | VCCPD7 — Pre-driver supply 2.5 V / 3.3 V bank 7 |
| Chân K5 | I/O — General-purpose user I/O bank 8 |
| Chân K6 | GND — Ground reference |
| Chân K7 | I/O — General-purpose user I/O bank 8 |
| Chân K8 | VCCAUX — Auxiliary supply 2.5 V |
| Chân K9 | I/O — General-purpose user I/O bank 8 |
| Chân K10 | GND — Ground reference |
| Chân K11 | I/O — General-purpose user I/O bank 8 |
| Chân L1 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| Chân L2 | I/O — General-purpose user I/O bank 7 |
| Chân L3 | GND — Ground reference |
| Chân L4 | I/O — General-purpose user I/O bank 7 |
| Chân L5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| Chân L6 | I/O — General-purpose user I/O bank 8 |
| Chân L7 | GND — Ground reference |
| Chân L8 | I/O — General-purpose user I/O bank 8 |
| Chân L9 | VCCINT — Core supply 1.0 V nominal |
| Chân L10 | I/O — General-purpose user I/O bank 8 |
| Chân L11 | GND — Ground reference |
| Chân M1 | I/O — General-purpose user I/O bank 7 |
| Chân M2 | GND — Ground reference |
| Chân M3 | I/O — General-purpose user I/O bank 7 |
| Chân M4 | VCCINT — Core supply 1.0 V nominal |
| Chân M5 | GND — Ground reference |
| Chân M6 | I/O — General-purpose user I/O bank 8 |
| Chân M7 | VCCAUX — Auxiliary supply 2.5 V |
| Chân M8 | I/O — General-purpose user I/O bank 8 |
| Chân M9 | GND — Ground reference |
| Chân M10 | I/O — General-purpose user I/O bank 8 |
| Chân M11 | I/O — General-purpose user I/O bank 8 |
Ứng dụng tiêu biểu
10CL010YM164C8G phù hợp cho 6 Áp dụngs: Industrial I/O Expansion Module, Video Format Bridge / Image Sensor Pre-Processing, Motor Drive and Robotics Glue Logic, Telecom Line-Card Glue and Protocol Conversion, Low-Cost PCIe-Over-Cable Bridge, Battery-Powered Test & Measurement Instrumentation.
Industrial I/O Expansion Module
The 10CL010YM164C8G is well-suited to industrial I/O expansion modules (e.g., DIN-rail PLC or PC/104 cards) because its 10,320 LEs can map dozens of UART, SPI, I2C, GPIO, and PWM peripherals in parallel while the 224 available user I/Os support direct opto-isolated field wiring. The 1.0 V low-power core and 60 nm process keep typical power budgets under 1.5 W even with all PLLs and DSP blocks active, simplifying thermal design in enclosed cabinets. Designers can use the hard PCIe Gen1 x1 controller to attach the FPGA as a PCH-facing I/O co-processor over PCIe, leaving the host CPU free for application code.
Được đề xuất
Video Format Bridge / Image Sensor Pre-Processing
In machine-vision and image-sensor front ends, the 10CL010YM164C8G can ingest parallel CMOS sensor data (e.g., MIPI CSI-2 over LVDS or sub-LVDS) and reformat it to HDMI, BT.656, USB3 Vision, or Ethernet AVB streams. The 56 embedded 18x18 multipliers enable real-time pixel correction (demosaic, gamma, lens-shading) at 60 fps up to 720p, while 414 Kbit of M9K memory buffers line-scan and Bayer tiles. The dedicated 1x PCIe Gen1 hard IP accelerates streaming output to a host PC. Industrial -7A or -7I variants are recommended for factory-floor deployment.
Được đề xuất
Motor Drive and Robotics Glue Logic
The 10CL010YM164C8G is a strong fit as glue logic between a microcontroller/DSP and a 3-phase motor inverter: it implements field-oriented control (FOC) commutation tables, encoder quadrature decoding, hall-sensor debouncing, and safety interlocks with deterministic sub-microsecond latency. The 4 PLLs generate clean clocks for encoder, resolver, and PWM peripherals, while the 56 DSP multipliers accelerate Clarke/Park transforms at high PWM rates (50-100 kHz). Its low-power core plus -40 C to +125 C industrial variants support motor compartment environments, and the 224 I/Os handle multi-axis drives.
Được đề xuất
Telecom Line-Card Glue and Protocol Conversion
In telecom line cards, the 10CL010YM164C8G bridges legacy TDM (E1/T1/J1) framers to modern packet backplanes, offloading the host CPU. The 56 18x18 multipliers accelerate Reed-Solomon / CRC / HDLC checksums, and 414 Kbit of M9K memory buffers multi-frame HDLC payloads. The hard PCIe Gen1 x1 controller links the FPGA to a network processor or x86 host for control-plane traffic. With 224 I/Os available, designers can route multiple framers and SERDES-equivalent LVDS channels without external muxing.
