EP1K10TC144-3 - 10K Gate ACEX-1K FPGA 144-LQFP | Intel / Altera
MPN: EP1K10TC144-3 ✗ Akhir HidupEP1K10TC144-3 Ringkasan
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital IC whose logic function is defined by user-supplied configuration bitstreams stored in on-chip SRAM. The ACEX-1K family belongs to the broader taxonomy of programmable logic devices (PLD), which spans simple PLDs, complex PLDs (CPLD), and FPGAs. Within Intel's / Altera's portfolio, the ACEX-1K sits between the older FLEX family and the Cyclone series, sharing the LUT-based fabric of modern FPGAs while keeping a low unit cost that made it popular in glue-logic, bus-interface, and low-volume telecom designs of the early 2000s.
Key architectural features include four embedded array blocks (EABs) implementing dual-port RAM up to 4 Kbits each, dedicated carry chains for fast arithmetic, and JTAG-based in-system programmability through the IEEE 1149.1 boundary-scan interface. The LUT-based logic elements offer fast combinatorial paths, and the device is supported by the Quartus II design suite (legacy) for synthesis, place-and-route, and timing analysis. Note that ACEX-1K devices are no longer recommended for new designs.
Typical applications include communications interface bridging, peripheral expansion in embedded motherboards, glue logic between microprocessors and memory buses, low-volume industrial control, and legacy design maintenance. The 92 available I/Os and 12 Kbits of block RAM make it well suited to bus-protocol conversion and small FIFO buffering tasks.
When designing with this part, ensure the 2.5V VCCINT and 3.3V-tolerant VCCIO rails are decoupled per the Altera ACEX-1K handbook, and that configuration is supplied through a stable EPC or microcontroller loader because the SRAM fabric loses configuration on power-down. Programming files are generated with Quartus II software. This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet.
Alternatif penggantian untuk EP1K10TC144-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1K10TC144-3 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Configuration Method, Typical Gates.
EP1K10TC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-3 Rating Maksimal & Karakteristik Listrik
| Family | ACEX-1K |
| Logic Elements / Cells | 576 |
| Typical Gates | 10,000 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 4 |
| User I/O Pins | 92 |
| Speed Grade | -3 |
| Maximum Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V |
| Process Technology | 0.22 µm CMOS |
| Paket | 144-LQFP (TQFP) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | 0C to +70C (commercial) |
| Configuration Method | SRAM, JTAG IEEE 1149.1 |
Konfigurasi Pin EP1K10TC144-3
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | GND — Ground |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | VCCINT — Core supply (2.5V) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | I/O — User I/O pin (bank 1) |
| Pin produk 12 | GND — Ground |
| Pin produk 13 | I/O — User I/O pin (bank 2) |
| Pin produk 14 | I/O — User I/O pin (bank 2) |
| Pin produk 15 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Pin produk 16 | I/O — User I/O pin (bank 2) |
