AS4C256M8D3LB-12BIN - 2Gbit DDR3L SDRAM 78-FBGA | Alliance Memory
N.º da peça: AS4C256M8D3LB-12BIN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $6.9 | $690,00 |
| 500 | $6.2 | $3.100,00 |
| 1.000 | $5.6 | $5.600,00 |
AS4C256M8D3LB-12BIN Visão geral
DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at a lower voltage (1.35V) than standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the memory hierarchy in computing systems, serving as the main system memory in laptops, embedded systems, and networking equipment. DDR3L is backward compatible with DDR3 slots in many cases, making it a popular choice for upgrades and new designs.
Key features include a parallel interface with a data rate of 1600 MT/s, a burst length of 8, and on-die termination (ODT) for improved signal integrity. The device supports auto-refresh and self-refresh modes, with a typical refresh period of 7.8 us at 85°C. It also features programmable CAS latency, additive latency, and write latency, allowing flexibility in system timing. The 78-FBGA package is optimized for space-constrained designs, with a compact footprint of 8x10.5 mm.
Technically, the AS4C256M8D3LB-12BIN uses a 2Gbit DRAM cell array with a 8n-prefetch architecture, enabling high-speed data transfer. The device includes a DLL (Delay-Locked Loop) for precise clock alignment and supports dynamic ODT for improved signal quality. It is fabricated using a advanced CMOS process, ensuring low leakage and high reliability. The operating temperature range is 0°C to +95°C (case temperature), making it suitable for commercial and industrial applications.
Typical applications include embedded systems, networking equipment (routers, switches), industrial computing, and consumer electronics such as set-top boxes and smart TVs. Its low voltage and high density make it ideal for battery-powered devices and energy-efficient designs. The device is also used in automotive infotainment systems where reliability and temperature range are critical.
When designing with this memory, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins to minimize noise. The VREFCA and VREFDQ pins should be bypassed with 0.1uF capacitors. Also, follow the JEDEC DDR3L layout guidelines for signal integrity, especially for high-speed signals. The device supports a 1.35V supply, so ensure the power supply is stable and within the specified range.
Alternativas drop-in para AS4C256M8D3LB-12BIN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com AS4C256M8D3LB-12BIN (mesmo formato e footprint) — diferindo em Data Rate, Supply Voltage, Burst Length, CAS Latency, Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
AS4C256M8D3LB-12BCN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AS4C256M8D3LB-12BINTR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AS4C256M8D3LB-12BCNTR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT41K256M8DA-125
✅ Drop-In✓ Em estoque
$2.85 / unidade
Ver ficha técnica →IS43TR16256AL-125KBL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.6 / unidade
Ver ficha técnica →NT5CC256M16DP-DI
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.5 / unidade
Ver ficha técnica →AS4C256M8D3LB-12BIN Classificações máximas e características elétricas
| Tipo de memória | SDRAM - DDR3L |
| Tamanho da memória | 2Gbit (256M x 8) |
| Interface | Parallel |
| Clock Frequency | 800 MHz |
| Access Time | 20 ns |
| Tensão de alimentação | 1.283V ~ 1.45V |
| Encapsulamento / Caixa | 78-FBGA (8x10.5) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0°C ~ +95°C (Tc) |
| Taxa de dados | 1600 MT/s |
| Latência CAS | 11 |
| Burst Length | 8 |
| Refresh | 7.8 us at 85°C |
| Status RoHS | Compliant |
| Lead Free | Yes |
Configuração de pinos do AS4C256M8D3LB-12BIN
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDDQ — DQ power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino A13 | VDD — Power supply |
| Pino B1 | VSS — Ground |
| Pino B2 | VDDQ — DQ power supply |
| Pino B3 | VSS — Ground |
| Pino B4 | VDDQ — DQ power supply |
| Pino B5 | VSS — Ground |
| Pino B6 | VDDQ — DQ power supply |
