Alliance Memory

AS4C256M8D3LB-12BIN - 2Gbit DDR3L SDRAM 78-FBGA | Alliance Memory

Name: AS4C256M8D3LB-12BIN
Brand: Alliance Memory, Inc.
Price: 8.50 USD
Availability: InStock

MPN: AS4C256M8D3LB-12BIN ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.283V ~ 1.45V Vdss 78-FBGA (8x10.5) Package 800 MHz Speed SDRAM - DDR3L Memory

$8.5 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$8.5	$8.50
10	$7.8	$78.00
100	$6.9	$690.00
500	$6.2	$3,100.00
1,000	$5.6	$5,600.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for AS4C256M8D3LB-12BIN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

AS4C256M8D3LB-12BCN

✅ Drop-In

📦 78-FBGA (8x10.5)

Same die and package, tray packaging instead of tape-and-reel

📋 Reference alternative (not in catalog)

AS4C256M8D3LB-12BINTR

✅ Drop-In

📦 78-FBGA (8x10.5)

Same die and package, tape-and-reel packaging variant

📋 Reference alternative (not in catalog)

AS4C256M8D3LB-12BCNTR

✅ Drop-In

📦 78-FBGA (8x10.5)

Same die and package, tape-and-reel packaging variant

📋 Reference alternative (not in catalog)

MT41K256M8DA-125

✅ Drop-In

📦 78-FBGA (8x10.5)

Cross-brand, same density and organization, pin-compatible per Alliance comparison

📋 Reference alternative (not in catalog)

IS43TR16256AL-125KBL

✅ Drop-In

ISSI, Integrated Silicon Solution Inc

📦 78-FBGA (8x10.5)

SDRAM - DDR3L · 4Gbit (256M x 16) · Parallel · 800 MHz · 20 ns · 1.35V (backward compatible to 1.5V) · 96-TWBGA (9x13mm) · Surface Mount

✓ 99,999 In Stock

$5.6 / Unit

View Datasheet →

NT5CC256M16DP-DI

✅ Drop-In

Nanya Technology

📦 78-FBGA (8x10.5)

DDR3L SDRAM · 4Gb · 256M x 16 · 1.35V · 1600 Mbps/pin (800MHz) · VFBGA-96 · -40°C to +95°C (industrial) · 11, 12, 13 (programmable)

✓ 99,999 In Stock

$6.5 / Unit

View Datasheet →

AS4C256M8D3LB-12BIN Maximum Ratings & Electrical Characteristics

Memory Type	SDRAM - DDR3L
Memory Size	2Gbit (256M x 8)
Interface	Parallel
Clock Frequency	800 MHz
Access Time	20 ns
Supply Voltage	1.283V ~ 1.45V
Package / Case	78-FBGA (8x10.5)
Mounting Type	Surface Mount
Operating Temperature	0°C ~ +95°C (Tc)
Data Rate	1600 MT/s
CAS Latency	11
Burst Length	8
Refresh	7.8 us at 85°C
RoHS Status	Compliant
Lead Free	Yes

