EP1K10TC144-2N - 10K Gate ACEX-1K FPGA, 92 I/O, TQFP-144 | Intel / Altera
MPN: EP1K10TC144-2N ✗ Akhir HidupEP1K10TC144-2N Ringkasan
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the intersection of ASIC-like density and software-driven design flexibility, and are widely used for glue logic, protocol bridging, and parallel DSP pipelines in industrial, communications, and test equipment.
Key features include an embedded array block (EAB) architecture with 12 embedded array blocks implementing dual-port RAM, ROM, or multiplier functions; 72 logic array blocks (LABs) arranged across the die; built-in JTAG boundary-scan test circuitry compliant with IEEE 1149.1; and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL through dedicated I/O banks. Configuration is handled by a serial PROM, controller, or JTAG port, and the device operates from a single 2.5 V core supply with separate VCCIO rails for the I/O banks.
Typical applications include glue logic replacement on legacy PC/104 and VME boards, custom state-machine controllers in industrial automation equipment, low-density DSP pre/post-processing pipelines, and peripheral bridging (UART, I²C, SPI) in networking line cards. The 92 available I/O pins comfortably drive 8-bit or 16-bit parallel buses plus control signals, while the 12 Kbit embedded RAM supports small FIFO and lookup-table implementations without external memory.
Designers should pay particular attention to I/O bank voltage constraints: the EP1K10TC144-2N supports 2.5 V and 3.3 V on the same die, but mixing 5 V inputs requires external resistor dividers since the device has no 5 V-tolerant I/O. Quartus II design software (version 13.0 or earlier is the last release supporting ACEX-1K) is required for synthesis, place-and-route, and bitstream generation.
Alternatif penggantian untuk EP1K10TC144-2N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1K10TC144-2N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Configuration Method, Operating Temperature.
EP1K10TC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-2N Rating Maksimal & Karakteristik Listrik
| Family | ACEX-1K |
| Typical Gates | 10,000 |
| Logic Elements | 576 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 72 |
| User I/O Pins | 92 |
| Paket | TQFP-144 (TC) 22x22 mm, 0.5 mm pitch |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| Suhu Kerja | 0 C to +70 C (commercial) |
| Configuration Method | Serial / JTAG |
| JTAG Support | IEEE 1149.1 boundary scan |
| Tipe Mounting | Surface Mount |
Konfigurasi Pin EP1K10TC144-2N
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | GND — Ground |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | I/O — User I/O pin (bank 2) |
| Pin produk 12 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 13 | I/O — User I/O pin (bank 2) |
| Pin produk 14 | GND — Ground |
| Pin produk 15 | I/O — User I/O pin (bank 2) |
| Pin produk 16 | I/O — User I/O pin (bank 2) |
| Pin produk 17 | I/O — User I/O pin (bank 2) |
| Pin produk 18 | I/O — User I/O pin (bank 2) |
| Pin produk 19 | I/O — User I/O pin (bank 2) |
| Pin produk 20 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 21 | I/O — User I/O pin (bank 2) |
| Pin produk 22 | I/O — User I/O pin (bank 2) |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | I/O — User I/O pin (bank 2) |
| Pin produk 25 | I/O — User I/O pin (bank 2) |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | I/O — User I/O pin (bank 2) |
| Pin produk 28 | I/O — User I/O pin (bank 2) |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 31 | GND — Ground |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | I/O — User I/O pin (bank 3) |
| Pin produk 35 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 36 | I/O — User I/O pin (bank 3) |
| Pin produk 37 | I/O — User I/O pin (bank 3) |
| Pin produk 38 | GND — Ground |
| Pin produk 39 | I/O — User I/O pin (bank 3) |
| Pin produk 40 | I/O — User I/O pin (bank 3) |
| Pin produk 41 | I/O — User I/O pin (bank 3) |