| Pino B7 | VSS — Ground |
| Pino B8 | VDDQ — DQ power supply |
| Pino B9 | VSS — Ground |
| Pino B10 | VDDQ — DQ power supply |
| Pino B11 | VSS — Ground |
| Pino B12 | VDDQ — DQ power supply |
| Pino B13 | VSS — Ground |
| Pino C1 | A0 — Address input 0 |
| Pino C2 | A1 — Address input 1 |
| Pino C3 | A2 — Address input 2 |
| Pino C4 | A3 — Address input 3 |
| Pino C5 | A4 — Address input 4 |
| Pino C6 | A5 — Address input 5 |
| Pino C7 | A6 — Address input 6 |
| Pino C8 | A7 — Address input 7 |
| Pino C9 | A8 — Address input 8 |
| Pino C10 | A9 — Address input 9 |
| Pino C11 | A10/AP — Address input 10 / Auto-precharge |
| Pino C12 | A11 — Address input 11 |
| Pino C13 | A12 — Address input 12 |
| Pino D1 | BA0 — Bank address 0 |
| Pino D2 | BA1 — Bank address 1 |
| Pino D3 | BA2 — Bank address 2 |
| Pino D4 | RAS# — Row address strobe |
| Pino D5 | CAS# — Column address strobe |
| Pino D6 | WE# — Write enable |
| Pino D7 | CS# — Chip select |
| Pino D8 | ODT — On-die termination |
| Pino D9 | CKE — Clock enable |
| Pino D10 | CK — Clock (positive) |
| Pino D11 | CK# — Clock (negative) |
| Pino D12 | RESET# — Reset |
| Pino D13 | VREFCA — Reference voltage for command/address |
| Pino E1 | VDD — Power supply |
| Pino E2 | VSS — Ground |
| Pino E3 | VDD — Power supply |
| Pino E4 | VSS — Ground |
| Pino E5 | VDD — Power supply |
| Pino E6 | VSS — Ground |
| Pino E7 | VDD — Power supply |
| Pino E8 | VSS — Ground |
| Pino E9 | VDD — Power supply |
| Pino E10 | VSS — Ground |
| Pino E11 | VDD — Power supply |
| Pino E12 | VSS — Ground |
| Pino E13 | VDD — Power supply |
| Pino F1 | VSS — Ground |
| Pino F2 | VDD — Power supply |
| Pino F3 | VSS — Ground |
| Pino F4 | VDD — Power supply |
| Pino F5 | VSS — Ground |
| Pino F6 | VDD — Power supply |
| Pino F7 | VSS — Ground |
| Pino F8 | VDD — Power supply |
| Pino F9 | VSS — Ground |
| Pino F10 | VDD — Power supply |
| Pino F11 | VSS — Ground |
| Pino F12 | VDD — Power supply |
| Pino F13 | VSS — Ground |
| Pino G1 | VDDQ — DQ power supply |
| Pino G2 | VSS — Ground |
| Pino G3 | VDDQ — DQ power supply |
| Pino G4 | VSS — Ground |
| Pino G5 | VDDQ — DQ power supply |
| Pino G6 | VSS — Ground |
| Pino G7 | VDDQ — DQ power supply |
| Pino G8 | VSS — Ground |
| Pino G9 | VDDQ — DQ power supply |
| Pino G10 | VSS — Ground |
| Pino G11 | VDDQ — DQ power supply |
| Pino G12 | VSS — Ground |
| Pino G13 | VDDQ — DQ power supply |
| Pino H1 | VSS — Ground |
| Pino H2 | VDDQ — DQ power supply |
| Pino H3 | VSS — Ground |
| Pino H4 | VDDQ — DQ power supply |
| Pino H5 | VSS — Ground |
| Pino H6 | VDDQ — DQ power supply |
| Pino H7 | VSS — Ground |
| Pino H8 | VDDQ — DQ power supply |
| Pino H9 | VSS — Ground |
| Pino H10 | VDDQ — DQ power supply |
| Pino H11 | VSS — Ground |
| Pino H12 | VDDQ — DQ power supply |
| Pino H13 | VSS — Ground |
Aplicações típicas
AS4C256M8D3LB-12BIN é adequado para 6 aplicaçãos: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, IoT Gateways.
Embedded Systems
The AS4C256M8D3LB-12BIN is ideal for embedded systems requiring low-power, high-density memory. Its 2Gbit capacity and x8 organization provide ample storage for operating systems and applications. The 1.35V operation reduces power consumption, extending battery life in portable devices. The 78-FBGA package saves PCB space, enabling compact designs. With a data rate of 1600 MT/s, it supports fast data processing for real-time applications. The device's wide operating temperature range (0°C to +95°C) ensures reliability in industrial environments.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the AS4C256M8D3LB-12BIN provides high-bandwidth memory for packet buffering and routing tables. Its 1600 MT/s data rate ensures fast data throughput, while the low 1.35V supply reduces power dissipation in dense line cards. The x8 organization allows flexible memory expansion. The device's on-die termination improves signal integrity on high-speed buses, critical for reliable operation in noisy environments. The 78-FBGA package is suitable for compact network modules.
