EP1C6T144C8AA - Cyclone FPGA, 6K LEs, 144-LQFP | Intel
MPN: EP1C6T144C8AA ⚠ Waktu Beli TerakhirEP1C6T144C8AA Ringkasan
A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are defined by a user-supplied bitstream held in external SRAM or flash. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the digital design hierarchy: they deliver ASIC-class parallelism and I/O flexibility without NRE cost, while offering far more deterministic real-time performance than general-purpose CPUs. The Cyclone family was Intel's (formerly Altera's) first low-cost FPGA line and helped define the modern mid-density FPGA market segment.
Key features of the EP1C6T144C8AA include 5,980 logic elements, 92,160 RAM bits (approximately 11.5 Kbytes of block RAM), up to 185 Kbits of usable RAM, two PLLs, and support for LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards. The 144-LQFP package exposes 98 user I/Os across four I/O banks, supporting up to 4 user I/O banks per Cyclone device. Industrial temperature range is -40 °C to +100 °C junction, making the part suitable for harsh environments. The device is configured via active serial (AS), passive serial (PS), or JTAG modes using an external configuration device.
Architecturally, the EP1C6T144C8AA uses a four-input look-up-table (LUT) per logic element, M4K RAM blocks of 4 Kbits each (with parity and shift-register modes), and dedicated multiplier blocks are not present in this family (multipliers are implemented in soft logic using the Quartus Prime library megafunctions). The two PLLs support clock multiplication, division, phase shifting, and external clock output, enabling robust clock-tree design across the 98 I/Os.
Typical applications include industrial motor control and factory automation glue logic, video processing and image-sensor interface bridging, low-cost ASIC prototyping, communications backplane interfacing, and consumer display controllers. Designers migrating from discrete logic or CPLDs frequently choose this device for its RAM density and PLL support.
When designing with this part, ensure the JTAG chain, configuration flash, and decoupling network are correctly designed. Quartus II (or the legacy Quartus Prime 13.0sp1) is the supported development toolchain; third-party synthesis from Synopsys Synplify or Mentor Precision is also available.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not consolidated on a single manufacturer or distributor page.
Alternatif penggantian untuk EP1C6T144C8AA — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1C6T144C8AA (sama faktor bentuk dan footprint) — berbeda di dalam Package, Speed Grade, Process Technology, Family, Operating Temperature.
EP1C6T144C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1C6T144C7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1C6T144C6N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1C6T144I7N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP1C6Q240C8N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP1C6F256C8N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP1C6T144C8AA Rating Maksimal & Karakteristik Listrik
| Series | Cyclone |
| Family | Cyclone (original) |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Number of Logic Array Blocks (LABs) | 598 |
| Number of M4K RAM Blocks (4 Kbit each) | 20 |
| User I/O Pins | 98 |
| PLLs | 2 |
| Paket | 144-LQFP (TQFP), 20 mm × 20 mm, 0.4 mm pitch |
| Jumlah Pin | 144 |
| Speed Grade | 8 (slowest commercial) |
| Suffix AA | Lead-free, industrial temperature grade |