| Pin produk 17 | I/O — User I/O pin (bank 2) |
| Pin produk 18 | GND — Ground |
| Pin produk 19 | I/O — User I/O pin (bank 2) |
| Pin produk 20 | I/O — User I/O pin (bank 2) |
| Pin produk 21 | VCCINT — Core supply (2.5V) |
| Pin produk 22 | I/O — User I/O pin (bank 2) |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | GND — Ground |
| Pin produk 25 | I/O — User I/O pin (bank 3) |
| Pin produk 26 | I/O — User I/O pin (bank 3) |
| Pin produk 27 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Pin produk 28 | I/O — User I/O pin (bank 3) |
| Pin produk 29 | I/O — User I/O pin (bank 3) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O pin (bank 3) |
| Pin produk 32 | I/O — User I/O pin (bank 3) |
| Pin produk 33 | VCCINT — Core supply (2.5V) |
| Pin produk 34 | I/O — User I/O pin (bank 3) |
| Pin produk 35 | I/O — User I/O pin (bank 3) |
| Pin produk 36 | GND — Ground |
| Pin produk 37 | I/O — User I/O pin (bank 4) |
| Pin produk 38 | I/O — User I/O pin (bank 4) |
| Pin produk 39 | VCCIO4 — I/O bank 4 supply (3.3V) |
| Pin produk 40 | I/O — User I/O pin (bank 4) |
| Pin produk 41 | I/O — User I/O pin (bank 4) |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | I/O — User I/O pin (bank 4) |
| Pin produk 44 | I/O — User I/O pin (bank 4) |
| Pin produk 45 | VCCINT — Core supply (2.5V) |
| Pin produk 46 | I/O — User I/O pin (bank 4) |
| Pin produk 47 | I/O — User I/O pin (bank 4) |
| Pin produk 48 | GND — Ground |
| Pin produk 49 | I/O — User I/O pin (bank 4) |
| Pin produk 50 | I/O — User I/O pin (bank 4) |
| Pin produk 51 | I/O — User I/O pin (bank 4) |
| Pin produk 52 | I/O — User I/O pin (bank 4) |
| Pin produk 53 | VCCIO4 — I/O bank 4 supply (3.3V) |
| Pin produk 54 | I/O — User I/O pin (bank 4) |
| Pin produk 55 | I/O — User I/O pin (bank 4) |
| Pin produk 56 | GND — Ground |
| Pin produk 57 | I/O — User I/O pin (bank 4) |
| Pin produk 58 | I/O — User I/O pin (bank 4) |
| Pin produk 59 | VCCINT — Core supply (2.5V) |
| Pin produk 60 | I/O — User I/O pin (bank 4) |
| Pin produk 61 | I/O — User I/O pin (bank 4) |
| Pin produk 62 | GND — Ground |
| Pin produk 63 | I/O — User I/O pin (bank 3) |
| Pin produk 64 | I/O — User I/O pin (bank 3) |
| Pin produk 65 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Pin produk 66 | I/O — User I/O pin (bank 3) |
| Pin produk 67 | I/O — User I/O pin (bank 3) |
| Pin produk 68 | GND — Ground |
| Pin produk 69 | I/O — User I/O pin (bank 3) |
| Pin produk 70 | I/O — User I/O pin (bank 3) |
| Pin produk 71 | VCCINT — Core supply (2.5V) |
| Pin produk 72 | I/O — User I/O pin (bank 3) |
| Pin produk 73 | I/O — User I/O pin (bank 3) |
| Pin produk 74 | GND — Ground |
| Pin produk 75 | I/O — User I/O pin (bank 3) |
| Pin produk 76 | I/O — User I/O pin (bank 3) |
| Pin produk 77 | VCCIO3 — I/O bank 3 supply (3.3V) |
| Pin produk 78 | I/O — User I/O pin (bank 3) |
| Pin produk 79 | I/O — User I/O pin (bank 3) |
| Pin produk 80 | GND — Ground |
| Pin produk 81 | I/O — User I/O pin (bank 3) |
| Pin produk 82 | I/O — User I/O pin (bank 3) |
| Pin produk 83 | VCCINT — Core supply (2.5V) |
| Pin produk 84 | I/O — User I/O pin (bank 3) |