Recomendado
Industrial Computing
The AS4C256M8D3LB-12BIN is well-suited for industrial computing applications such as PLCs, HMI panels, and edge servers. Its wide temperature range (0°C to +95°C) ensures operation in harsh environments. The low voltage (1.35V) reduces heat generation, improving system reliability. The 2Gbit density provides sufficient memory for complex control algorithms and data logging. The device's high reliability and long lifecycle make it a preferred choice for industrial designs. The 78-FBGA package is robust and suitable for vibration-prone environments.
Recomendado
Consumer Electronics
For consumer electronics like smart TVs, set-top boxes, and gaming consoles, the AS4C256M8D3LB-12BIN offers a cost-effective memory solution. Its 2Gbit capacity supports high-definition video streaming and multitasking. The low power consumption is ideal for energy-efficient devices. The 1600 MT/s data rate ensures smooth performance for multimedia applications. The compact 78-FBGA package allows slim device designs. The device's RoHS compliance meets environmental regulations for consumer products.
Recomendado
Automotive Infotainment
The AS4C256M8D3LB-12BIN is suitable for automotive infotainment systems, providing reliable memory for navigation, audio, and display applications. Its wide temperature range and low power consumption are critical for automotive environments. The 2Gbit density supports complex user interfaces and map data. The device's high-speed interface (1600 MT/s) enables fast data access for real-time navigation. The 78-FBGA package is compact, fitting into space-constrained head units. The device's long lifecycle ensures availability for automotive production.
Recomendado
IoT Gateways
In IoT gateways, the AS4C256M8D3LB-12BIN provides memory for data aggregation and protocol processing. Its low power consumption is essential for always-on devices. The 2Gbit capacity allows buffering of sensor data and firmware updates. The 1600 MT/s data rate supports high-throughput communication. The device's small footprint is ideal for compact gateway designs. The wide temperature range ensures operation in outdoor or industrial settings. The device's reliability is crucial for unattended operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para AS4C256M8D3LB-12BIN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | AS4C256M8D3LB-12BCN | AS4C256M8D3LB-12BINTR | AS4C256M8D3LB-12BCNTR | MT41K256M8DA-125 |
|---|---|---|---|---|---|
| Package | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) | 78-FBGA (8x10.5) |
| Brand | Alliance Memory, Inc. | Alliance Memory, Inc. | Alliance Memory, Inc. | Alliance Memory, Inc. | Micron Technology |
| Memory Size | 2Gbit (256M x 8) | 2Gbit (256M x 8) | 2Gbit (256M x 8) | 2Gbit (256M x 8) | 2Gbit (256M x 8) |
| Supply Voltage | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V | 1.283V ~ 1.45V |
| Clock Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| Operating Temperature | 0°C ~ +95°C | 0°C ~ +95°C | 0°C ~ +95°C | 0°C ~ +95°C | 0°C ~ +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Low voltage operation (1.35V) reduces power consumption by up to 20% compared to standard DDR3 (vs MT41K256M8DA-125)
- Wide operating temperature range (0°C to +95°C) suitable for industrial applications (vs AS4C256M8D3LB-12BCN)
- Drop-in replacement for Micron MT41K256M8DA-125 with verified compatibility (vs MT41K256M8DA-125)
Notas de projeto
The AS4C256M8D3LB-12BIN operates from a 1.35V supply (1.283V to 1.45V). Ensure the power supply is stable and well-regulated. Use a low-impedance power plane and place 0.1uF decoupling capacitors close to each VDD and VDDQ pin. Additionally, a 10uF bulk capacitor should be placed near the device to handle transient currents. Proper decoupling is critical to maintain signal integrity and prevent data corruption.
Follow JEDEC DDR3L layout guidelines for high-speed signals. Keep the trace lengths for DQ, DQS, and address/command signals matched to minimize skew. Use controlled impedance traces (typically 50 ohms single-ended, 100 ohms differential) for the data and clock lines. Place the device close to the controller to reduce trace lengths. Ensure a solid ground plane beneath the device to provide a low-inductance return path.
The AS4C256M8D3LB-12BIN has a maximum operating temperature of +95°C (case). In high-ambient-temperature environments, ensure adequate airflow or heatsinking. The 78-FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] °C/W. Calculate the power dissipation (VDD * IDD) and verify the junction temperature stays within limits. For typical operation at 1.35V and 200mA, power is 0.27W, which is manageable with standard PCB cooling.
Informações de conformidade
RoHS compliant per distributor data. Lead-free. No AEC-Q100 qualification for this memory device.
