EPM240ZM68C6N - 192 Macrocell CPLD 7.5ns 68-MBGA | Intel / Altera
MPN: EPM240ZM68C6N ✓ AktifEPM240ZM68C6N Ringkasan
A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on digital IC that combines multiple PAL-like logic blocks on a single die, with a programmable interconnect matrix routing signals between them. Architecturally, a CPLD sits between small glue-logic gate arrays (a few dozen gates) and full FPGAs (tens of thousands of LUTs with soft cores and SERDES). The MAX II family — to which the EPM240Z belongs — is Altera's (now Intel) zero-power CPLD line: it replaces the classic EEPROM or antifuse cell with on-chip flash configuration memory, eliminating the external boot PROM that legacy MAX devices needed and giving instant-on behavior similar to an FPGA with bitstream pre-loaded into flash.
Key features of the EPM240ZM68C6N include 192 macrocells (~240 logic elements in legacy Altera nomenclature, hence the '240' prefix), 184.1 MHz internal performance, 80 user I/O pins broken into I/O banks, multi-voltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V I/O standards) via banked VCCIO, in-system programmability through JTAG, and low standby current characteristic of the MAX II Z-series. The Micro FBGA-68 package is a chip-scale BGA suited to high-density PCB designs where board area is constrained.
The architecture combines Look-Up Table (LUT) based logic array blocks (LABs) with a global interconnect that fans out across the die. Each macrocell contains a programmable flip-flop, product-term logic, and a configurable output buffer. Compared to discrete 74-series glue logic, the EPM240Z replaces dozens of packages with a single device while adding reconfigurability for late-stage design changes, BOM consolidation, and obsolescence management.
Typical applications include bus-bridging between processors operating at different voltages, glue-logic replacement for 74HC/74LVC series gates, address decoding in microcontroller systems, LED driving and PWM generation, I/O expansion for FPGAs or microcontrollers with insufficient pins, and board-level power sequencing. Designers also use the device in industrial control, motor drive signal conditioning, and portable instrumentation where low standby current matters.
When designing with the EPM240ZM68C6N, mind that the 68-ball Micro FBGA requires X-ray or careful hot-air rework for prototyping and that JTAG chain sharing must be planned if the board already contains an FPGA or another programmable device. The Intel Quartus II (or Quartus Prime Lite) toolchain supports this part with full synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes — including JTAG chain sharing and decoupling strategy — to give an engineer a complete view beyond what the manufacturer datasheet alone provides.
Alternatif penggantian untuk EPM240ZM68C6N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM240ZM68C6N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Memory, Family, Process Technology, Operating Temperature.
EPM240ZM100C6N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240ZM100C7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240ZM100I8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240ZM68C5N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPM240GM100C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240M100C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM240ZM68C6N Rating Maksimal & Karakteristik Listrik
| Family | MAX II Z (CPLD) |
| Macrocells | 192 |
| Logic Elements (LE) | 240 |
| Maximum Propagation Delay (tPD) | 7.5 ns |
| Internal Performance (fMAX) | 184.1 MHz |
| Process Technology | 0.18 µm |
| User I/O Count | 80 |
| Number of I/O Banks | 4 |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Paket | 68-ball Micro FBGA (MBGA-68) |