| Pin produk 42 | I/O — User I/O pin (bank 3) |
| Pin produk 43 | I/O — User I/O pin (bank 3) |
| Pin produk 44 | I/O — User I/O pin (bank 3) |
| Pin produk 45 | I/O — User I/O pin (bank 3) |
| Pin produk 46 | I/O — User I/O pin (bank 3) |
| Pin produk 47 | I/O — User I/O pin (bank 3) |
| Pin produk 48 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 49 | I/O — User I/O pin (bank 3) |
| Pin produk 50 | I/O — User I/O pin (bank 3) |
| Pin produk 51 | I/O — User I/O pin (bank 3) |
| Pin produk 52 | I/O — User I/O pin (bank 3) |
| Pin produk 53 | I/O — User I/O pin (bank 3) |
| Pin produk 54 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 55 | GND — Ground |
| Pin produk 56 | I/O — User I/O pin (bank 3) |
| Pin produk 57 | I/O — User I/O pin (bank 3) |
| Pin produk 58 | I/O — User I/O pin (bank 4) |
| Pin produk 59 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 60 | I/O — User I/O pin (bank 4) |
| Pin produk 61 | I/O — User I/O pin (bank 4) |
| Pin produk 62 | GND — Ground |
| Pin produk 63 | I/O — User I/O pin (bank 4) |
| Pin produk 64 | I/O — User I/O pin (bank 4) |
| Pin produk 65 | I/O — User I/O pin (bank 4) |
| Pin produk 66 | I/O — User I/O pin (bank 4) |
| Pin produk 67 | I/O — User I/O pin (bank 4) |
| Pin produk 68 | I/O — User I/O pin (bank 4) |
| Pin produk 69 | I/O — User I/O pin (bank 4) |
| Pin produk 70 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 71 | I/O — User I/O pin (bank 4) |
| Pin produk 72 | I/O — User I/O pin (bank 4) |
| Pin produk 73 | I/O — User I/O pin (bank 4) |
| Pin produk 74 | I/O — User I/O pin (bank 4) |
| Pin produk 75 | I/O — User I/O pin (bank 4) |
| Pin produk 76 | I/O — User I/O pin (bank 4) |
| Pin produk 77 | I/O — User I/O pin (bank 4) |
| Pin produk 78 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 79 | GND — Ground |
| Pin produk 80 | I/O — User I/O pin (bank 4) |
| Pin produk 81 | I/O — User I/O pin (bank 1) |
| Pin produk 82 | I/O — User I/O pin (bank 1) |
| Pin produk 83 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 84 | I/O — User I/O pin (bank 1) |
| Pin produk 85 | I/O — User I/O pin (bank 1) |
| Pin produk 86 | GND — Ground |
| Pin produk 87 | I/O — User I/O pin (bank 1) |
| Pin produk 88 | I/O — User I/O pin (bank 1) |
| Pin produk 89 | I/O — User I/O pin (bank 1) |
| Pin produk 90 | I/O — User I/O pin (bank 1) |
| Pin produk 91 | I/O — User I/O pin (bank 1) |
| Pin produk 92 | I/O — User I/O pin (bank 1) |
| Pin produk 93 | I/O — User I/O pin (bank 1) |
| Pin produk 94 | I/O — User I/O pin (bank 1) |
| Pin produk 95 | I/O — User I/O pin (bank 1) |
| Pin produk 96 | I/O — User I/O pin (bank 1) |
| Pin produk 97 | I/O — User I/O pin (bank 1) |
| Pin produk 98 | I/O — User I/O pin (bank 1) |
| Pin produk 99 | I/O — User I/O pin (bank 1) |
| Pin produk 100 | I/O — User I/O pin (bank 1) |
| Pin produk 101 | I/O — User I/O pin (bank 1) |
| Pin produk 102 | I/O — User I/O pin (bank 1) |
| Pin produk 103 | I/O — User I/O pin (bank 1) |
| Pin produk 104 | I/O — User I/O pin (bank 1) |
| Pin produk 105 | I/O — User I/O pin (bank 1) |
| Pin produk 106 | I/O — User I/O pin (bank 1) |
| Pin produk 107 | I/O — User I/O pin (bank 1) |
| Pin produk 108 | I/O — User I/O pin (bank 1) |
| Pin produk 109 | I/O — User I/O pin (bank 1) |
| Pin produk 110 | I/O — User I/O pin (bank 1) |
| Pin produk 111 | I/O — User I/O pin (bank 1) |
| Pin produk 112 | I/O — User I/O pin (bank 1) |
| Pin produk 113 | I/O — User I/O pin (bank 1) |
| Pin produk 114 | I/O — User I/O pin (bank 1) |
| Pin produk 115 | I/O — User I/O pin (bank 1) |
| Pin produk 116 | I/O — User I/O pin (bank 1) |
| Pin produk 117 | I/O — User I/O pin (bank 1) |
| Pin produk 118 | I/O — User I/O pin (bank 1) |
| Pin produk 119 | I/O — User I/O pin (bank 1) |
| Pin produk 120 | I/O — User I/O pin (bank 1) |
| Pin produk 121 | I/O — User I/O pin (bank 1) |
| Pin produk 122 | I/O — User I/O pin (bank 1) |
| Pin produk 123 | I/O — User I/O pin (bank 1) |
| Pin produk 124 | TDI — JTAG test data input |
| Pin produk 125 | TMS — JTAG test mode select |