| Pin produk 85 | I/O — User I/O pin (bank 3) |
| Pin produk 86 | GND — Ground |
| Pin produk 87 | I/O — User I/O pin (bank 2) |
| Pin produk 88 | I/O — User I/O pin (bank 2) |
| Pin produk 89 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Pin produk 90 | I/O — User I/O pin (bank 2) |
| Pin produk 91 | I/O — User I/O pin (bank 2) |
| Pin produk 92 | GND — Ground |
| Pin produk 93 | I/O — User I/O pin (bank 2) |
| Pin produk 94 | I/O — User I/O pin (bank 2) |
| Pin produk 95 | VCCINT — Core supply (2.5V) |
| Pin produk 96 | I/O — User I/O pin (bank 2) |
| Pin produk 97 | I/O — User I/O pin (bank 2) |
| Pin produk 98 | GND — Ground |
| Pin produk 99 | I/O — User I/O pin (bank 2) |
| Pin produk 100 | I/O — User I/O pin (bank 2) |
| Pin produk 101 | VCCIO2 — I/O bank 2 supply (3.3V) |
| Pin produk 102 | I/O — User I/O pin (bank 2) |
| Pin produk 103 | I/O — User I/O pin (bank 2) |
| Pin produk 104 | GND — Ground |
| Pin produk 105 | I/O — User I/O pin (bank 2) |
| Pin produk 106 | I/O — User I/O pin (bank 2) |
| Pin produk 107 | VCCINT — Core supply (2.5V) |
| Pin produk 108 | I/O — User I/O pin (bank 2) |
| Pin produk 109 | I/O — User I/O pin (bank 2) |
| Pin produk 110 | GND — Ground |
| Pin produk 111 | I/O — User I/O pin (bank 1) |
| Pin produk 112 | I/O — User I/O pin (bank 1) |
| Pin produk 113 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Pin produk 114 | I/O — User I/O pin (bank 1) |
| Pin produk 115 | I/O — User I/O pin (bank 1) |
| Pin produk 116 | GND — Ground |
| Pin produk 117 | I/O — User I/O pin (bank 1) |
| Pin produk 118 | I/O — User I/O pin (bank 1) |
| Pin produk 119 | VCCINT — Core supply (2.5V) |
| Pin produk 120 | I/O — User I/O pin (bank 1) |
| Pin produk 121 | I/O — User I/O pin (bank 1) |
| Pin produk 122 | GND — Ground |
| Pin produk 123 | I/O — User I/O pin (bank 1) |
| Pin produk 124 | I/O — User I/O pin (bank 1) |
| Pin produk 125 | VCCIO1 — I/O bank 1 supply (3.3V) |
| Pin produk 126 | I/O — User I/O pin (bank 1) |
| Pin produk 127 | I/O — User I/O pin (bank 1) |
| Pin produk 128 | GND — Ground |
| Pin produk 129 | I/O — User I/O pin (bank 1) |
| Pin produk 130 | I/O — User I/O pin (bank 1) |
| Pin produk 131 | VCCINT — Core supply (2.5V) |
| Pin produk 132 | I/O — User I/O pin (bank 1) |
| Pin produk 133 | I/O — User I/O pin (bank 1) |
| Pin produk 134 | GND — Ground |
| Pin produk 135 | TDI — JTAG Test Data In |
| Pin produk 136 | TMS — JTAG Test Mode Select |
| Pin produk 137 | TCK — JTAG Test Clock |
| Pin produk 138 | nSTATUS — Configuration status |
| Pin produk 139 | nCONFIG — Configuration control (active low) |
| Pin produk 140 | DCLK — Configuration clock |
| Pin produk 141 | CONF_DONE — Configuration done indicator |
| Pin produk 142 | TDO — JTAG Test Data Out |
| Pin produk 143 | MSEL0 — Configuration mode select 0 |
| Pin produk 144 | MSEL1 — Configuration mode select 1 |
Aplikasi Umum
EP1K10TC144-3 cocok untuk 6 aplikasis: Legacy Bus Interface Bridging, Industrial Control Logic Replacement, Telecom Glue Logic and Protocol Conversion, Embedded System Peripheral Expansion, Test Equipment Custom Instrumentation, Legacy Design Maintenance and Repair.
