EP1C6T144C8AA - Cyclone FPGA, 6K LEs, 144-LQFP | Intel
Référence : EP1C6T144C8AA ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.9 | $339,00 |
| 100 | $29.2 | $2 920,00 |
| 500 | $25.75 | $12 875,00 |
| 1 000 | $22.4 | $22 400,00 |
EP1C6T144C8AA Présentation
A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are defined by a user-supplied bitstream held in external SRAM or flash. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the digital design hierarchy: they deliver ASIC-class parallelism and I/O flexibility without NRE cost, while offering far more deterministic real-time performance than general-purpose CPUs. The Cyclone family was Intel's (formerly Altera's) first low-cost FPGA line and helped define the modern mid-density FPGA market segment.
Key features of the EP1C6T144C8AA include 5,980 logic elements, 92,160 RAM bits (approximately 11.5 Kbytes of block RAM), up to 185 Kbits of usable RAM, two PLLs, and support for LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards. The 144-LQFP package exposes 98 user I/Os across four I/O banks, supporting up to 4 user I/O banks per Cyclone device. Industrial temperature range is -40 °C to +100 °C junction, making the part suitable for harsh environments. The device is configured via active serial (AS), passive serial (PS), or JTAG modes using an external configuration device.
Architecturally, the EP1C6T144C8AA uses a four-input look-up-table (LUT) per logic element, M4K RAM blocks of 4 Kbits each (with parity and shift-register modes), and dedicated multiplier blocks are not present in this family (multipliers are implemented in soft logic using the Quartus Prime library megafunctions). The two PLLs support clock multiplication, division, phase shifting, and external clock output, enabling robust clock-tree design across the 98 I/Os.
Typical applications include industrial motor control and factory automation glue logic, video processing and image-sensor interface bridging, low-cost ASIC prototyping, communications backplane interfacing, and consumer display controllers. Designers migrating from discrete logic or CPLDs frequently choose this device for its RAM density and PLL support.
When designing with this part, ensure the JTAG chain, configuration flash, and decoupling network are correctly designed. Quartus II (or the legacy Quartus Prime 13.0sp1) is the supported development toolchain; third-party synthesis from Synopsys Synplify or Mentor Precision is also available.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not consolidated on a single manufacturer or distributor page.
Alternatives de remplacement direct pour EP1C6T144C8AA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C6T144C8AA (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, Family, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C6T144C8N
✅ Remplacement direct✓ En stock
$12.95 / unité
Voir la fiche technique →EP1C6T144C7N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EP1C6T144C6N
✅ Remplacement direct✓ En stock
$18.85 / unité
Voir la fiche technique →EP1C6T144I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$42.5 / unité
Voir la fiche technique →EP1C6Q240C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.6 / unité
Voir la fiche technique →EP1C6F256C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.4 / unité
Voir la fiche technique →EP1C6T144C8AA Valeurs maximales et caractéristiques électriques
| Series | Cyclone |
