EP1K50TC144-2 - 50K Gate ACEX-1K FPGA, 144-TQFP | Intel / Altera
MPN: EP1K50TC144-2 ✗ Akhir HidupEP1K50TC144-2 Ringkasan
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic, glue logic, state machines, bus interfaces, and soft processor cores after PCB fabrication. Within the broader semiconductor hierarchy, FPGAs sit above ASICs and microcontrollers in design flexibility but below them in per-unit cost and static power. The ACEX-1K family belongs to Altera's low-cost SRAM-based FPGA lineage, predating the Cyclone series and offering embedded dual-port RAM blocks, a 2.5 V core supply, and a 0.22 µm CMOS process that targets glue logic, communication bridges, and low-volume ASIC prototyping.
Key features of the EP1K50TC144-2 include 49,152 bits of embedded RAM distributed across EABs, multi-voltage I/O support via selectable bank standards, in-system programmability through the IEEE 1149.1 JTAG interface and Altera EPC configuration devices, and a maximum internal toggle frequency around 200 MHz. The 144-pin TQFP body provides manageable board-level assembly using conventional SMT lines without requiring fine-pitch BGA reballing, easing low-to-medium volume production and bench prototyping.
The architecture combines a continuous interconnect network with LAB-based logic, EAB-based memory, and dedicated I/O element (IOE) cells with slew-rate and drive-strength control. Each LAB contains ten logic elements (LEs), and each LE embeds a 4-input LUT plus a programmable register, enabling efficient mapping of wide combinational paths and pipelined datapaths. The 2.5 V core and I/O bank supplies allow interfacing with 3.3 V peripherals through level-shifting I/O standards.
Typical applications include industrial control and glue logic replacement, communication protocol bridges (UART, SPI, I2C), low-volume ASIC prototyping, educational and lab development boards, parallel-to-serial converters, and simple peripheral controllers. Designers also target the EP1K50TC144-2 for legacy system upgrades where existing ACEX-1K designs are being re-spun or migrated to a long-lifecycle pin-compatible footprint.
When designing with this part, note that the ACEX-1K family is mature, and Intel has transitioned new designs to the Cyclone and MAX families. Designers should verify long-term availability through franchised distributors and confirm that legacy Quartus II (or MAX+PLUS II) toolchains support the chosen speed grade. JTAG programming with EPC configuration devices is the standard in-system configuration path.
This page synthesizes franchised distributor pricing (DigiKey, Mouser, Octopart), drop-in same-package alternatives from the EP1K50 family, and practical design notes not consolidated in the original ACEX-1K datasheet family document.
Alternatif penggantian untuk EP1K50TC144-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1K50TC144-2 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Family, Configuration Method.
EP1K50TC144-1N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TC144-1
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TC144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TC144-2 Rating Maksimal & Karakteristik Listrik
| Family | ACEX-1K |
| Typical Gates | 50,000 |
| System Gates | 40,960 |
| Logic Elements | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded RAM Bits | 49,152 |
| User I/O Pins | 102 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Paket | 144-pin TQFP (TC144) |
| Tipe Mounting | Surface Mount |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -2 (commercial) |
| Suhu Kerja | Commercial (0C to +70C) |
| Configuration Interface | JTAG (IEEE 1149.1) + EPC device |
| Status RoHS | Compliant (verify per lot) |
Konfigurasi Pin EP1K50TC144-2
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | VCCINT — Core supply 2.5 V |
