Intel

EPF6016ATC100-3N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Intel

Name: EPF6016ATC100-3N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Intel
Brand: Intel
SKU: EPF6016ATC100-3N

MPN: EPF6016ATC100-3N ✗ Akhir Hidup

3.3 V Vdss 100-pin TQFP (14x14 mm) Package 142.86 MHz (max) Speed

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MOQ: 1 |

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Kuantitas

EPF6016ATC100-3N Ringkasan

The Intel EPF6016ATC100-3N is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs), featuring 16,000 typical gates, 1,320 logic elements (LEs), 81 user I/Os, and an internal operating frequency up to 142.86 MHz, housed in a 100-pin TQFP package. The device is fabricated on a 0.42 micrometer CMOS process, operates from a 3.3 V supply, and supports in-system programmability through the FLEX 6000 SRAM configuration architecture.

What is an FPGA? A Field Programmable Gate Array is a programmable logic device that integrates configurable logic blocks (LBs), programmable interconnect, and programmable I/O cells on a single semiconductor die. FPGAs sit hierarchically between simple PLDs (CPLDs, GALs) and fixed-function ASICs, providing hardware-level parallelism with software-reconfigurable logic - making them ideal for glue logic, prototyping, low-volume production, and design changes late in the product cycle without respinning a board.

Key features include 1,320 logic elements organized into 132 Logic Array Blocks (LABs) with carry and cascade chains for high-speed arithmetic and wide-input functions, 81 user I/O pins supporting multiple I/O standards, built-in JTAG boundary-scan test support, and an SRAM-based configuration cell that allows unlimited reconfiguration. The -3N speed grade places it in the moderate-performance tier of the FLEX 6000 family.

Technically, the FLEX 6000 architecture uses a continuous routing structure called the FastTrack Interconnect, which provides predictable timing across the device. Each LE contains a 4-input look-up table (LUT), a programmable register, and dedicated paths for carry propagation (counters, adders) and cascade chains (wide comparators). Configuration is volatile - external memory or a configuration PROM is required at power-up, distinguishing FPGAs from non-volatile CPLDs.

Typical applications include telecommunication interface bridging, industrial control glue logic, low-density glue-logic consolidation replacing 74-series TTL, simple state machines, and education/development platforms for digital design. The wide package availability (TQFP-100) makes it well-suited for hand-solderable prototypes and low-cost PCB designs.

When designing with this part, note that the EPF6016ATC100-3N is now marked obsolete (EOL) per distributor data. New designs should consider the FLEX 10K, Cyclone, or MAX II families; this part remains in service primarily for legacy board maintenance and long-lifecycle industrial equipment.

This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not collected in any single manufacturer document.

Alternatif penggantian untuk EPF6016ATC100-3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF6016ATC100-3N (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Speed Grade, Package, Process Technology, Device Type.

EPF6016ATC100-1

Altera

Operating Temperature: 0 °C to +85 °C (commercial)

Speed Grade: -1 (AC speed bin)

Package: 100-pin TQFP (TQFP-100), 14 mm x 14 mm