| Family | Cyclone (original) |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Number of Logic Array Blocks (LABs) | 598 |
| Number of M4K RAM Blocks (4 Kbit each) | 20 |
| User I/O Pins | 98 |
| PLLs | 2 |
| Boîtier | 144-LQFP (TQFP), 20 mm × 20 mm, 0.4 mm pitch |
| Nombre de broches | 144 |
| Speed Grade | 8 (slowest commercial) |
| Suffix AA | Lead-free, industrial temperature grade |
| Operating Temperature (junction) | -40 °C to +100 °C |
| Supply Voltage (Core) | 1.5 V |
| Configuration Modes | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, SSTL, PCI, LVDS |
| Process Technology | 0.13 µm SRAM |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (lead-free AA suffix) |
| Niveau MSL | 3 (168 hours, per AIChipLink listing) |
Configuration des broches de EP1C6T144C8AA
| Broche 1 | I/O (Bank 1) — User I/O; dual-purpose configuration pin |
| Broche 2 | I/O (Bank 1) — User I/O |
| Broche 3 | I/O (Bank 1) — User I/O |
| Broche 4 | I/O (Bank 1) — User I/O |
| Broche 5 | VCCIO1 — I/O bank 1 supply |
| Broche 6 | I/O (Bank 1) — User I/O |
| Broche 7 | I/O (Bank 1) — User I/O |
| Broche 8 | GND — Ground |
| Broche 9 | I/O (Bank 1) — User I/O |
| Broche 10 | I/O (Bank 1) — User I/O |
| Broche 11 | I/O (Bank 1) — User I/O |
| Broche 12 | VCCINT — Core supply (1.5 V) |
| Broche 13 | I/O (Bank 1) — User I/O |
| Broche 14 | I/O (Bank 1) — User I/O |
| Broche 15 | I/O (Bank 1) — User I/O |
| Broche 16 | GND — Ground |
| Broche 17 | I/O (Bank 1) — User I/O |
| Broche 18 | I/O (Bank 1) — User I/O |
| Broche 19 | I/O (Bank 1) — User I/O |
| Broche 20 | VCCIO1 — I/O bank 1 supply |
| Broche 21 | I/O (Bank 1) — User I/O |
| Broche 22 | I/O (Bank 1) — User I/O |
| Broche 23 | I/O (Bank 1) — User I/O |
| Broche 24 | I/O (Bank 1) — User I/O |
| Broche 25 | I/O (Bank 1) — User I/O |
| Broche 26 | I/O (Bank 1) — User I/O |
| Broche 27 | I/O (Bank 1) — User I/O |
| Broche 28 | GND — Ground |
| Broche 29 | I/O (Bank 1) — User I/O |
| Broche 30 | I/O (Bank 1) — User I/O |
| Broche 31 | VCCIO1 — I/O bank 1 supply |
| Broche 32 | I/O (Bank 1) — User I/O |
| Broche 33 | I/O (Bank 1) — User I/O |
| Broche 34 | I/O (Bank 1) — User I/O |
| Broche 35 | I/O (Bank 1) — User I/O |
| Broche 36 | I/O (Bank 1) — User I/O |
| Broche 37 | VCCINT — Core supply (1.5 V) |
| Broche 38 | I/O (Bank 2) — User I/O |
| Broche 39 | I/O (Bank 2) — User I/O |
| Broche 40 | I/O (Bank 2) — User I/O |
| Broche 41 | GND — Ground |
| Broche 42 | I/O (Bank 2) — User I/O |
| Broche 43 | I/O (Bank 2) — User I/O |
| Broche 44 | VCCIO2 — I/O bank 2 supply |
| Broche 45 | I/O (Bank 2) — User I/O |
| Broche 46 | I/O (Bank 2) — User I/O |
| Broche 47 | I/O (Bank 2) — User I/O |
| Broche 48 | I/O (Bank 2) — User I/O |
| Broche 49 | GND — Ground |
| Broche 50 | I/O (Bank 2) — User I/O |
| Broche 51 | I/O (Bank 2) — User I/O |
| Broche 52 | I/O (Bank 2) — User I/O |
| Broche 53 | VCCIO2 — I/O bank 2 supply |
| Broche 54 | I/O (Bank 2) — User I/O |
| Broche 55 | I/O (Bank 2) — User I/O |
| Broche 56 | I/O (Bank 2) — User I/O |
| Broche 57 | I/O (Bank 2) — User I/O |
| Broche 58 | VCCINT — Core supply (1.5 V) |
| Broche 59 | I/O (Bank 2) — User I/O |
| Broche 60 | I/O (Bank 2) — User I/O |
| Broche 61 | I/O (Bank 2) — User I/O |
| Broche 62 | GND — Ground |
| Broche 63 | I/O (Bank 2) — User I/O |
| Broche 64 | I/O (Bank 2) — User I/O |
| Broche 65 | I/O (Bank 2) — User I/O |
| Broche 66 | VCCIO2 — I/O bank 2 supply |
| Broche 67 | I/O (Bank 2) — User I/O |
| Broche 68 | I/O (Bank 2) — User I/O |