| Operating Temperature (junction) | -40 °C to +100 °C |
| Supply Voltage (Core) | 1.5 V |
| Configuration Modes | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, SSTL, PCI, LVDS |
| Process Technology | 0.13 µm SRAM |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant (lead-free AA suffix) |
| Level MSL | 3 (168 hours, per AIChipLink listing) |
Konfigurasi Pin EP1C6T144C8AA
| Pin produk 1 | I/O (Bank 1) — User I/O; dual-purpose configuration pin |
| Pin produk 2 | I/O (Bank 1) — User I/O |
| Pin produk 3 | I/O (Bank 1) — User I/O |
| Pin produk 4 | I/O (Bank 1) — User I/O |
| Pin produk 5 | VCCIO1 — I/O bank 1 supply |
| Pin produk 6 | I/O (Bank 1) — User I/O |
| Pin produk 7 | I/O (Bank 1) — User I/O |
| Pin produk 8 | GND — Ground |
| Pin produk 9 | I/O (Bank 1) — User I/O |
| Pin produk 10 | I/O (Bank 1) — User I/O |
| Pin produk 11 | I/O (Bank 1) — User I/O |
| Pin produk 12 | VCCINT — Core supply (1.5 V) |
| Pin produk 13 | I/O (Bank 1) — User I/O |
| Pin produk 14 | I/O (Bank 1) — User I/O |
| Pin produk 15 | I/O (Bank 1) — User I/O |
| Pin produk 16 | GND — Ground |
| Pin produk 17 | I/O (Bank 1) — User I/O |
| Pin produk 18 | I/O (Bank 1) — User I/O |
| Pin produk 19 | I/O (Bank 1) — User I/O |
| Pin produk 20 | VCCIO1 — I/O bank 1 supply |
| Pin produk 21 | I/O (Bank 1) — User I/O |
| Pin produk 22 | I/O (Bank 1) — User I/O |
| Pin produk 23 | I/O (Bank 1) — User I/O |
| Pin produk 24 | I/O (Bank 1) — User I/O |
| Pin produk 25 | I/O (Bank 1) — User I/O |
| Pin produk 26 | I/O (Bank 1) — User I/O |
| Pin produk 27 | I/O (Bank 1) — User I/O |
| Pin produk 28 | GND — Ground |
| Pin produk 29 | I/O (Bank 1) — User I/O |
| Pin produk 30 | I/O (Bank 1) — User I/O |
| Pin produk 31 | VCCIO1 — I/O bank 1 supply |
| Pin produk 32 | I/O (Bank 1) — User I/O |
| Pin produk 33 | I/O (Bank 1) — User I/O |
| Pin produk 34 | I/O (Bank 1) — User I/O |
| Pin produk 35 | I/O (Bank 1) — User I/O |
| Pin produk 36 | I/O (Bank 1) — User I/O |
| Pin produk 37 | VCCINT — Core supply (1.5 V) |
| Pin produk 38 | I/O (Bank 2) — User I/O |
| Pin produk 39 | I/O (Bank 2) — User I/O |
| Pin produk 40 | I/O (Bank 2) — User I/O |
| Pin produk 41 | GND — Ground |
| Pin produk 42 | I/O (Bank 2) — User I/O |
| Pin produk 43 | I/O (Bank 2) — User I/O |
| Pin produk 44 | VCCIO2 — I/O bank 2 supply |
| Pin produk 45 | I/O (Bank 2) — User I/O |
| Pin produk 46 | I/O (Bank 2) — User I/O |
| Pin produk 47 | I/O (Bank 2) — User I/O |
| Pin produk 48 | I/O (Bank 2) — User I/O |
| Pin produk 49 | GND — Ground |
| Pin produk 50 | I/O (Bank 2) — User I/O |
| Pin produk 51 | I/O (Bank 2) — User I/O |
| Pin produk 52 | I/O (Bank 2) — User I/O |
| Pin produk 53 | VCCIO2 — I/O bank 2 supply |
| Pin produk 54 | I/O (Bank 2) — User I/O |
| Pin produk 55 | I/O (Bank 2) — User I/O |
| Pin produk 56 | I/O (Bank 2) — User I/O |
| Pin produk 57 | I/O (Bank 2) — User I/O |
| Pin produk 58 | VCCINT — Core supply (1.5 V) |
| Pin produk 59 | I/O (Bank 2) — User I/O |
| Pin produk 60 | I/O (Bank 2) — User I/O |
| Pin produk 61 | I/O (Bank 2) — User I/O |
| Pin produk 62 | GND — Ground |
| Pin produk 63 | I/O (Bank 2) — User I/O |
| Pin produk 64 | I/O (Bank 2) — User I/O |
| Pin produk 65 | I/O (Bank 2) — User I/O |
| Pin produk 66 | VCCIO2 — I/O bank 2 supply |
| Pin produk 67 | I/O (Bank 2) — User I/O |
| Pin produk 68 | I/O (Bank 2) — User I/O |
| Pin produk 69 | I/O (Bank 2) — User I/O |
| Pin produk 70 | I/O (Bank 2) — User I/O |
| Pin produk 71 | GND — Ground |
| Pin produk 72 | I/O (Bank 2) — User I/O |
| Pin produk 73 | I/O (Bank 3) — User I/O |