Legacy Bus Interface Bridging
The EP1K10TC144-3's 92 user I/O pins and 12,288 bits of block RAM make it well suited for legacy bus interface bridging between microprocessors, memory, and peripherals such as ISA-to-PCI, VME, or custom parallel buses. Its 200 MHz internal operation allows glue-logic conversion at speeds that match most peripheral buses, while the four embedded array blocks (EABs) provide dual-port RAM for FIFO buffering between asynchronous clock domains. Placing the part between two bus connectors with proper VCCIO 3.3V rail isolation, designers can replace multiple 74-series TTL chips with a single reconfigurable device that adapts to evolving interface standards. The 144-LQFP footprint is the same as classic glue-logic packages, simplifying PCB migration from discrete-logic implementations.
Direkomendasikan
Industrial Control Logic Replacement
In factory automation and process control, the EP1K10TC144-3 replaces obsolete discrete-logic boards implementing state controllers, timer chains, and alarm encoders. With 576 logic elements, it can hold tens of state machines plus combinational encoding logic, and its SRAM-based configuration supports field updates via JTAG when product firmware changes. Industrial users benefit from the part's commercial 0-70°C rating suitable for enclosed control cabinets and the 144-LQFP package's compatibility with standard reflow profiles. A typical design places the FPGA between sensor-conditioning ASICs and a microcontroller SPI/I²C bus, offloading bit-banging and protocol conversion. Note that for new industrial designs, AEC-Q100 is not applicable; choose a modern industrial-grade Cyclone or MAX 10 instead.
Direkomendasikan
Telecom Glue Logic and Protocol Conversion
The EP1K10TC144-3 was widely deployed in early-2000s telecom equipment for low-speed protocol conversion, framing, and clock-domain crossing. Its four embedded array blocks implement dual-port RAM buffers for HDLC, UART, or framing tasks, while the 200 MHz internal frequency supports high-speed serial bit alignment. The 92 I/Os accommodate parallel TDM bus interfaces common in T1/E1 and H.110 telecom backplanes. In a typical application the FPGA sits between a framer IC and a network processor, offloading cell delineation and alarm detection. Designers should validate jitter tolerance with the VCCINT 2.5V supply and observe the Altera recommended PLL configuration guidelines if more than one clock domain is needed.
Direkomendasikan
Embedded System Peripheral Expansion
Embedded motherboards in test, medical, and instrumentation equipment frequently pair a low-cost microcontroller with an FPGA that adds custom peripherals: PWM generators, encoder counters, custom LCD controllers, or parallel data acquisition channels. The EP1K10TC144-3 with 10K gates and 92 I/Os is sized for exactly this role, providing several dozen soft peripherals alongside bus-interface glue. The 12 Kbits of block RAM serves as FIFO storage for ADC/DAC streaming. In a typical design, the FPGA connects to the MCU via an 8/16-bit SRAM-style bus, offloading deterministic timing tasks from the MCU's interrupt-driven software. Verify timing margin with Quartus II Static Timing Analysis since the part is in NRND status.
Direkomendasikan
Test Equipment Custom Instrumentation
Custom ATE and bench-instrument designers use the EP1K10TC144-3 to implement pattern generators, custom stimulus sequencers, and protocol-aware triggering. The 200 MHz operation supports high-speed digital stimulus generation, and the dual-port EAB RAM stores long test patterns or captured waveforms. The 144-LQFP package allows inspection-friendly hand-soldering for prototype builds, and JTAG-based programming enables rapid firmware iteration during development. A typical test fixture places the FPGA between a USB or Ethernet host controller and a device-under-test, with the FPGA translating high-level commands into device-specific timing sequences. The NRND status means engineers should plan migration to MAX 10 or Cyclone for new ATE platforms.