| Broche 69 | I/O (Bank 2) — User I/O |
| Broche 70 | I/O (Bank 2) — User I/O |
| Broche 71 | GND — Ground |
| Broche 72 | I/O (Bank 2) — User I/O |
| Broche 73 | I/O (Bank 3) — User I/O |
| Broche 74 | VCCIO3 — I/O bank 3 supply |
| Broche 75 | I/O (Bank 3) — User I/O |
| Broche 76 | I/O (Bank 3) — User I/O |
| Broche 77 | I/O (Bank 3) — User I/O |
| Broche 78 | VCCINT — Core supply (1.5 V) |
| Broche 79 | I/O (Bank 3) — User I/O |
| Broche 80 | I/O (Bank 3) — User I/O |
| Broche 81 | I/O (Bank 3) — User I/O |
| Broche 82 | GND — Ground |
| Broche 83 | I/O (Bank 3) — User I/O |
| Broche 84 | I/O (Bank 3) — User I/O |
| Broche 85 | I/O (Bank 3) — User I/O |
| Broche 86 | VCCIO3 — I/O bank 3 supply |
| Broche 87 | I/O (Bank 3) — User I/O |
| Broche 88 | I/O (Bank 3) — User I/O |
| Broche 89 | I/O (Bank 3) — User I/O |
| Broche 90 | I/O (Bank 3) — User I/O |
| Broche 91 | GND — Ground |
| Broche 92 | I/O (Bank 3) — User I/O |
| Broche 93 | I/O (Bank 3) — User I/O |
| Broche 94 | VCCIO3 — I/O bank 3 supply |
| Broche 95 | I/O (Bank 3) — User I/O |
| Broche 96 | I/O (Bank 3) — User I/O |
| Broche 97 | I/O (Bank 3) — User I/O |
| Broche 98 | I/O (Bank 3) — User I/O |
| Broche 99 | VCCINT — Core supply (1.5 V) |
| Broche 100 | I/O (Bank 3) — User I/O |
| Broche 101 | I/O (Bank 3) — User I/O |
| Broche 102 | I/O (Bank 3) — User I/O |
| Broche 103 | GND — Ground |
| Broche 104 | I/O (Bank 3) — User I/O |
| Broche 105 | I/O (Bank 3) — User I/O |
| Broche 106 | I/O (Bank 3) — User I/O |
| Broche 107 | VCCIO3 — I/O bank 3 supply |
| Broche 108 | I/O (Bank 3) — User I/O |
| Broche 109 | VCCINT — Core supply (1.5 V) |
| Broche 110 | I/O (Bank 4) — User I/O |
| Broche 111 | I/O (Bank 4) — User I/O |
| Broche 112 | I/O (Bank 4) — User I/O |
| Broche 113 | GND — Ground |
| Broche 114 | I/O (Bank 4) — User I/O |
| Broche 115 | I/O (Bank 4) — User I/O |
| Broche 116 | VCCIO4 — I/O bank 4 supply |
| Broche 117 | I/O (Bank 4) — User I/O |
| Broche 118 | I/O (Bank 4) — User I/O |
| Broche 119 | I/O (Bank 4) — User I/O |
| Broche 120 | I/O (Bank 4) — User I/O |
| Broche 121 | GND — Ground |
| Broche 122 | I/O (Bank 4) — User I/O |
| Broche 123 | I/O (Bank 4) — User I/O |
| Broche 124 | VCCIO4 — I/O bank 4 supply |
| Broche 125 | I/O (Bank 4) — User I/O |
| Broche 126 | I/O (Bank 4) — User I/O |
| Broche 127 | I/O (Bank 4) — User I/O |
| Broche 128 | I/O (Bank 4) — User I/O |
| Broche 129 | VCCINT — Core supply (1.5 V) |
| Broche 130 | I/O (Bank 4) — User I/O |
| Broche 131 | I/O (Bank 4) — User I/O |
| Broche 132 | I/O (Bank 4) — User I/O |
| Broche 133 | GND — Ground |
| Broche 134 | nCONFIG — Configuration start (active-low) |
| Broche 135 | nSTATUS — Configuration status (active-low) |
| Broche 136 | CONF_DONE — Configuration complete (open-drain) |
| Broche 137 | DCLK — Configuration clock |
| Broche 138 | MSEL0 — Configuration mode select |
| Broche 139 | MSEL1 — Configuration mode select |
| Broche 140 | TDI — JTAG test data in |
| Broche 141 | TMS — JTAG test mode select |
| Broche 142 | TCK — JTAG test clock |
| Broche 143 | TDO — JTAG test data out |
| Broche 144 | VCCIO4 — I/O bank 4 supply (also JTAG bank) |
Applications typiques
EP1C6T144C8AA convient pour 6 applications: Industrial Motor Control and Factory Automation, Video Image-Sensor Interface Bridging, Legacy Telecom Backplane and Bus Bridging, Low-Cost ASIC Prototyping, Consumer Display Controllers and LCD Adapters, Test and Measurement Front-End Logic.
