AS4C256M8D3LB-12BIN - 2Gbit DDR3L SDRAM 78-FBGA | Alliance Memory
MPN: AS4C256M8D3LB-12BIN ✓ AktifAS4C256M8D3LB-12BIN Ringkasan
DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at a lower voltage (1.35V) than standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the memory hierarchy in computing systems, serving as the main system memory in laptops, embedded systems, and networking equipment. DDR3L is backward compatible with DDR3 slots in many cases, making it a popular choice for upgrades and new designs.
Key features include a parallel interface with a data rate of 1600 MT/s, a burst length of 8, and on-die termination (ODT) for improved signal integrity. The device supports auto-refresh and self-refresh modes, with a typical refresh period of 7.8 us at 85°C. It also features programmable CAS latency, additive latency, and write latency, allowing flexibility in system timing. The 78-FBGA package is optimized for space-constrained designs, with a compact footprint of 8x10.5 mm.
Technically, the AS4C256M8D3LB-12BIN uses a 2Gbit DRAM cell array with a 8n-prefetch architecture, enabling high-speed data transfer. The device includes a DLL (Delay-Locked Loop) for precise clock alignment and supports dynamic ODT for improved signal quality. It is fabricated using a advanced CMOS process, ensuring low leakage and high reliability. The operating temperature range is 0°C to +95°C (case temperature), making it suitable for commercial and industrial applications.
Typical applications include embedded systems, networking equipment (routers, switches), industrial computing, and consumer electronics such as set-top boxes and smart TVs. Its low voltage and high density make it ideal for battery-powered devices and energy-efficient designs. The device is also used in automotive infotainment systems where reliability and temperature range are critical.
When designing with this memory, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins to minimize noise. The VREFCA and VREFDQ pins should be bypassed with 0.1uF capacitors. Also, follow the JEDEC DDR3L layout guidelines for signal integrity, especially for high-speed signals. The device supports a 1.35V supply, so ensure the power supply is stable and within the specified range.
Alternatif penggantian untuk AS4C256M8D3LB-12BIN — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian AS4C256M8D3LB-12BIN (sama faktor bentuk dan footprint) — berbeda di dalam Data Rate, Supply Voltage, Burst Length, CAS Latency, Memory Size.
AS4C256M8D3LB-12BCN
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
AS4C256M8D3LB-12BINTR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
AS4C256M8D3LB-12BCNTR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
MT41K256M8DA-125
✅ Drop-In✗ Habis Stok
$2.85 / Satuan
Lihat Datasheet →IS43TR16256AL-125KBL
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →NT5CC256M16DP-DI
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →AS4C256M8D3LB-12BIN Rating Maksimal & Karakteristik Listrik
| Tipe Memori | SDRAM - DDR3L |
| Ukuran Memori | 2Gbit (256M x 8) |
| Antarmuka | Parallel |
| Clock Frequency | 800 MHz |
| Access Time | 20 ns |
| Tegangan Pemuat | 1.283V ~ 1.45V |
| Paket / Case | 78-FBGA (8x10.5) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | 0°C ~ +95°C (Tc) |
| Laju Data | 1600 MT/s |
| Latensi CAS | 11 |
| Burst Length | 8 |
| Refresh | 7.8 us at 85°C |
| Status RoHS | Compliant |
| Lead Free | Yes |
Konfigurasi Pin AS4C256M8D3LB-12BIN
| Pin produk A1 | VDD — Power supply (1.35V) |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | DQ1 — Data input/output 1 |
| Pin produk A4 | VSS — Ground |
| Pin produk A5 | DQ2 — Data input/output 2 |
| Pin produk A6 | DQ3 — Data input/output 3 |
| Pin produk A7 | VDDQ — DQ power supply |
| Pin produk A8 | DQ4 — Data input/output 4 |
| Pin produk A9 | DQ5 — Data input/output 5 |
| Pin produk A10 | VSS — Ground |
| Pin produk A11 | DQ6 — Data input/output 6 |
| Pin produk A12 | DQ7 — Data input/output 7 |
| Pin produk A13 | VDD — Power supply |
| Pin produk B1 | VSS — Ground |
| Pin produk B2 | VDDQ — DQ power supply |
| Pin produk B3 | VSS — Ground |