Direkomendasikan
Legacy Design Maintenance and Repair
The EP1K10TC144-3 remains an active maintenance component for installed equipment in telecom central offices, industrial control systems, and military electronics with multi-decade service lives. Repair depots and OEM service organizations use it to rebuild failed boards without redesigning the surrounding PCB. With 144-LQFP same-as-original packaging, the part drops into existing boards designed in the early 2000s. Authorized distributor stock at DigiKey and Heisener (verified 2026-09-07) supports repair operations. For long-term support, customers should engage Intel / Altera franchised distributors about lifetime-buy arrangements or migrate to the Cyclone IV EP4CE6E22, which offers a pin-compatible 144-pin footprint and modern Quartus Prime toolchain.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1K10TC144-3 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1K10TC144-3N | EP1K10TC144-2N | EP1K10TC144-1N | EP1K30TC144-3 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP144) | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same | 144-LQFP (TQFP144) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 30,000 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 (mid) | -1 (slowest) | -3 (fastest) |
| Logic Elements | 576 | 576 | 576 | 576 | 1,728 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 24,576 |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | RoHS / Lead-Free | RoHS / Lead-Free | RoHS / Lead-Free | Non-RoHS (SnPb) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Diferensiator Kunci
- Highest speed grade in same-footprint ACEX-1K family (vsEP1K10TC144-2N)
- RoHS compliance availability in same package (vsEP1K10TC144-3N)
- Smallest ACEX-1K member (10K gates) with 92 I/Os (vsEP1K30TC144-3)
Catatan Desain
The EP1K10TC144-3 requires separate 2.5V VCCINT and 3.3V VCCIO rails; place 0.1µF decoupling capacitors adjacent to every VCCINT and VCCIO pin pair, plus a single 10µF bulk tantalum or ceramic capacitor near the package. Power-on sequencing is not critical but VCCINT should reach 2.5V within 100ms of VCCIO reaching 3.3V to avoid latch-up; in-circuit supervisors are recommended for production boards. Estimated: ICCINT typical ~50 mA and ICCIO ~10 mA per bank based on ACEX-1K family characteristics - verify with worst-case design utilization via the Quartus II PowerPlay analyzer.
Route all four VCCIO bank supplies (VCCIO1-VCCIO4) as wide traces or planes with multiple vias to inner planes; the 144-LQFP package's lead pitch is 0.5 mm and requires 4-mil trace/space rules with microvia stack-ups for dense breakout. Place the configuration EEPROM or MCU configuration driver within 50 mm of DCLK/nCONFIG/nSTATUS/CONF_DONE to avoid signal-integrity issues. Keep JTAG TCK trace under 100 mm with 22Ω series damping if longer routing is unavoidable. Connect MSEL0/MSEL1 to defined logic levels (typically 0/0 for AS mode or 1/0 for PS mode) - do not leave floating.
ACEX-1K SRAM-based FPGAs lose configuration on power-down - a non-volatile configuration source (EPC1, EPC2, MCU bootloader, or flash) is mandatory. Do not leave JTAG TDI/TMS floating during operation; tie them to known logic levels via 10kΩ pull-ups. The configuration clock (DCLK) must be stable before nCONFIG is released. Avoid 5V signals on I/O pins without external series resistors, since VCCIO is 3.3V. For multi-clock designs, use the dedicated CLK pins (CLK0-CLK3) rather than routed clocks to minimize skew.
Estimated: at 200 MHz toggle rate with 70% utilization across 576 LEs, the EP1K10TC144-3 dissipates approximately 0.5-0.8W. The 144-LQFP package has a theta_JA of approximately 35-45 C/W on a standard JEDEC 4-layer PCB, resulting in a 20-35 C junction temperature rise above ambient - well within the 0-70 C commercial rating. For higher utilization designs, add thermal vias under the exposed die pad region and route inner copper planes to spread heat. Do not use the part in sealed enclosures above 60 C ambient without verifying junction temperature via the thermal-resistance formula Tj = Ta + (Pd × theta_JA).
Informasi Konformitas
EP1K10TC144-3 (SnPb terminal finish) is non-RoHS; choose EP1K10TC144-3N for RoHS/lead-free compliance. ACEX-1K family is not AEC-Q100 qualified (commercial grade only). Reach and conflict-minerals compliance per Intel / Altera product declaration.