AS4C256M8D3LB-12BIN Pin Configuration

Pin A1	VDD — Power supply (1.35V)
Pin A2	DQ0 — Data input/output 0
Pin A3	DQ1 — Data input/output 1
Pin A4	VSS — Ground
Pin A5	DQ2 — Data input/output 2
Pin A6	DQ3 — Data input/output 3
Pin A7	VDDQ — DQ power supply
Pin A8	DQ4 — Data input/output 4
Pin A9	DQ5 — Data input/output 5
Pin A10	VSS — Ground
Pin A11	DQ6 — Data input/output 6
Pin A12	DQ7 — Data input/output 7
Pin A13	VDD — Power supply
Pin B1	VSS — Ground
Pin B2	VDDQ — DQ power supply
Pin B3	VSS — Ground
Pin B4	VDDQ — DQ power supply
Pin B5	VSS — Ground
Pin B6	VDDQ — DQ power supply
Pin B7	VSS — Ground
Pin B8	VDDQ — DQ power supply
Pin B9	VSS — Ground
Pin B10	VDDQ — DQ power supply
Pin B11	VSS — Ground
Pin B12	VDDQ — DQ power supply
Pin B13	VSS — Ground
Pin C1	A0 — Address input 0
Pin C2	A1 — Address input 1
Pin C3	A2 — Address input 2
Pin C4	A3 — Address input 3
Pin C5	A4 — Address input 4
Pin C6	A5 — Address input 5
Pin C7	A6 — Address input 6
Pin C8	A7 — Address input 7
Pin C9	A8 — Address input 8
Pin C10	A9 — Address input 9
Pin C11	A10/AP — Address input 10 / Auto-precharge
Pin C12	A11 — Address input 11
Pin C13	A12 — Address input 12
Pin D1	BA0 — Bank address 0
Pin D2	BA1 — Bank address 1
Pin D3	BA2 — Bank address 2
Pin D4	RAS# — Row address strobe
Pin D5	CAS# — Column address strobe
Pin D6	WE# — Write enable
Pin D7	CS# — Chip select
Pin D8	ODT — On-die termination
Pin D9	CKE — Clock enable
Pin D10	CK — Clock (positive)
Pin D11	CK# — Clock (negative)
Pin D12	RESET# — Reset
Pin D13	VREFCA — Reference voltage for command/address
Pin E1	VDD — Power supply
Pin E2	VSS — Ground
Pin E3	VDD — Power supply
Pin E4	VSS — Ground
Pin E5	VDD — Power supply
Pin E6	VSS — Ground
Pin E7	VDD — Power supply
Pin E8	VSS — Ground
Pin E9	VDD — Power supply
Pin E10	VSS — Ground
Pin E11	VDD — Power supply
Pin E12	VSS — Ground
Pin E13	VDD — Power supply
Pin F1	VSS — Ground
Pin F2	VDD — Power supply
Pin F3	VSS — Ground
Pin F4	VDD — Power supply
Pin F5	VSS — Ground
Pin F6	VDD — Power supply
Pin F7	VSS — Ground
Pin F8	VDD — Power supply
Pin F9	VSS — Ground
Pin F10	VDD — Power supply
Pin F11	VSS — Ground
Pin F12	VDD — Power supply
Pin F13	VSS — Ground
Pin G1	VDDQ — DQ power supply
Pin G2	VSS — Ground
Pin G3	VDDQ — DQ power supply
Pin G4	VSS — Ground
Pin G5	VDDQ — DQ power supply
Pin G6	VSS — Ground
Pin G7	VDDQ — DQ power supply
Pin G8	VSS — Ground
Pin G9	VDDQ — DQ power supply
Pin G10	VSS — Ground
Pin G11	VDDQ — DQ power supply
Pin G12	VSS — Ground
Pin G13	VDDQ — DQ power supply
Pin H1	VSS — Ground
Pin H2	VDDQ — DQ power supply
Pin H3	VSS — Ground
Pin H4	VDDQ — DQ power supply
Pin H5	VSS — Ground
Pin H6	VDDQ — DQ power supply
Pin H7	VSS — Ground
Pin H8	VDDQ — DQ power supply
Pin H9	VSS — Ground
Pin H10	VDDQ — DQ power supply
Pin H11	VSS — Ground
Pin H12	VDDQ — DQ power supply
Pin H13	VSS — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

AS4C256M8D3LB-12BIN is suitable for 6 applications: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, IoT Gateways.

🔧

Embedded Systems

The AS4C256M8D3LB-12BIN is ideal for embedded systems requiring low-power, high-density memory. Its 2Gbit capacity and x8 organization provide ample storage for operating systems and applications. The 1.35V operation reduces power consumption, extending battery life in portable devices. The 78-FBGA package saves PCB space, enabling compact designs. With a data rate of 1600 MT/s, it supports fast data processing for real-time applications. The device's wide operating temperature range (0°C to +95°C) ensures reliability in industrial environments.