| Pin produk 74 | VCCIO3 — I/O bank 3 supply |
| Pin produk 75 | I/O (Bank 3) — User I/O |
| Pin produk 76 | I/O (Bank 3) — User I/O |
| Pin produk 77 | I/O (Bank 3) — User I/O |
| Pin produk 78 | VCCINT — Core supply (1.5 V) |
| Pin produk 79 | I/O (Bank 3) — User I/O |
| Pin produk 80 | I/O (Bank 3) — User I/O |
| Pin produk 81 | I/O (Bank 3) — User I/O |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | I/O (Bank 3) — User I/O |
| Pin produk 84 | I/O (Bank 3) — User I/O |
| Pin produk 85 | I/O (Bank 3) — User I/O |
| Pin produk 86 | VCCIO3 — I/O bank 3 supply |
| Pin produk 87 | I/O (Bank 3) — User I/O |
| Pin produk 88 | I/O (Bank 3) — User I/O |
| Pin produk 89 | I/O (Bank 3) — User I/O |
| Pin produk 90 | I/O (Bank 3) — User I/O |
| Pin produk 91 | GND — Ground |
| Pin produk 92 | I/O (Bank 3) — User I/O |
| Pin produk 93 | I/O (Bank 3) — User I/O |
| Pin produk 94 | VCCIO3 — I/O bank 3 supply |
| Pin produk 95 | I/O (Bank 3) — User I/O |
| Pin produk 96 | I/O (Bank 3) — User I/O |
| Pin produk 97 | I/O (Bank 3) — User I/O |
| Pin produk 98 | I/O (Bank 3) — User I/O |
| Pin produk 99 | VCCINT — Core supply (1.5 V) |
| Pin produk 100 | I/O (Bank 3) — User I/O |
| Pin produk 101 | I/O (Bank 3) — User I/O |
| Pin produk 102 | I/O (Bank 3) — User I/O |
| Pin produk 103 | GND — Ground |
| Pin produk 104 | I/O (Bank 3) — User I/O |
| Pin produk 105 | I/O (Bank 3) — User I/O |
| Pin produk 106 | I/O (Bank 3) — User I/O |
| Pin produk 107 | VCCIO3 — I/O bank 3 supply |
| Pin produk 108 | I/O (Bank 3) — User I/O |
| Pin produk 109 | VCCINT — Core supply (1.5 V) |
| Pin produk 110 | I/O (Bank 4) — User I/O |
| Pin produk 111 | I/O (Bank 4) — User I/O |
| Pin produk 112 | I/O (Bank 4) — User I/O |
| Pin produk 113 | GND — Ground |
| Pin produk 114 | I/O (Bank 4) — User I/O |
| Pin produk 115 | I/O (Bank 4) — User I/O |
| Pin produk 116 | VCCIO4 — I/O bank 4 supply |
| Pin produk 117 | I/O (Bank 4) — User I/O |
| Pin produk 118 | I/O (Bank 4) — User I/O |
| Pin produk 119 | I/O (Bank 4) — User I/O |
| Pin produk 120 | I/O (Bank 4) — User I/O |
| Pin produk 121 | GND — Ground |
| Pin produk 122 | I/O (Bank 4) — User I/O |
| Pin produk 123 | I/O (Bank 4) — User I/O |
| Pin produk 124 | VCCIO4 — I/O bank 4 supply |
| Pin produk 125 | I/O (Bank 4) — User I/O |
| Pin produk 126 | I/O (Bank 4) — User I/O |
| Pin produk 127 | I/O (Bank 4) — User I/O |
| Pin produk 128 | I/O (Bank 4) — User I/O |
| Pin produk 129 | VCCINT — Core supply (1.5 V) |
| Pin produk 130 | I/O (Bank 4) — User I/O |
| Pin produk 131 | I/O (Bank 4) — User I/O |
| Pin produk 132 | I/O (Bank 4) — User I/O |
| Pin produk 133 | GND — Ground |
| Pin produk 134 | nCONFIG — Configuration start (active-low) |
| Pin produk 135 | nSTATUS — Configuration status (active-low) |
| Pin produk 136 | CONF_DONE — Configuration complete (open-drain) |
| Pin produk 137 | DCLK — Configuration clock |
| Pin produk 138 | MSEL0 — Configuration mode select |
| Pin produk 139 | MSEL1 — Configuration mode select |
| Pin produk 140 | TDI — JTAG test data in |
| Pin produk 141 | TMS — JTAG test mode select |
| Pin produk 142 | TCK — JTAG test clock |
| Pin produk 143 | TDO — JTAG test data out |
| Pin produk 144 | VCCIO4 — I/O bank 4 supply (also JTAG bank) |
Aplikasi Umum
EP1C6T144C8AA cocok untuk 6 aplikasis: Industrial Motor Control and Factory Automation, Video Image-Sensor Interface Bridging, Legacy Telecom Backplane and Bus Bridging, Low-Cost ASIC Prototyping, Consumer Display Controllers and LCD Adapters, Test and Measurement Front-End Logic.