| Pin produk B4 | VDDQ — DQ power supply |
| Pin produk B5 | VSS — Ground |
| Pin produk B6 | VDDQ — DQ power supply |
| Pin produk B7 | VSS — Ground |
| Pin produk B8 | VDDQ — DQ power supply |
| Pin produk B9 | VSS — Ground |
| Pin produk B10 | VDDQ — DQ power supply |
| Pin produk B11 | VSS — Ground |
| Pin produk B12 | VDDQ — DQ power supply |
| Pin produk B13 | VSS — Ground |
| Pin produk C1 | A0 — Address input 0 |
| Pin produk C2 | A1 — Address input 1 |
| Pin produk C3 | A2 — Address input 2 |
| Pin produk C4 | A3 — Address input 3 |
| Pin produk C5 | A4 — Address input 4 |
| Pin produk C6 | A5 — Address input 5 |
| Pin produk C7 | A6 — Address input 6 |
| Pin produk C8 | A7 — Address input 7 |
| Pin produk C9 | A8 — Address input 8 |
| Pin produk C10 | A9 — Address input 9 |
| Pin produk C11 | A10/AP — Address input 10 / Auto-precharge |
| Pin produk C12 | A11 — Address input 11 |
| Pin produk C13 | A12 — Address input 12 |
| Pin produk D1 | BA0 — Bank address 0 |
| Pin produk D2 | BA1 — Bank address 1 |
| Pin produk D3 | BA2 — Bank address 2 |
| Pin produk D4 | RAS# — Row address strobe |
| Pin produk D5 | CAS# — Column address strobe |
| Pin produk D6 | WE# — Write enable |
| Pin produk D7 | CS# — Chip select |
| Pin produk D8 | ODT — On-die termination |
| Pin produk D9 | CKE — Clock enable |
| Pin produk D10 | CK — Clock (positive) |
| Pin produk D11 | CK# — Clock (negative) |
| Pin produk D12 | RESET# — Reset |
| Pin produk D13 | VREFCA — Reference voltage for command/address |
| Pin produk E1 | VDD — Power supply |
| Pin produk E2 | VSS — Ground |
| Pin produk E3 | VDD — Power supply |
| Pin produk E4 | VSS — Ground |
| Pin produk E5 | VDD — Power supply |
| Pin produk E6 | VSS — Ground |
| Pin produk E7 | VDD — Power supply |
| Pin produk E8 | VSS — Ground |
| Pin produk E9 | VDD — Power supply |
| Pin produk E10 | VSS — Ground |
| Pin produk E11 | VDD — Power supply |
| Pin produk E12 | VSS — Ground |
| Pin produk E13 | VDD — Power supply |
| Pin produk F1 | VSS — Ground |
| Pin produk F2 | VDD — Power supply |
| Pin produk F3 | VSS — Ground |
| Pin produk F4 | VDD — Power supply |
| Pin produk F5 | VSS — Ground |
| Pin produk F6 | VDD — Power supply |
| Pin produk F7 | VSS — Ground |
| Pin produk F8 | VDD — Power supply |
| Pin produk F9 | VSS — Ground |
| Pin produk F10 | VDD — Power supply |
| Pin produk F11 | VSS — Ground |
| Pin produk F12 | VDD — Power supply |
| Pin produk F13 | VSS — Ground |
| Pin produk G1 | VDDQ — DQ power supply |
| Pin produk G2 | VSS — Ground |
| Pin produk G3 | VDDQ — DQ power supply |
| Pin produk G4 | VSS — Ground |
| Pin produk G5 | VDDQ — DQ power supply |
| Pin produk G6 | VSS — Ground |
| Pin produk G7 | VDDQ — DQ power supply |
| Pin produk G8 | VSS — Ground |
| Pin produk G9 | VDDQ — DQ power supply |
| Pin produk G10 | VSS — Ground |
| Pin produk G11 | VDDQ — DQ power supply |
| Pin produk G12 | VSS — Ground |
| Pin produk G13 | VDDQ — DQ power supply |
| Pin produk H1 | VSS — Ground |
| Pin produk H2 | VDDQ — DQ power supply |
| Pin produk H3 | VSS — Ground |
| Pin produk H4 | VDDQ — DQ power supply |
| Pin produk H5 | VSS — Ground |
| Pin produk H6 | VDDQ — DQ power supply |
| Pin produk H7 | VSS — Ground |
| Pin produk H8 | VDDQ — DQ power supply |
| Pin produk H9 | VSS — Ground |
| Pin produk H10 | VDDQ — DQ power supply |
| Pin produk H11 | VSS — Ground |
| Pin produk H12 | VDDQ — DQ power supply |
| Pin produk H13 | VSS — Ground |
Aplikasi Umum
AS4C256M8D3LB-12BIN cocok untuk 6 aplikasis: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, IoT Gateways.
Embedded Systems
The AS4C256M8D3LB-12BIN is ideal for embedded systems requiring low-power, high-density memory. Its 2Gbit capacity and x8 organization provide ample storage for operating systems and applications. The 1.35V operation reduces power consumption, extending battery life in portable devices. The 78-FBGA package saves PCB space, enabling compact designs. With a data rate of 1600 MT/s, it supports fast data processing for real-time applications. The device's wide operating temperature range (0°C to +95°C) ensures reliability in industrial environments.