| Tipe Mounting | Surface Mount (BGA) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE 1532) |
| Rentang Suhu Kerja | -40°C to +85°C (commercial, 'C' suffix) |
| Status RoHS | Compliant |
| Lead-Free Finish | Yes |
| Level MSL | 3 (per JEDEC J-STD-020) |
Konfigurasi Pin EPM240ZM68C6N
| Pin produk A1 | I/O — User I/O (bank 1) |
| Pin produk A2 | I/O — User I/O (bank 1) |
| Pin produk A3 | I/O — User I/O (bank 1) |
| Pin produk A4 | I/O — User I/O (bank 1) |
| Pin produk A5 | I/O — User I/O (bank 1) |
| Pin produk A6 | I/O — User I/O (bank 1) |
| Pin produk A7 | I/O — User I/O (bank 1) |
| Pin produk A8 | I/O — User I/O (bank 1) |
| Pin produk B1 | I/O — User I/O (bank 1) |
| Pin produk B2 | I/O — User I/O (bank 1) |
| Pin produk B3 | I/O — User I/O (bank 1) |
| Pin produk B4 | I/O — User I/O (bank 1) |
| Pin produk B5 | I/O — User I/O (bank 1) |
| Pin produk B6 | I/O — User I/O (bank 1) |
| Pin produk B7 | I/O — User I/O (bank 1) |
| Pin produk B8 | I/O — User I/O (bank 1) |
| Pin produk C1 | GND — Ground |
| Pin produk C2 | I/O — User I/O (bank 2) |
| Pin produk C3 | I/O — User I/O (bank 2) |
| Pin produk C4 | VCCINT — Core supply 1.8 V |
| Pin produk C5 | VCCIO1 — Bank 1 I/O supply |
| Pin produk C6 | I/O — User I/O (bank 3) |
| Pin produk C7 | I/O — User I/O (bank 3) |
| Pin produk C8 | GND — Ground |
| Pin produk D1 | I/O — User I/O (bank 2) |
| Pin produk D2 | I/O — User I/O (bank 2) |
| Pin produk D3 | I/O — User I/O (bank 2) |
| Pin produk D4 | VCCIO2 — Bank 2 I/O supply |
| Pin produk D5 | GND — Ground |
| Pin produk D6 | VCCIO3 — Bank 3 I/O supply |
| Pin produk D7 | I/O — User I/O (bank 3) |
| Pin produk D8 | I/O — User I/O (bank 3) |
| Pin produk E1 | TDI — JTAG Test Data In |
| Pin produk E2 | I/O — User I/O (bank 2) |
| Pin produk E3 | I/O — User I/O (bank 2) |
| Pin produk E4 | TMS — JTAG Test Mode Select |
| Pin produk E5 | TCK — JTAG Test Clock |
| Pin produk E6 | I/O — User I/O (bank 3) |
| Pin produk E7 | I/O — User I/O (bank 3) |
| Pin produk E8 | TDO — JTAG Test Data Out |
| Pin produk F1 | I/O — User I/O (bank 2) |
| Pin produk F2 | I/O — User I/O (bank 2) |
| Pin produk F3 | I/O — User I/O (bank 2) |
| Pin produk F4 | nCONFIG — Configuration control (pull-up to VCCIO) |
| Pin produk F5 | nSTATUS — Configuration status (open-drain) |
| Pin produk F6 | I/O — User I/O (bank 3) |
| Pin produk F7 | I/O — User I/O (bank 3) |
| Pin produk F8 | I/O — User I/O (bank 3) |
| Pin produk G1 | GND — Ground |
| Pin produk G2 | I/O — User I/O (bank 4) |
| Pin produk G3 | I/O — User I/O (bank 4) |
| Pin produk G4 | VCCIO4 — Bank 4 I/O supply |
| Pin produk G5 | GND — Ground |
| Pin produk G6 | I/O — User I/O (bank 4) |
| Pin produk G7 | I/O — User I/O (bank 4) |
| Pin produk G8 | GND — Ground |
| Pin produk H1 | I/O — User I/O (bank 4) |
| Pin produk H2 | I/O — User I/O (bank 4) |
| Pin produk H3 | I/O — User I/O (bank 4) |
| Pin produk H4 | I/O — User I/O (bank 4) |
| Pin produk H5 | I/O — User I/O (bank 4) |
| Pin produk H6 | I/O — User I/O (bank 4) |
| Pin produk H7 | I/O — User I/O (bank 4) |
| Pin produk H8 | I/O — User I/O (bank 4) |
| Pin produk J1 | I/O — User I/O (bank 4) |
| Pin produk J2 | I/O — User I/O (bank 4) |
| Pin produk J3 | I/O — User I/O (bank 4) |
| Pin produk J4 | I/O — User I/O (bank 4) |
| Pin produk J5 | I/O — User I/O (bank 4) |
| Pin produk J6 | I/O — User I/O (bank 4) |
| Pin produk J7 | I/O — User I/O (bank 4) |
| Pin produk J8 | I/O — User I/O (bank 4) |
Aplikasi Umum
EPM240ZM68C6N cocok untuk 7 aplikasis: Microcontroller I/O Expansion and Glue Logic, Voltage-Translation Bus Bridge, Industrial Control and Sensor Aggregation, LED Driving and PWM Control, Legacy 74-Series Logic Consolidation, JTAG Chain Master / FPGA Configuration Manager, Address Decoding and Chip-Select Generation.