Industrial Motor Control and Factory Automation
The EP1C6T144C8AA's 5,980 logic elements and two PLLs make it well-suited to industrial motor control front-ends, where the device performs PWM generation, encoder decoding, and field-oriented control glue logic. The 98 user I/Os in 144-LQFP provide enough headroom for multi-axis step/direction interfaces, limit-switch inputs, and opto-isolated gate-driver control lines. Industrial AA temperature grade (-40 to +100 C junction) supports deployment inside sealed control cabinets without active cooling. Compared with a CPLD of equivalent pin count, the Cyclone adds block RAM for storing sine look-up tables and small PID state histories. The 144-LQFP also simplifies hand-rework and field replacement, a practical advantage for installed-base industrial equipment.
Direkomendasikan
Video Image-Sensor Interface Bridging
The EP1C6T144C8AA is frequently used as a bridge between parallel CMOS image sensors and downstream processors in industrial cameras, scanners, and machine-vision systems. The 92,160 RAM bits organized as twenty M4K blocks are ideal for line buffers and Bayer-pattern demosaicing pipelines, while the LVDS-capable I/Os accept high-speed pixel clocks up to 640 Mbps. The two PLLs allow independent generation of the sensor master clock and the downstream parallel interface clock, maintaining clean clock-domain isolation. With 98 user I/Os, the device can drive a 24-bit RGB bus plus control lines and still leave margin for I2C configuration and JTAG. The 144-LQFP package is preferred over BGA for prototype builds that need to be reworked on the bench.
Direkomendasikan
Legacy Telecom Backplane and Bus Bridging
Telecom backplanes often require glue logic between asynchronous serial links (T1/E1, RS-485, SPI, I2C) and backplane fabrics such as H.110 or proprietary parallel buses. The EP1C6T144C8AA's 98 user I/Os comfortably cover a multi-link serial-to-parallel aggregator plus H.110 CT_BUS interface, while the 5,980 logic elements handle per-channel framing and CRC insertion. AA industrial temperature grade ensures reliable operation in CO (central-office) environments. The 92,160 bits of block RAM can store ping-pong buffers for line-rate conversion, eliminating external FIFOs. Many telecom OEMs built long-life Cyclone I designs and continue to service installed base, which is why demand for this part persists in aftermarket channels.
Direkomendasikan
Low-Cost ASIC Prototyping
Designers routinely map mid-complexity ASICs onto the EP1C6T144C8AA for pre-silicon validation and firmware bring-up. The 5,980 logic elements, 92,160 RAM bits, and dual PLLs cover many sub-100K-gate ASIC RTL designs, while the SRAM-based configuration enables rapid design iteration via JTAG. Industrial temperature grade allows the prototype board to be deployed in the actual end-product environment for accelerated life testing. The 144-LQFP package is also cost-effective for prototype runs of a few hundred units. Quartus II 13.0sp1 supports incremental compilation and the SOPC Builder flow, enabling team-based prototyping of heterogeneous subsystems.
Direkomendasikan
Consumer Display Controllers and LCD Adapters
The EP1C6T144C8AA is widely deployed as a low-cost display-format converter for legacy consumer electronics, medical monitors, and kiosk displays. Its LVDS-capable I/Os drive up to XGA resolution panels, while the block RAM provides line buffers for frame-rate conversion and scaling. Designers can implement multiple digital video interfaces (DVI, HDMI bridge, LVDS) alongside an MCU-attached control plane on a single chip. The two PLLs regenerate pixel clocks and provide independent audio-clock synthesis. Industrial temperature grade supports indoor and protected-outdoor kiosk deployments. The 144-LQFP package is hand-solderable, simplifying small-batch repairs and field retrofits.