Được đề xuất
Low-Cost PCIe-Over-Cable Bridge
The 10CL010YM164C8G integrates a hard PCIe Gen1 (x1/x2) controller, making it ideal for cost-sensitive PCIe-over-cable adapters that extend PCIe across Ethernet or coax backplanes. Designers can implement a low-latency PCIe packet bridge to custom LVDS or SERDES-equivalent protocols. Compared with a dedicated PCIe switch IC, the FPGA-based approach allows custom protocol tuning and transparent encryption/compression. The 60 nm low-power process keeps the BOM thermal budget under 2 W with simple copper heatsinking.
Được đề xuất
Battery-Powered Test & Measurement Instrumentation
Battery-powered oscilloscope probes, logic analyzers, and field-portable data loggers benefit from the 10CL010YM164C8G's low static and dynamic power at 1.0 V core - typically <0.5 W in mid-utilization scenarios. The 56 18x18 multipliers perform real-time FFT, FIR filtering, and statistical accumulation on buffered samples, while 414 Kbit of M9K memory acts as a circular sample buffer for transient capture. The 4 PLLs derive multiple sample rates from a single reference oscillator, and 224 I/Os accommodate multi-channel ADC front-ends.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10CL010YM164C8G — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10CL010YM164C6G | 10CL010YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G | 10CL016YM164C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 164-ball MBGA (8x8 mm) | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+50%) |
| Embedded Memory | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 504 Kbit |
| Speed Grade | -8C (commercial) | -6C (commercial, lower Fmax) | -7A (automotive grade) | -7I (industrial grade) | -8C (commercial) | -8C (commercial) |
| Operating Junction Temperature | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 |
| Hard PCIe Controller | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) |
Bảo phân biệt quan trọng
- Highest speed grade in the 10K-LE 164-MBGA variant (vs10CL010YM164C6G)
- In-family logic capacity upgrade path on identical footprint (vs10CL016YM164C8G)
- Hard PCIe Gen1 controller eliminates soft IP overhead (vsLattice ECP5 (LFE5U-12F-8BG256C) in similar footprint)
Ghi chú thiết kế
Estimated: at typical 60% LE utilization, 50% toggle rate, and 25 C ambient, the 10CL010YM164C8G core draws approximately 0.6-0.9 W from the 1.0 V VCCINT rail. Provide at least 1.5 A VCCINT headroom and use a low-noise LDO (e.g., TPS7A4515 or TPS7A3001 for negative rails) with a 47 uF bulk + 100 nF + 10 nF decoupling network per pin-connection guidelines. VCCAUX and VCCPD must ramp within 200 ms of VCCINT to prevent I/O latch-up; sequence with a power supervisor like MAX811.
Estimated: the 164-ball MBGA uses a 0.5 mm ball pitch with 8x8 mm body. Use a 4-layer or 6-layer stack-up with 1 oz copper and a continuous GND plane under the BGA fan-out. Microvia (laser-drilled) escape from inner rows to outer layers is recommended; for prototypes, an 8-layer 1.0 oz stack with 0.8 mm core and 0.1 mm prepreg works well. Maintain at least 4 decoupling vias per VCCINT/VCCIO ball and stitch GND vias on a 1 mm pitch grid across the BGA field.
Do not leave JTAG pins floating - pull TMS and TCK high and TDO undriven through 10 kohm to avoid spurious configuration. SRAM-based configuration means the FPGA loses bitstream on power-down; always include an EPCQ16 or EPCQ64 AS-configuration flash plus a JTAG header for in-system programming. Avoid sharing VCCIO bank voltages across incompatible I/O standards (e.g., do not mix 2.5 V LVCMOS and 1.8 V SSTL on the same bank without bank-level isolation).
Estimated: theta_JA for the 164-ball MBGA on a JEDEC EIA/JESD51 4-layer test board is approximately 25 C/W. With 0.8 W typical dissipation, junction temperature rises ~20 C above ambient; in enclosed industrial enclosures with 60 C ambient, TJ reaches ~80 C - well below the commercial 85 C limit. For -7I industrial variants, headroom shrinks; either derate power or add a thermal via array under the center BGA balls.
Thông tin tuân thủ
RoHS-compliant per Altera/Intel product page. MSL 3 per JEDEC J-STD-020. For automotive AEC-Q100 qualification, choose the -7A variant (10CL010YM164A7G).