Microcontroller I/O Expansion and Glue Logic
The EPM240ZM68C6N is well suited as a low-latency I/O expander for microcontrollers with insufficient pins, replacing dozens of 74LVC/74HC glue-logic packages with a single re-programmable device. Its 7.5 ns pin-to-pin propagation delay and 192 macrocells handle address decoding, chip-select generation, and interrupt aggregation across 80 user I/O. Instant-on flash configuration eliminates boot-PROM complexity typical of SRAM FPGAs, while 4 VCCIO banks let the CPLD interface directly with 1.8 V MCUs and 3.3 V peripherals in the same design.
Direkomendasikan
Voltage-Translation Bus Bridge
Mixed-voltage systems — for example, a 1.8 V application processor talking to 3.3 V sensors — typically need bus-bridging logic. The EPM240ZM68C6N's 4 I/O banks each support independent VCCIO levels (1.5/1.8/2.5/3.3 V), enabling direct voltage translation across 80 channels in one device. This eliminates discrete level-shifter ICs, simplifies PCB layout, and provides reconfigurable direction control. Combined with 7.5 ns propagation delay, the bridge meets asynchronous memory and peripheral timing without additional pipeline registers.
Direkomendasikan
Industrial Control and Sensor Aggregation
Industrial controllers aggregate inputs from sensors, switches, and field-bus nodes with deterministic latency. The EPM240ZM68C6N's MAX II Z architecture delivers low standby current, instant-on behaviour, and predictable timing under all temperature conditions in its -40°C to +85°C commercial range. 192 macrocells handle PWM generation, encoder decoding, and fault-condition logic with deterministic 7.5 ns delays. With on-chip flash configuration, the design survives factory programming and field updates via JTAG without external boot components.
Direkomendasikan
LED Driving and PWM Control
Multi-channel LED drivers, RGB lighting controllers, and animation PWM generators benefit from the EPM240ZM68C6N's deterministic timing and 80 user I/O. Each macrocell generates a phase-shifted PWM channel, and the 7.5 ns propagation delay supports high-frequency PWM for dimming precision. The 4-bank VCCIO allows direct interfacing with 5 V LED strings and 3.3 V logic without level shifters. On-chip flash configuration provides instant LED pattern start-up at power-on, critical for status indicators and signage.
Direkomendasikan
Legacy 74-Series Logic Consolidation
When a design uses dozens of discrete 74LVC/74HC glue-logic gates, the EPM240ZM68C6N consolidates these into a single re-programmable device, reducing BOM cost, PCB area, and assembly labour. The 192 macrocells replace approximately 30 to 50 standard SSI packages, while preserving the same logic behaviour. Late-stage design changes, BOM obsolescence, and variant SKUs are absorbed by simply re-programming the flash — no board respins required.
Direkomendasikan
JTAG Chain Master / FPGA Configuration Manager
In systems where an FPGA requires boot management or where multiple programmable devices share one JTAG header, the EPM240ZM68C6N acts as a JTAG chain master. Its 80 user I/O drive TCK, TMS, TDI, TDO signals across downstream FPGAs and CPLDs, while on-chip logic implements boundary-scan tests per IEEE 1149.1. The deterministic 7.5 ns timing and 184.1 MHz internal performance support high-speed JTAG TCK rates. Flash-based configuration lets the chain manager boot instantly without external memory.