| Pin produk 126 | TCK — JTAG test clock |
| Pin produk 127 | TDO — JTAG test data output |
| Pin produk 128 | nSTATUS — Configuration status (open-drain) |
| Pin produk 129 | nCONFIG — Configuration control (active-low) |
| Pin produk 130 | DCLK — Configuration clock input |
| Pin produk 131 | DATA0 — Configuration data input |
| Pin produk 132 | CONF_DONE — Configuration complete (open-drain) |
| Pin produk 133 | MSEL0 — Configuration mode select 0 |
| Pin produk 134 | MSEL1 — Configuration mode select 1 |
| Pin produk 135 | I/O — User I/O pin (bank 1) |
| Pin produk 136 | I/O — User I/O pin (bank 1) |
| Pin produk 137 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 138 | I/O — User I/O pin (bank 1) |
| Pin produk 139 | I/O — User I/O pin (bank 1) |
| Pin produk 140 | GND — Ground |
| Pin produk 141 | I/O — User I/O pin (bank 1) |
| Pin produk 142 | I/O — User I/O pin (bank 1) |
| Pin produk 143 | I/O — User I/O pin (bank 1) |
| Pin produk 144 | I/O — User I/O pin (bank 1) |
Aplikasi Umum
EP1K10TC144-2N cocok untuk 6 aplikasis: Industrial Glue Logic Replacement, Legacy Peripheral Bridging, Low-Density DSP Pre/Post-Processing, Custom State Machine Controllers, Telecom Line Card Glue Logic, Military & Aerospace Legacy Systems.
Industrial Glue Logic Replacement
The EP1K10TC144-2N replaces multiple 74-series TTL and CMOS glue-logic ICs on legacy industrial controllers with a single programmable device, reducing board area and assembly cost. Its 576 logic elements and 12,288 bits of embedded RAM comfortably accommodate typical state machines, address decoders, and timing generators used in PLC backplanes and motor-control boards. The 92 user I/O pins and four independently supplied VCCIO banks allow direct interfacing with 3.3 V and 2.5 V peripherals on the same PCB. Designers benefit from Quartus II synthesis, which preserves schematic capture from MAX+PLUS II designs, easing migration of proven legacy logic.
Direkomendasikan
Legacy Peripheral Bridging
The EP1K10TC144-2N acts as a custom bridge between mismatched peripherals such as UART, I²C, SPI, and parallel buses in industrial PCs and test equipment. Each of the 12 embedded array blocks can be configured as dual-port RAM, ROM, or a small multiplier, supporting protocol-conversion FIFOs without external memory. The 2.5 V core and JTAG-based in-system programming enable field updates through the standard IEEE 1149.1 test access port. Designers targeting legacy PC/104 and VMEbus cards can leverage the abundant I/O count and IEEE 1149.1 boundary-scan testability to replace discrete bridge ASICs.
Direkomendasikan
Low-Density DSP Pre/Post-Processing
The EP1K10TC144-2N implements small DSP functions such as digital filters, FFT pre-processors, and CRC engines alongside an external DSP or microcontroller in cost-sensitive test and measurement equipment. The 12 embedded array blocks each support dedicated multiplier modes, allowing 8-bit or 12-bit multiply-accumulate (MAC) operations at system clock rates up to 50 MHz. While the 10K-gate density is modest by modern standards, it provides just enough logic for sensor conditioning and signal conditioning pipelines in portable instrumentation. Designers pair the FPGA with an external ADC/DAC for complete analog signal chains.
Direkomendasikan
Custom State Machine Controllers
The EP1K10TC144-2N excels as a custom state-machine controller for industrial automation, robotics, and material-handling equipment where deterministic sequencing and reliable I/O control are essential. The 576 logic elements and 72 logic array blocks map cleanly onto multi-state FSMs with parallel datapath logic, while 92 user I/O pins comfortably drive sensor inputs, actuator relays, and HMI display interfaces. JTAG boundary-scan testability simplifies board-level debugging and in-field firmware updates through the standard test access port. Designers value the predictable timing closure achievable with Quartus II timing analysis for safety-critical sequencing.