Recommended

🌐

Networking Equipment

In networking equipment such as routers and switches, the AS4C256M8D3LB-12BIN provides high-bandwidth memory for packet buffering and routing tables. Its 1600 MT/s data rate ensures fast data throughput, while the low 1.35V supply reduces power dissipation in dense line cards. The x8 organization allows flexible memory expansion. The device's on-die termination improves signal integrity on high-speed buses, critical for reliable operation in noisy environments. The 78-FBGA package is suitable for compact network modules.

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🏭

Industrial Computing

The AS4C256M8D3LB-12BIN is well-suited for industrial computing applications such as PLCs, HMI panels, and edge servers. Its wide temperature range (0°C to +95°C) ensures operation in harsh environments. The low voltage (1.35V) reduces heat generation, improving system reliability. The 2Gbit density provides sufficient memory for complex control algorithms and data logging. The device's high reliability and long lifecycle make it a preferred choice for industrial designs. The 78-FBGA package is robust and suitable for vibration-prone environments.

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📺

Consumer Electronics

For consumer electronics like smart TVs, set-top boxes, and gaming consoles, the AS4C256M8D3LB-12BIN offers a cost-effective memory solution. Its 2Gbit capacity supports high-definition video streaming and multitasking. The low power consumption is ideal for energy-efficient devices. The 1600 MT/s data rate ensures smooth performance for multimedia applications. The compact 78-FBGA package allows slim device designs. The device's RoHS compliance meets environmental regulations for consumer products.

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🚗

Automotive Infotainment

The AS4C256M8D3LB-12BIN is suitable for automotive infotainment systems, providing reliable memory for navigation, audio, and display applications. Its wide temperature range and low power consumption are critical for automotive environments. The 2Gbit density supports complex user interfaces and map data. The device's high-speed interface (1600 MT/s) enables fast data access for real-time navigation. The 78-FBGA package is compact, fitting into space-constrained head units. The device's long lifecycle ensures availability for automotive production.

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🧩

IoT Gateways

In IoT gateways, the AS4C256M8D3LB-12BIN provides memory for data aggregation and protocol processing. Its low power consumption is essential for always-on devices. The 2Gbit capacity allows buffering of sensor data and firmware updates. The 1600 MT/s data rate supports high-throughput communication. The device's small footprint is ideal for compact gateway designs. The wide temperature range ensures operation in outdoor or industrial settings. The device's reliability is crucial for unattended operation.

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Recommended Products Summary

What is the memory size and organization of AS4C256M8D3LB-12BIN?

The AS4C256M8D3LB-12BIN is a 2Gbit DDR3L SDRAM organized as 256M x 8 bits. According to the Alliance Memory datasheet, it has a parallel interface and operates at 800 MHz with an access time of 20 ns. This configuration is ideal for applications requiring high-density, low-power memory.

What is the operating voltage range of AS4C256M8D3LB-12BIN?

The AS4C256M8D3LB-12BIN operates from 1.283V to 1.45V, with a nominal supply of 1.35V. This DDR3L device is designed for low-power applications, reducing power consumption by up to 20% compared to standard DDR3. Ensure your power supply is stable within this range for reliable operation.

What is the package type of AS4C256M8D3LB-12BIN?

The AS4C256M8D3LB-12BIN is housed in a 78-ball FBGA package with dimensions of 8x10.5 mm. This compact surface-mount package is suitable for space-constrained PCB designs. The package is RoHS compliant and lead-free, meeting environmental standards.

What is the price of AS4C256M8D3LB-12BIN?

As of 2026-08-19, the price of AS4C256M8D3LB-12BIN is approximately $8.50 for single-unit quantities, decreasing to $5.60 at 1000 units. Prices vary by distributor and quantity. Check DigiKey, Mouser, or Octopart for current pricing and availability.

Where can I buy AS4C256M8D3LB-12BIN online?

AS4C256M8D3LB-12BIN is available from authorized distributors such as DigiKey, Mouser, and Octopart. You can also purchase from specialized distributors like Micro-Semiconductor and Jotrin. Ensure you buy from authorized sources to guarantee genuine parts and warranty.