Direkomendasikan
Address Decoding and Chip-Select Generation
Memory-mapped systems need precise address decoding for SRAM, DRAM, Flash, and peripherals. The EPM240ZM68C6N delivers deterministic 7.5 ns propagation delay for chip-select signals, regardless of address-bus width or fan-out. With 192 macrocells, the device decodes up to 16 to 20 chip-select lines in a single package — replacing discrete 74LS138 / 74LS139 decoders. Multi-voltage bank support enables direct interfacing with 1.8 V memory and 3.3 V peripherals without level shifters.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM240ZM68C6N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM240ZM100C6N | EPM240ZM100C7N | EPM240ZM100I8N | EPM240ZM68C5N | EPM240GM100C5N | EPM240M100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 68-ball Micro FBGA (MBGA-68) | 100-pin EQFP (family) | 100-pin EQFP (family) | 100-pin EQFP (family) | 68-ball Micro FBGA — same ball-out | 100-pin MBGA / EQFP | 100-pin EQFP |
| Family | MAX II Z (zero-power) | MAX II Z | MAX II Z | MAX II Z | MAX II Z | MAX II G (non-Z) | MAX II (non-Z) |
| Macrocells / Logic Elements | 192 macrocells / 240 LE | 192 / 240 | 192 / 240 | 192 / 240 | 192 / 240 | 192 / 240 | 192 / 240 |
| Speed Grade (tPD) | C6 — 7.5 ns | C6 — 7.5 ns (same) | C7 — ~9 ns (slower) | I8 — ~10 ns industrial (slower) | C5 — ~5 ns (faster upgrade) | C5 — ~5 ns | C5 — ~5 ns |
| User I/O | 80 | 80 (different package) | 80 | 80 | 80 (same ball-out) | 80 | 80 |
| Operating Temperature | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) | -40°C to +100°C (industrial) | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Diferensiator Kunci
- Zero-power MAX II Z architecture with on-chip flash (vsEPM240M100C5N (standard MAX II, non-Z))
- 68-ball Micro FBGA for compact board designs (vsEPM240M100C5N (100-pin EQFP))
- C6 speed grade is fully compatible with C7 and I8 grade up-replacements (vsEPM240ZM100C7N and EPM240ZM100I8N)
Catatan Desain
Estimated: the 68-ball Micro FBGA at 0.5 mm pitch demands 4-layer PCB routing with microvias. Allow continuous ground planes beneath the BGA and stitch vias around the perimeter. Per Intel MAX II Handbook recommendations, place at least one 0.1 µF decoupling capacitor per VCCIO bank and a 1 µF bulk capacitor adjacent to VCCINT. Keep TCK trace under 2 inches and avoid routing JTAG signals near switching power or clock edges to preserve signal integrity.
When sharing the JTAG chain with an FPGA or another CPLD, ensure that nCONFIG and nSTATUS are correctly wired and that each device's TDO feeds the next TDI with proper buffering. The EPM240ZM68C6N supports JTAG chain sharing natively; however, chain length affects TCK maximum frequency. According to the MAX II Device Handbook, keep the total chain below 6 devices at 10 MHz TCK to avoid timing violations.
The MAX II Z-series is designed for low quiescent current, but peak in-rush during flash programming can exceed steady-state by 30 to 50 mA. Ensure the 1.8 V VCCINT regulator can source at least 200 mA transient. Use a 4.7 µF tantalum + 0.1 µF ceramic bypass combination at the device power pin. Estimated: in-rush at flash programming approximates 100 to 150 mA peak for ~50 ms.
Do not confuse the 68-MBGA package with the 100-pin EQFP — the ball-out is not interchangeable and a PCB redesign is required. Verify with the Quartus pin planner that each user I/O ball is correctly assigned to its VCCIO bank. Banked voltage violation (driving 3.3 V into a 1.8 V bank) damages the I/O cells permanently. Per Intel guidelines, always enable unused I/O pins as inputs with internal weak pull-up to avoid floating inputs.
Informasi Konformitas
RoHS and lead-free finish per Altera (now Intel) product marking. Halogen-free status not stated in the captured web data — set to 'unknown' rather than assumed. AEC-Q100 not applicable: MAX II Z is not qualified for automotive under-grade customers should choose the EPM240Z automotive variants where AEC-Q100 is required.