| Pin produk 6 | GND — Ground |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | VCCIO — I/O bank 1 supply |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | I/O — User I/O pin (bank 1) |
| Pin produk 16 | GND — Ground |
| Pin produk 17 | I/O — User I/O pin (bank 1) |
| Pin produk 18 | I/O — User I/O pin (bank 1) |
| Pin produk 19 | I/O — User I/O pin (bank 1) |
| Pin produk 20 | I/O — User I/O pin (bank 1) |
| Pin produk 21 | VCCIO — I/O bank 2 supply |
| Pin produk 22 | I/O — User I/O pin (bank 2) |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | I/O — User I/O pin (bank 2) |
| Pin produk 25 | GND — Ground |
| Pin produk 26 | I/O — User I/O pin (bank 2) |
| Pin produk 27 | I/O — User I/O pin (bank 2) |
| Pin produk 28 | I/O — User I/O pin (bank 2) |
| Pin produk 29 | I/O — User I/O pin (bank 2) |
| Pin produk 30 | VCCIO — I/O bank 2 supply |
| Pin produk 31 | I/O — User I/O pin (bank 2) |
| Pin produk 32 | I/O — User I/O pin (bank 2) |
| Pin produk 33 | I/O — User I/O pin (bank 2) |
| Pin produk 34 | I/O — User I/O pin (bank 2) |
| Pin produk 35 | GND — Ground |
| Pin produk 36 | I/O — User I/O pin (bank 3) |
| Pin produk 37 | I/O — User I/O pin (bank 3) |
| Pin produk 38 | I/O — User I/O pin (bank 3) |
| Pin produk 39 | VCCINT — Core supply 2.5 V |
| Pin produk 40 | I/O — User I/O pin (bank 3) |
| Pin produk 41 | I/O — User I/O pin (bank 3) |
| Pin produk 42 | I/O — User I/O pin (bank 3) |
| Pin produk 43 | I/O — User I/O pin (bank 3) |
| Pin produk 44 | VCCIO — I/O bank 3 supply |
| Pin produk 45 | I/O — User I/O pin (bank 3) |
| Pin produk 46 | I/O — User I/O pin (bank 3) |
| Pin produk 47 | I/O — User I/O pin (bank 3) |
| Pin produk 48 | GND — Ground |
| Pin produk 49 | I/O — User I/O pin (bank 4) |
| Pin produk 50 | I/O — User I/O pin (bank 4) |
| Pin produk 51 | I/O — User I/O pin (bank 4) |
| Pin produk 52 | I/O — User I/O pin (bank 4) |
| Pin produk 53 | VCCIO — I/O bank 4 supply |
| Pin produk 54 | I/O — User I/O pin (bank 4) |
| Pin produk 55 | I/O — User I/O pin (bank 4) |
| Pin produk 56 | GND — Ground |
| Pin produk 57 | I/O — User I/O pin (bank 4) |
| Pin produk 58 | I/O — User I/O pin (bank 4) |
| Pin produk 59 | I/O — User I/O pin (bank 4) |
| Pin produk 60 | VCCINT — Core supply 2.5 V |
| Pin produk 61 | I/O — User I/O pin (bank 4) |
| Pin produk 62 | I/O — User I/O pin (bank 5) |
| Pin produk 63 | I/O — User I/O pin (bank 5) |
| Pin produk 64 | I/O — User I/O pin (bank 5) |
| Pin produk 65 | VCCIO — I/O bank 5 supply |
| Pin produk 66 | I/O — User I/O pin (bank 5) |
| Pin produk 67 | I/O — User I/O pin (bank 5) |
| Pin produk 68 | I/O — User I/O pin (bank 5) |
| Pin produk 69 | GND — Ground |
| Pin produk 70 | I/O — User I/O pin (bank 5) |
| Pin produk 71 | I/O — User I/O pin (bank 5) |
| Pin produk 72 | I/O — User I/O pin (bank 5) |
| Pin produk 73 | I/O — User I/O pin (bank 5) |
| Pin produk 74 | VCCIO — I/O bank 5 supply |
| Pin produk 75 | I/O — User I/O pin (bank 6) |
| Pin produk 76 | I/O — User I/O pin (bank 6) |
| Pin produk 77 | GND — Ground |
| Pin produk 78 | I/O — User I/O pin (bank 6) |
| Pin produk 79 | I/O — User I/O pin (bank 6) |
| Pin produk 80 | I/O — User I/O pin (bank 6) |
| Pin produk 81 | VCCINT — Core supply 2.5 V |
| Pin produk 82 | I/O — User I/O pin (bank 6) |
| Pin produk 83 | I/O — User I/O pin (bank 6) |
| Pin produk 84 | I/O — User I/O pin (bank 6) |
| Pin produk 85 | VCCIO — I/O bank 6 supply |
| Pin produk 86 | I/O — User I/O pin (bank 6) |
| Pin produk 87 | I/O — User I/O pin (bank 6) |
| Pin produk 88 | GND — Ground |
| Pin produk 89 | I/O — User I/O pin (bank 6) |
| Pin produk 90 | I/O — User I/O pin (bank 7) |
| Pin produk 91 | I/O — User I/O pin (bank 7) |
| Pin produk 92 | I/O — User I/O pin (bank 7) |
| Pin produk 93 | VCCIO — I/O bank 7 supply |
| Pin produk 94 | I/O — User I/O pin (bank 7) |
| Pin produk 95 | I/O — User I/O pin (bank 7) |