Industrial Motor Control and Factory Automation
The EP1C6T144C8AA's 5,980 logic elements and two PLLs make it well-suited to industrial motor control front-ends, where the device performs PWM generation, encoder decoding, and field-oriented control glue logic. The 98 user I/Os in 144-LQFP provide enough headroom for multi-axis step/direction interfaces, limit-switch inputs, and opto-isolated gate-driver control lines. Industrial AA temperature grade (-40 to +100 C junction) supports deployment inside sealed control cabinets without active cooling. Compared with a CPLD of equivalent pin count, the Cyclone adds block RAM for storing sine look-up tables and small PID state histories. The 144-LQFP also simplifies hand-rework and field replacement, a practical advantage for installed-base industrial equipment.
Recommandé
Video Image-Sensor Interface Bridging
The EP1C6T144C8AA is frequently used as a bridge between parallel CMOS image sensors and downstream processors in industrial cameras, scanners, and machine-vision systems. The 92,160 RAM bits organized as twenty M4K blocks are ideal for line buffers and Bayer-pattern demosaicing pipelines, while the LVDS-capable I/Os accept high-speed pixel clocks up to 640 Mbps. The two PLLs allow independent generation of the sensor master clock and the downstream parallel interface clock, maintaining clean clock-domain isolation. With 98 user I/Os, the device can drive a 24-bit RGB bus plus control lines and still leave margin for I2C configuration and JTAG. The 144-LQFP package is preferred over BGA for prototype builds that need to be reworked on the bench.
Recommandé
Legacy Telecom Backplane and Bus Bridging
Telecom backplanes often require glue logic between asynchronous serial links (T1/E1, RS-485, SPI, I2C) and backplane fabrics such as H.110 or proprietary parallel buses. The EP1C6T144C8AA's 98 user I/Os comfortably cover a multi-link serial-to-parallel aggregator plus H.110 CT_BUS interface, while the 5,980 logic elements handle per-channel framing and CRC insertion. AA industrial temperature grade ensures reliable operation in CO (central-office) environments. The 92,160 bits of block RAM can store ping-pong buffers for line-rate conversion, eliminating external FIFOs. Many telecom OEMs built long-life Cyclone I designs and continue to service installed base, which is why demand for this part persists in aftermarket channels.
Recommandé
Low-Cost ASIC Prototyping
Designers routinely map mid-complexity ASICs onto the EP1C6T144C8AA for pre-silicon validation and firmware bring-up. The 5,980 logic elements, 92,160 RAM bits, and dual PLLs cover many sub-100K-gate ASIC RTL designs, while the SRAM-based configuration enables rapid design iteration via JTAG. Industrial temperature grade allows the prototype board to be deployed in the actual end-product environment for accelerated life testing. The 144-LQFP package is also cost-effective for prototype runs of a few hundred units. Quartus II 13.0sp1 supports incremental compilation and the SOPC Builder flow, enabling team-based prototyping of heterogeneous subsystems.
Recommandé
Consumer Display Controllers and LCD Adapters
The EP1C6T144C8AA is widely deployed as a low-cost display-format converter for legacy consumer electronics, medical monitors, and kiosk displays. Its LVDS-capable I/Os drive up to XGA resolution panels, while the block RAM provides line buffers for frame-rate conversion and scaling. Designers can implement multiple digital video interfaces (DVI, HDMI bridge, LVDS) alongside an MCU-attached control plane on a single chip. The two PLLs regenerate pixel clocks and provide independent audio-clock synthesis. Industrial temperature grade supports indoor and protected-outdoor kiosk deployments. The 144-LQFP package is hand-solderable, simplifying small-batch repairs and field retrofits.