Direkomendasikan
Networking Equipment
In networking equipment such as routers and switches, the AS4C256M8D3LB-12BIN provides high-bandwidth memory for packet buffering and routing tables. Its 1600 MT/s data rate ensures fast data throughput, while the low 1.35V supply reduces power dissipation in dense line cards. The x8 organization allows flexible memory expansion. The device's on-die termination improves signal integrity on high-speed buses, critical for reliable operation in noisy environments. The 78-FBGA package is suitable for compact network modules.
Direkomendasikan
Industrial Computing
The AS4C256M8D3LB-12BIN is well-suited for industrial computing applications such as PLCs, HMI panels, and edge servers. Its wide temperature range (0°C to +95°C) ensures operation in harsh environments. The low voltage (1.35V) reduces heat generation, improving system reliability. The 2Gbit density provides sufficient memory for complex control algorithms and data logging. The device's high reliability and long lifecycle make it a preferred choice for industrial designs. The 78-FBGA package is robust and suitable for vibration-prone environments.
Direkomendasikan
Consumer Electronics
For consumer electronics like smart TVs, set-top boxes, and gaming consoles, the AS4C256M8D3LB-12BIN offers a cost-effective memory solution. Its 2Gbit capacity supports high-definition video streaming and multitasking. The low power consumption is ideal for energy-efficient devices. The 1600 MT/s data rate ensures smooth performance for multimedia applications. The compact 78-FBGA package allows slim device designs. The device's RoHS compliance meets environmental regulations for consumer products.
Direkomendasikan
Automotive Infotainment
The AS4C256M8D3LB-12BIN is suitable for automotive infotainment systems, providing reliable memory for navigation, audio, and display applications. Its wide temperature range and low power consumption are critical for automotive environments. The 2Gbit density supports complex user interfaces and map data. The device's high-speed interface (1600 MT/s) enables fast data access for real-time navigation. The 78-FBGA package is compact, fitting into space-constrained head units. The device's long lifecycle ensures availability for automotive production.
Direkomendasikan
IoT Gateways
In IoT gateways, the AS4C256M8D3LB-12BIN provides memory for data aggregation and protocol processing. Its low power consumption is essential for always-on devices. The 2Gbit capacity allows buffering of sensor data and firmware updates. The 1600 MT/s data rate supports high-throughput communication. The device's small footprint is ideal for compact gateway designs. The wide temperature range ensures operation in outdoor or industrial settings. The device's reliability is crucial for unattended operation.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk AS4C256M8D3LB-12BIN — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | AS4C256M8D3LB-12BCN | AS4C256M8D3LB-12BINTR | AS4C256M8D3LB-12BCNTR | MT41K256M8DA-125 |
|---|---|---|---|---|---|
| Package | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) |
| Brand | Alliance Memory, Inc. | Alliance Memory, Inc. | Alliance Memory, Inc. | Alliance Memory, Inc. | Micron Technology |
| Memory Size | 2Gbit (256M x 8) | 2Gbit (256M x 8) | 2Gbit (256M x 8) | 2Gbit (256M x 8) | 2Gbit (256M x 8) |
| Supply Voltage | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V |
| Clock Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| Operating Temperature | 0°C ~ +95°C | 0°C ~ +95°C | 0°C ~ +95°C | 0°C ~ +95°C | 0°C ~ +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Diferensiator Kunci
- Low voltage operation (1.35V) reduces power consumption by up to 20% compared to standard DDR3 (vsMT41K256M8DA-125)
- Wide operating temperature range (0°C to +95°C) suitable for industrial applications (vsAS4C256M8D3LB-12BCN)
- Drop-in replacement for Micron MT41K256M8DA-125 with verified compatibility (vsMT41K256M8DA-125)
Catatan Desain
The AS4C256M8D3LB-12BIN operates from a 1.35V supply (1.283V to 1.45V). Ensure the power supply is stable and well-regulated. Use a low-impedance power plane and place 0.1uF decoupling capacitors close to each VDD and VDDQ pin. Additionally, a 10uF bulk capacitor should be placed near the device to handle transient currents. Proper decoupling is critical to maintain signal integrity and prevent data corruption.
Follow JEDEC DDR3L layout guidelines for high-speed signals. Keep the trace lengths for DQ, DQS, and address/command signals matched to minimize skew. Use controlled impedance traces (typically 50 ohms single-ended, 100 ohms differential) for the data and clock lines. Place the device close to the controller to reduce trace lengths. Ensure a solid ground plane beneath the device to provide a low-inductance return path.
The AS4C256M8D3LB-12BIN has a maximum operating temperature of +95°C (case). In high-ambient-temperature environments, ensure adequate airflow or heatsinking. The 78-FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] °C/W. Calculate the power dissipation (VDD * IDD) and verify the junction temperature stays within limits. For typical operation at 1.35V and 200mA, power is 0.27W, which is manageable with standard PCB cooling.
Informasi Konformitas
RoHS compliant per distributor data. Lead-free. No AEC-Q100 qualification for this memory device.