| Pin produk 96 | I/O — User I/O pin (bank 7) |
| Pin produk 97 | GND — Ground |
| Pin produk 98 | I/O — User I/O pin (bank 7) |
| Pin produk 99 | I/O — User I/O pin (bank 7) |
| Pin produk 100 | I/O — User I/O pin (bank 7) |
| Pin produk 101 | VCCINT — Core supply 2.5 V |
| Pin produk 102 | I/O — User I/O pin (bank 7) |
| Pin produk 103 | I/O — User I/O pin (bank 7) |
| Pin produk 104 | I/O — User I/O pin (bank 8) |
| Pin produk 105 | VCCIO — I/O bank 8 supply |
| Pin produk 106 | I/O — User I/O pin (bank 8) |
| Pin produk 107 | I/O — User I/O pin (bank 8) |
| Pin produk 108 | I/O — User I/O pin (bank 8) |
| Pin produk 109 | GND — Ground |
| Pin produk 110 | I/O — User I/O pin (bank 8) |
| Pin produk 111 | I/O — User I/O pin (bank 8) |
| Pin produk 112 | I/O — User I/O pin (bank 8) |
| Pin produk 113 | I/O — User I/O pin (bank 8) |
| Pin produk 114 | VCCIO — I/O bank 8 supply |
| Pin produk 115 | I/O — User I/O pin (bank 8) |
| Pin produk 116 | I/O — User I/O pin (bank 8) |
| Pin produk 117 | I/O — User I/O pin (bank 8) |
| Pin produk 118 | GND — Ground |
| Pin produk 119 | TDI — JTAG Test Data In |
| Pin produk 120 | TMS — JTAG Test Mode Select |
| Pin produk 121 | TCK — JTAG Test Clock |
| Pin produk 122 | nCONFIG — Configuration control (active low) |
| Pin produk 123 | nSTATUS — Configuration status (active low) |
| Pin produk 124 | CONF_DONE — Configuration done indicator |
| Pin produk 125 | DCLK — Configuration clock input |
| Pin produk 126 | DATA0 — Configuration data input |
| Pin produk 127 | nCE — Chip enable (active low) |
| Pin produk 128 | MSEL0 — Configuration mode select 0 |
| Pin produk 129 | MSEL1 — Configuration mode select 1 |
| Pin produk 130 | TDO — JTAG Test Data Out |
| Pin produk 131 | VCCINT — Core supply 2.5 V |
| Pin produk 132 | GND — Ground |
| Pin produk 133 | CLK0 — Dedicated clock input 0 |
| Pin produk 134 | CLK1 — Dedicated clock input 1 |
| Pin produk 135 | CLK2 — Dedicated clock input 2 |
| Pin produk 136 | I/O — User I/O pin (bank 1) |
| Pin produk 137 | I/O — User I/O pin (bank 1) |
| Pin produk 138 | I/O — User I/O pin (bank 1) |
| Pin produk 139 | I/O — User I/O pin (bank 1) |
| Pin produk 140 | VCCIO — I/O bank 1 supply |
| Pin produk 141 | I/O — User I/O pin (bank 1) |
| Pin produk 142 | I/O — User I/O pin (bank 1) |
| Pin produk 143 | I/O — User I/O pin (bank 1) |
| Pin produk 144 | GND — Ground |
Aplikasi Umum
EP1K50TC144-2 cocok untuk 6 aplikasis: Industrial Glue Logic and Bus Bridging, Low-Volume ASIC Prototyping, Communication Protocol Bridge, Legacy Equipment Maintenance and Re-Spin, Educational FPGA Development Boards, Parallel-to-Serial Converter and Serializer.
Industrial Glue Logic and Bus Bridging
The EP1K50TC144-2 fits industrial glue-logic roles because its 2,880 logic elements and 102 user I/Os easily accommodate multi-protocol bus bridges (UART, SPI, I2C, parallel) plus discrete logic consolidation. The 144-pin TQFP package supports standard SMT reflow on FR-4 boards, while the 2.5 V core and 3.3 V-tolerant I/O banks allow direct interfacing with legacy 3.3 V peripherals without external level shifters. Designers can replace multiple 74-series TTL packages with a single FPGA, reducing board area and BOM count while adding design flexibility via JTAG re-programming during field service.
Direkomendasikan
Low-Volume ASIC Prototyping
The EP1K50TC144-2 is well-suited for ASIC prototyping because the SRAM-based ACEX-1K fabric allows full design re-spin in hours rather than weeks, accelerating pre-silicon verification. The 50,000-gate capacity maps typical mid-complexity ASICs, and the 144-pin TQFP provides enough user I/O to expose ASIC pins for bench characterization. Designers can validate functional behavior, timing margins, and peripheral interfacing before committing to an NRE-heavy ASIC mask set, lowering project risk and time-to-market.