What is the lead time for AS4C256M8D3LB-12BIN?

The lead time for AS4C256M8D3LB-12BIN varies by distributor and stock levels. As of 2026-08-19, DigiKey lists it as 'ships today' for in-stock items. For larger quantities, lead times may range from 2 to 6 weeks. Contact your preferred distributor for accurate lead time information.

Is AS4C256M8D3LB-12BIN in stock?

Yes, AS4C256M8D3LB-12BIN is in stock at several distributors. DigiKey shows it as available for immediate shipping, and Micro-Semiconductor reports 17,342 units in stock. Check current stock levels on distributor websites as inventory can change rapidly.

What is the difference between AS4C256M8D3LB-12BIN and AS4C256M16D3LC-12BIN?

The AS4C256M8D3LB-12BIN is a 2Gbit DDR3L organized as 256M x 8, while the AS4C256M16D3LC-12BIN is a 4Gbit DDR3L organized as 256M x 16. The x16 device has double the data bus width, offering higher bandwidth but different pinout. They are not drop-in replacements due to different organizations and pin configurations.

When should I choose AS4C256M8D3LB-12BIN over AS4C256M16D3LC-12BIN?

Choose AS4C256M8D3LB-12BIN when you need a 2Gbit memory with an x8 interface, which is common in ECC and embedded applications. Choose AS4C256M16D3LC-12BIN if you require 4Gbit density and a wider x16 bus for higher bandwidth. The x8 device offers lower power per bit and is more suitable for byte-oriented systems.

What is the best drop-in replacement for AS4C256M8D3LB-12BIN?

The best drop-in replacement for AS4C256M8D3LB-12BIN is the AS4C256M8D3LB-12BCNTR, which is the tape-and-reel version of the same die and package. Other pin-compatible alternatives include the AS4C256M8D3LB-12BCN (tray) and the AS4C256M8D3LB-12BINTR (tape-and-reel). All share the same 78-FBGA footprint and specifications.

Can AS4C256M8D3LB-12BIN replace MT41K256M8DA-125?

Yes, the AS4C256M8D3LB-12BIN can replace the MT41K256M8DA-125 in many designs. Both are 2Gbit DDR3L SDRAM in 78-FBGA packages with similar timing. According to Alliance Memory's comparison document, the AS4C256M8D3LB-12BCN is a drop-in replacement for the MT41K256M8DA-125, offering comparable performance and pin compatibility.

Where can I download the AS4C256M8D3LB-12BIN datasheet PDF?

The AS4C256M8D3LB-12BIN datasheet is available from Alliance Memory's website and distributor sites. A direct PDF link is provided by Mouser: https://www.mouser.com/catalog/specsheets/alliance%20memory_allm-s-a0004957228-1.pdf. You can also find it on DigiKey's product page under 'Documents'.

What are the key specifications of AS4C256M8D3LB-12BIN that engineers should know?

Engineers should note that the AS4C256M8D3LB-12BIN is a 2Gbit DDR3L SDRAM with a 256M x 8 organization, operating at 800 MHz (1600 MT/s) with a CAS latency of 11. It uses a 1.35V supply (1.283V-1.45V) and comes in a 78-FBGA package. The access time is 20 ns, and it supports burst length 8. These specs make it suitable for low-power, high-density memory applications.

Is AS4C256M8D3LB-12BIN the same as AS4C256M8D3LB-12BCN?

No, AS4C256M8D3LB-12BIN and AS4C256M8D3LB-12BCN are not the same. The suffix 'BIN' indicates a specific configuration (likely industrial temperature or specific timing), while 'BCN' may denote a different temperature grade or packaging option. Always verify the full part number and datasheet to ensure compatibility.

What is the best Micron equivalent for AS4C256M8D3LB-12BIN?