Recommandé
Test and Measurement Front-End Logic
Bench-top and modular instruments frequently use the EP1C6T144C8AA as a flexible digital-front-end between sensors and a DSP or host CPU. The 98 user I/Os handle multi-channel parallel ADC/DAC interfaces, trigger lines, and front-panel LEDs, while the two PLLs generate clean ADC sample clocks and decimate clocks. Industrial temperature grade supports lab and light-industrial environments. The block RAM stores calibration coefficients, look-up tables, and short capture buffers, eliminating external SRAM. The 144-LQFP package is convenient for instrument firmware engineers who need direct access to JTAG and configuration pins during development and re-spin cycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C6T144C8AA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C6T144C8N | EP1C6T144C7N | EP1C6T144C6N | EP1C6T144I7N | EP1C6Q240C8N | EP1C6F256C8N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 240-PQFP - larger, not footprint-compatible | 256-FBGA - not footprint-compatible |
| Brand | Intel | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 5,980 | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical die) | 5,980 (identical die) |
| Total RAM Bits | 92,160 | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical die) | 92,160 (identical die) |
| User I/O Pins | 98 | 98 (identical) | 98 (identical) | 98 (identical) | 98 (identical) | 185 (more I/O, larger package) | 185 (more I/O, BGA package) |
| Speed Grade | 8 (slowest) | 8 (identical) | 7 (~12% Fmax improvement) | 6 (fastest Cyclone I bin, ~25% Fmax improvement) | 7 (industrial) | 8 (identical speed) | 8 (identical speed) |
| Temperature Grade | Industrial (-40 to +100 C junction) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| PLLs | 2 | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical die) | 2 (identical die) |
| Footprint-Compatibility with 144-LQFP | Yes (this part) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | No (different package) | No (BGA package) |
| Lifecycle Status (as of 2026-09-06) | Last-time-buy | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) |
Principaux différenciateurs
- Industrial temperature grade in a Cyclone I 144-LQFP (vs EP1C6T144C8N)
- Slower speed grade (8) with full industrial rating (vs EP1C6T144I7N)
- Drop-in compatible with all EP1C6T144 variants (vs EP1C3T144C8 / EP1C12Q240C8N)
Notes de conception
Estimated: at 25 °C ambient, full 98-I/O utilization, 100 MHz core clock, the EP1C6T144C8AA typically consumes 200-300 mA from VCCINT (1.5 V) plus per-bank VCCIO current. Estimated Icc_int = 250 mA, VCCINT power = 0.375 W. Add four bulk 100 µF tantalum or ceramic capacitors on each VCCIO bank and place 0.1 µF + 0.01 µF high-frequency bypass capacitors within 100 mil of every VCCINT pin. Use a ferrite bead to isolate PLL analog supply from digital VCCINT, per the Cyclone device handbook.
144-LQFP at 0.4 mm pitch requires 0.2 mm trace width and 0.2 mm clearance for fanout. Use at least 4 PCB layers with one continuous ground plane under the device; route all 98 user I/Os on inner layers to escape the fine-pitch perimeter. Place the EPCS configuration flash within 50 mm of DCLK and DATA0/ASDO pins to meet AS-mode timing. JTAG chain (TCK/TMS/TDO/TDI) must be kept short and daisy-chained with 4.7 kΩ pull-ups on TCK/TMS as recommended in the Cyclone handbook.
Cyclone I family is configured by a 1.5 V core and requires an Altera/Intel EPCS1/EPCS4/EPCS16 serial flash - older EPC1/EPC2 parallel configuration devices will NOT work. Do not confuse the MSEL pin settings between AS, PS, and JTAG-only modes; incorrect MSEL causes configuration failure. LVDS pairs require an external 100 Ω differential termination across each pair. Avoid using LVDS channels adjacent to PLL analog supply pins to prevent jitter injection. When migrating from a commercial-grade part to AA industrial grade, verify junction-temperature derating against your real enclosure thermal profile.
Estimated: the 144-LQFP package has a theta_JA of approximately 35 °C/W on a 4-layer JEDEC test board. At typical 0.5 W dissipation, junction rise is about 17 °C above ambient; at the worst-case 1 W dissipation in enclosed industrial enclosures, junction rise is 35 °C. Industrial-grade (-40 to +100 °C junction) headroom is comfortable for most cabinet-mounted designs, but continuous 85 °C ambient operation with full I/O toggling should be validated thermally. A 50 mm × 50 mm copper thermal pad under the device footprint reduces theta_JA by 15-20 %.
Informations de conformité
AA suffix indicates lead-free finish; part is RoHS and REACH compliant per Intel/Altera Cyclone family documentation. Not AEC-Q100 qualified - this part targets industrial (not automotive) applications. Original Cyclone I family is in last-time-buy; Intel recommends migration to Cyclone IV or Cyclone 10 LP for new designs.