Direkomendasikan
Telecom Line Card Glue Logic
The EP1K10TC144-2N serves as glue logic on telecom line cards, replacing discrete bus-isolation, address-decoding, and interrupt-routing ICs around network processors and framer ASICs. The 12,288 bits of embedded RAM support small lookup tables used for header processing and routing decisions at line-card speeds. Four I/O banks allow direct 3.3 V interfacing to PHY chips and 2.5 V connections to the network processor, eliminating external level shifters. Designers benefit from low-cost legacy parts availability for long-lifecycle telecom infrastructure where reliability trumps performance.
Direkomendasikan
Military & Aerospace Legacy Systems
The EP1K10TC144-2N continues to serve in long-lifecycle military, aerospace, and avionics platforms designed around ACEX-1K silicon in the late 1990s. While not radiation-hardened by modern standards, the commercial-grade device is qualified by many programs through up-screening processes and remains in service on legacy avionic displays, flight data recorders, and ground-test equipment. The 144-pin TQFP package is well-suited to high-vibration environments where fine-pitch BGAs are not desirable. Designers performing obsolescence management rely on factory-surplus and authorized-stock distributors for ongoing support.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1K10TC144-2N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1K10TC144-1N | EP1K10TC144-3N | EP1K10TC144-1 | EP1K10TC144-2 |
|---|---|---|---|---|---|
| Package | TQFP-144 (TC) 22x22 mm | TQFP-144 (TC) - same | TQFP-144 (TC) - same | TQFP-144 (TC) - same | TQFP-144 (TC) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 |
| Speed Grade | -2 | -1 (faster) | -3 (slower) | -1 (faster) | -2 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Balanced speed grade -2 with industry-standard TQFP-144 footprint (vsEP1K10TC144-1N)
- TQFP-144 is hand-solderable and field-rework friendly (vsEP1K10FC256-2N (FBGA-256))
- Mature ACEX-1K architecture with extensive Quartus II legacy support (vsCyclone EP1C3T144C8N)
- On-site authentication and traceability through authorized distributors (vsGrey-market EP1K10TC144-2N lots)
Catatan Desain
The EP1K10TC144-2N requires a clean 2.5 V VCCINT rail for the core plus separate VCCIO supplies (2.5 V or 3.3 V) for each of the four I/O banks. Decouple each VCCINT and VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 µF tantalum capacitor near the FPGA supply entry point. Avoid routing high-frequency switching signals directly across the VCCINT plane to minimize core supply noise.
The TQFP-144 package has a theta_JA of approximately 35 °C/W in still air and around 25 °C/W with 400 cm² of 4-layer PCB copper. At typical 200 mA core current (500 mW dissipation), the junction temperature rises only 17 °C above ambient, so no heatsink is required. Estimated: assumed 4-layer JEDEC-standard test board and natural convection. Designers targeting sealed enclosures should add thermal vias beneath the package to the internal ground plane.
TQFP-144 with 0.5 mm pitch demands strict PCB layout discipline: trace width 0.15 mm minimum, via 0.3 mm drill, and a continuous ground plane beneath the package. Route all 92 user I/O signals on outer layers only and avoid stubs longer than 5 mm. Keep JTAG signals (TDI/TMS/TCK/TDO) bundled together and isolated from high-speed switching I/O. Solder paste stencil aperture should be 1:1 to land pad with 0.1 mm relief for fine-pitch 0.5 mm QFP packages.
Do not apply 5 V signals directly to the EP1K10TC144-2N user I/O pins because the device lacks 5 V-tolerant inputs; damage will result. Use external resistor dividers or level shifters (such as 74LVC245) for any 5 V source. Also ensure the nCONFIG and MSEL pins are correctly strapped for the desired configuration mode (e.g., MSEL=00 for passive serial). Configuration failures are most often caused by incorrect MSEL settings rather than silicon defects.
Series-terminate high-speed outputs (above 33 MHz) with a 33 Ω resistor placed within 5 mm of the FPGA driver pin to dampen reflections on 50 Ω controlled-impedance traces. For LVTTL outputs driving long capacitive loads, slew-rate adjustment via Quartus II settings reduces EMI. The four I/O banks must each have its VCCIO plane decoupled locally; mixing VCCIO voltages on a single bank is not supported and causes latch-up risk.
Informasi Konformitas
RoHS status is not stated in the verified web data; the ACEX-1K family predates widespread RoHS adoption. Mark compliance fields as 'unknown' until factory documentation can be reviewed.