Direkomendasikan
Communication Protocol Bridge
The EP1K50TC144-2's 200 MHz internal frequency and 102 I/Os support a wide range of protocol bridge implementations, including UART-to-SPI, SPI-to-I2C, parallel-to-LVDS, and PCI-to-ISA legacy interconnects. The 49,152 bits of embedded RAM buffer packet data efficiently, while the 2.5 V core allows 3.3 V peripherals on the same board. Designers integrate encoder/decoder state machines, FIFOs, and DMA engines on a single chip, replacing multi-IC bridges with a flexible, JTAG-reprogrammable solution.
Direkomendasikan
Legacy Equipment Maintenance and Re-Spin
The EP1K50TC144-2 is ideal for maintaining legacy industrial and military equipment whose original ACEX-1K designs are reaching end-of-life, because the 144-pin TQFP footprint remains drop-in compatible across speed grades. Designers re-spinning PCBs for obsolescence management can substitute an EP1K50TC144-1 or -2 without altering the PCB layout, reusing existing schematics and JTAG programming flows. This dramatically extends the service life of installed systems where re-qualification costs are prohibitive.
Direkomendasikan
Educational FPGA Development Boards
The EP1K50TC144-2 supports educational and lab development because its 2,880 logic elements and 49,152 bits of embedded RAM are sufficient for soft-core processor implementations, lab exercises, and student projects. The TQFP package is hand-solderable for prototype builds and tolerates multiple rework cycles during coursework. Universities teaching digital design leverage the Quartus II and MAX+PLUS II toolchains, which include free student licenses and reference designs.
Direkomendasikan
Parallel-to-Serial Converter and Serializer
The EP1K50TC144-2 is well-matched to parallel-to-serial conversion applications because its 102 I/O pins accept wide parallel buses while on-chip EABs implement FIFO buffering at line rates up to 200 MHz. Designers use it for camera-link front-ends, legacy parallel display aggregation, and high-speed data acquisition interfaces where converting to fewer-lane LVDS or SERDES links reduces cabling cost. The JTAG interface enables field-upgradeable serializer firmware.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1K50TC144-2 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1K50TC144-1N | EP1K50TC144-1 | EP1K30TC144-2N | EP1K10TC144-2 |
|---|---|---|---|---|---|
| Package | 144-pin TQFP (TC144) | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same | 144-pin TQFP (TC144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Typical Gates | 50,000 | 50,000 | 50,000 | 30,000 | 10,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 576 |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -2 | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM Bits | 49,152 | 49,152 | 49,152 | 24,576 | 12,288 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Largest logic capacity in the EP1K50 TC144 pinout family (vsEP1K30TC144-2)
- Lower cost than faster speed grade (vsEP1K50TC144-1N)
- More embedded RAM than lower-density ACEX-1K siblings (vsEP1K10TC144-2)
Catatan Desain
Estimated: the EP1K50TC144-2 draws approximately 100-300 mA from the 2.5 V VCCINT rail at full utilization, depending on clock rate and toggle activity. Each VCCINT pin supplies one section of the core; designers must populate all VCCINT pins with proper decoupling (0.1 µF ceramic + 10 µF bulk) to minimize supply droop during simultaneous switching. VCCIO bank supplies must be tied to 3.3 V (or 2.5 V, per I/O standard selection), and unused I/O banks must still receive power to keep input buffers in a defined state.
The 144-pin TQFP package uses 0.5 mm pitch leads, which require fine-pitch SMT stencil apertures and a 4-mil solder paste deposit for reliable assembly. Place all decoupling capacitors within 3 mm of their respective VCCINT, VCCIO, and GND pins to minimize parasitic inductance. Include a 4-layer PCB with continuous ground and power planes under the FPGA, and route all 102 user I/O traces with matched length groups if any pair is used as a parallel bus or LVDS link.
Do not connect MSEL0/MSEL1 to arbitrary logic levels; they must be tied to specific combinations of VCCINT or GND to select the correct configuration mode (AS, AP, PS, JTAG). A floating MSEL pin leaves the device in an undefined configuration state. Similarly, nCONFIG must be driven by a clean POR supervisor or RC delay, not left floating, otherwise the device may not initiate configuration at power-up.
Informasi Konformitas
RoHS and lead-free per DigiKey listing; halogen-free status not verified in available data; AEC-Q100 not applicable to commercial FPGAs.