Direkomendasikan
Test and Measurement Front-End Logic
Bench-top and modular instruments frequently use the EP1C6T144C8AA as a flexible digital-front-end between sensors and a DSP or host CPU. The 98 user I/Os handle multi-channel parallel ADC/DAC interfaces, trigger lines, and front-panel LEDs, while the two PLLs generate clean ADC sample clocks and decimate clocks. Industrial temperature grade supports lab and light-industrial environments. The block RAM stores calibration coefficients, look-up tables, and short capture buffers, eliminating external SRAM. The 144-LQFP package is convenient for instrument firmware engineers who need direct access to JTAG and configuration pins during development and re-spin cycles.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1C6T144C8AA — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1C6T144C8N | EP1C6T144C7N | EP1C6T144C6N | EP1C6T144I7N | EP1C6Q240C8N | EP1C6F256C8N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 240-PQFP - larger, not footprint-compatible | 256-FBGA - not footprint-compatible |
| Brand | Intel | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 5,980 | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical die) | 5,980 (identical die) |
| Total RAM Bits | 92,160 | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical die) | 92,160 (identical die) |
| User I/O Pins | 98 | 98 (identical) | 98 (identical) | 98 (identical) | 98 (identical) | 185 (more I/O, larger package) | 185 (more I/O, BGA package) |
| Speed Grade | 8 (slowest) | 8 (identical) | 7 (~12% Fmax improvement) | 6 (fastest Cyclone I bin, ~25% Fmax improvement) | 7 (industrial) | 8 (identical speed) | 8 (identical speed) |
| Temperature Grade | Industrial (-40 to +100 C junction) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| PLLs | 2 | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical die) | 2 (identical die) |
| Footprint-Compatibility with 144-LQFP | Yes (this part) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | No (different package) | No (BGA package) |
| Lifecycle Status (as of 2026-09-06) | Last-time-buy | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) |
Diferensiator Kunci
- Industrial temperature grade in a Cyclone I 144-LQFP (vsEP1C6T144C8N)
- Slower speed grade (8) with full industrial rating (vsEP1C6T144I7N)
- Drop-in compatible with all EP1C6T144 variants (vsEP1C3T144C8 / EP1C12Q240C8N)
Catatan Desain
Estimated: at 25 °C ambient, full 98-I/O utilization, 100 MHz core clock, the EP1C6T144C8AA typically consumes 200-300 mA from VCCINT (1.5 V) plus per-bank VCCIO current. Estimated Icc_int = 250 mA, VCCINT power = 0.375 W. Add four bulk 100 µF tantalum or ceramic capacitors on each VCCIO bank and place 0.1 µF + 0.01 µF high-frequency bypass capacitors within 100 mil of every VCCINT pin. Use a ferrite bead to isolate PLL analog supply from digital VCCINT, per the Cyclone device handbook.
144-LQFP at 0.4 mm pitch requires 0.2 mm trace width and 0.2 mm clearance for fanout. Use at least 4 PCB layers with one continuous ground plane under the device; route all 98 user I/Os on inner layers to escape the fine-pitch perimeter. Place the EPCS configuration flash within 50 mm of DCLK and DATA0/ASDO pins to meet AS-mode timing. JTAG chain (TCK/TMS/TDO/TDI) must be kept short and daisy-chained with 4.7 kΩ pull-ups on TCK/TMS as recommended in the Cyclone handbook.
Cyclone I family is configured by a 1.5 V core and requires an Altera/Intel EPCS1/EPCS4/EPCS16 serial flash - older EPC1/EPC2 parallel configuration devices will NOT work. Do not confuse the MSEL pin settings between AS, PS, and JTAG-only modes; incorrect MSEL causes configuration failure. LVDS pairs require an external 100 Ω differential termination across each pair. Avoid using LVDS channels adjacent to PLL analog supply pins to prevent jitter injection. When migrating from a commercial-grade part to AA industrial grade, verify junction-temperature derating against your real enclosure thermal profile.
Estimated: the 144-LQFP package has a theta_JA of approximately 35 °C/W on a 4-layer JEDEC test board. At typical 0.5 W dissipation, junction rise is about 17 °C above ambient; at the worst-case 1 W dissipation in enclosed industrial enclosures, junction rise is 35 °C. Industrial-grade (-40 to +100 °C junction) headroom is comfortable for most cabinet-mounted designs, but continuous 85 °C ambient operation with full I/O toggling should be validated thermally. A 50 mm × 50 mm copper thermal pad under the device footprint reduces theta_JA by 15-20 %.
Informasi Konformitas
AA suffix indicates lead-free finish; part is RoHS and REACH compliant per Intel/Altera Cyclone family documentation. Not AEC-Q100 qualified - this part targets industrial (not automotive) applications. Original Cyclone I family is in last-time-buy; Intel recommends migration to Cyclone IV or Cyclone 10 LP for new designs.