The best Micron equivalent for AS4C256M8D3LB-12BIN is the MT41K256M8DA-125, which is a 2Gbit DDR3L SDRAM in a 78-ball FBGA package. According to Alliance Memory's comparison, the AS4C256M8D3LB-12BCN is a drop-in replacement for the MT41K256M8DA-125, indicating pin and timing compatibility. Verify the specific speed grade and temperature range for your application.

Engineering reference data for AS4C256M8D3LB-12BIN — comparison, design guidance, and compliance information.

Selection Guide

Choose the AS4C256M8D3LB-12BIN when you need a 2Gbit DDR3L SDRAM with an x8 organization, low power consumption, and a wide temperature range. It is ideal for embedded systems, networking equipment, and industrial computing. If you require a tape-and-reel packaging for automated assembly, consider the AS4C256M8D3LB-12BINTR or AS4C256M8D3LB-12BCNTR. For a tray packaging option, the AS4C256M8D3LB-12BCN is suitable. If you prefer a Micron part, the MT41K256M8DA-125 is a drop-in replacement with similar specifications. For higher density (4Gbit) or wider bus (x16), consider the AS4C256M16D3LC-12BIN, but note it is not pin-compatible. Always verify the specific temperature grade and timing parameters for your application.

Comparison with Alternatives

Parameter	This Product	AS4C256M8D3LB-12BCN	AS4C256M8D3LB-12BINTR	AS4C256M8D3LB-12BCNTR	MT41K256M8DA-125
Package	78-FBGA (8x10.5)	78-FBGA (8x10.5)	78-FBGA (8x10.5)	78-FBGA (8x10.5)	78-FBGA (8x10.5)
Brand	Alliance Memory, Inc.	Alliance Memory, Inc.	Alliance Memory, Inc.	Alliance Memory, Inc.	Micron Technology
Memory Size	2Gbit (256M x 8)	2Gbit (256M x 8)	2Gbit (256M x 8)	2Gbit (256M x 8)	2Gbit (256M x 8)
Supply Voltage	1.283V ~ 1.45V	1.283V ~ 1.45V	1.283V ~ 1.45V	1.283V ~ 1.45V	1.283V ~ 1.45V
Clock Frequency	800 MHz	800 MHz	800 MHz	800 MHz	800 MHz
Access Time	20 ns	20 ns	20 ns	20 ns	20 ns
Operating Temperature	0°C ~ +95°C	0°C ~ +95°C	0°C ~ +95°C	0°C ~ +95°C	0°C ~ +95°C
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant

Key Differentiators

Low voltage operation (1.35V) reduces power consumption by up to 20% compared to standard DDR3 (vs MT41K256M8DA-125)
Wide operating temperature range (0°C to +95°C) suitable for industrial applications (vs AS4C256M8D3LB-12BCN)
Drop-in replacement for Micron MT41K256M8DA-125 with verified compatibility (vs MT41K256M8DA-125)

Design Notes

The AS4C256M8D3LB-12BIN operates from a 1.35V supply (1.283V to 1.45V). Ensure the power supply is stable and well-regulated. Use a low-impedance power plane and place 0.1uF decoupling capacitors close to each VDD and VDDQ pin. Additionally, a 10uF bulk capacitor should be placed near the device to handle transient currents. Proper decoupling is critical to maintain signal integrity and prevent data corruption.

Follow JEDEC DDR3L layout guidelines for high-speed signals. Keep the trace lengths for DQ, DQS, and address/command signals matched to minimize skew. Use controlled impedance traces (typically 50 ohms single-ended, 100 ohms differential) for the data and clock lines. Place the device close to the controller to reduce trace lengths. Ensure a solid ground plane beneath the device to provide a low-inductance return path.

The AS4C256M8D3LB-12BIN has a maximum operating temperature of +95°C (case). In high-ambient-temperature environments, ensure adequate airflow or heatsinking. The 78-FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] °C/W. Calculate the power dissipation (VDD * IDD) and verify the junction temperature stays within limits. For typical operation at 1.35V and 200mA, power is 0.27W, which is manageable with standard PCB cooling.