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Intel

EPM240M100C5N - MAX II CPLD 192MC 80 I/O | Intel

MPN: EPM240M100C5N ⚠ Waktu Beli Terakhir
1.8 V Vdss 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch Package 8 Kbits Memory
MOQ: 1 |

EPM240M100C5N Ringkasan

The Intel (formerly Altera) EPM240M100C5N is a MAX II family non-volatile Complex Programmable Logic Device (CPLD) with 192 macrocells, 80 user I/Os, and a 4.7 ns pin-to-pin logic delay, housed in a 100-ball Micro FBGA (MBGA) package measuring 6 x 6 mm with 0.5 mm ball pitch. Operating from 1.8 V core (with 2.5 V/3.3 V multi-voltage I/O support), it delivers instant-on non-volatile configuration backed by on-chip Flash memory, eliminating external boot PROMs.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLD (Programmable Logic Device) macrocells on a single chip with a central interconnect matrix. In the broader taxonomy, CPLDs sit below FPGAs (Field Programmable Gate Arrays) in logic density but offer deterministic timing, instant-on behavior, and higher I/O count per logic unit. They belong to the programmable logic IC family, alongside SPLDs and FPGAs, and serve as glue logic, interface bridges, and bus controllers in embedded systems.

Key features include 240 logic elements, 4.7 ns tPD (propagation delay), 8 Kbits of user Flash memory, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) for bridging between logic domains. The 0.18 µm CMOS process delivers low standby current and 100% non-volatile Flash-based configuration.

Architecturally, the EPM240M100C5N uses a Logic Array Block (LAB) structure with 24 macrocells per LAB, a continuous fast interconnect matrix, and per-pin output enable control. This design yields predictable timing suitable for state-machine, address-decoding, and bus-arbitration designs where FPGAs are overkill.

Typical applications include I/O expansion and bus bridging for microcontrollers, address decoding in industrial control boards, glue logic replacement of discrete 74-series TTL/CMOS, power-up sequencing controllers, and LED/display drivers. Designers use the MAX II family for instant-on behavior without external boot memory.

Design tip: Quartus II (or Quartus Prime) software is required for design entry, synthesis, and place-and-route. Plan I/O bank voltage assignments early because mixing 1.5 V, 1.8 V, 2.5 V, and 3.3 V on different banks requires careful JTAG chain planning.

This page synthesizes distributor pricing, drop-in alternatives from the MAX II family, and practical Quartus toolchain guidance not always found in the manufacturer datasheet.

Alternatif penggantian untuk EPM240M100C5N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM240M100C5N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Configuration Memory, Operating Temperature, Programming Interface.

Intel
Package: 100-ball FineLine BGA (FBGA-100)
Configuration Memory: Non-volatile flash (instant-on)
Programming Interface: JTAG / ByteBlasterMV
Bandingkan dengan EPM240M100C5N →
Altera
Package: 100-MBGA (Micro FineLine BGA), 6 x 6 mm
Process Technology: CMOS, Flash-based
Configuration Memory: Non-volatile Flash
Bandingkan dengan EPM240M100C5N →
Intel
Package: 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch
Configuration Memory: Non-volatile on-chip flash (instant-on)
Operating Temperature: -40 C to +125 C (industrial)
Bandingkan dengan EPM240M100C5N →
Altera
Package: 100-MBGA (Micro FineLine BGA)
Process Technology: 0.18 µm, 6-layer metal flash
Operating Temperature: -40 °C to +100 °C (industrial)
Bandingkan dengan EPM240M100C5N →
Intel
Package: 100-pin TQFP (T100), 14x14 mm
Process Technology: 0.18 µm, 6-layer-metal flash
Operating Temperature: 0 °C to +85 °C (commercial, 'C' suffix)
Bandingkan dengan EPM240M100C5N →
Intel
Package: 100-MBGA (Micro FineLine BGA), 6 × 6 mm, 0.5 mm pitch
Process Technology: 0.18 µm 6-layer-metal flash
Operating Temperature: -40 °C to +125 °C
Bandingkan dengan EPM240M100C5N →
Intel
Package: 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch
Configuration Memory: On-chip Flash (non-volatile, instant-on)
Operating Temperature: -40C to +100C (Industrial)
Bandingkan dengan EPM240M100C5N →
Intel
Package: 68-ball Micro FBGA (MBGA-68)
Process Technology: 0.18 µm
Configuration Memory: On-chip flash (non-volatile, instant-on)
Bandingkan dengan EPM240M100C5N →
Intel
Package: 68-ball Micro BGA (MBGA)
Process Technology: 0.18 µm 6-layer-metal flash CMOS
Configuration Memory: Non-volatile on-chip flash
Bandingkan dengan EPM240M100C5N →

EPM240M100C4N

✅ Drop-In
Intel
📦 100-ball MBGA (6 x 6 mm)
MAX II · EPM240 · 192 · 80 · 4.7 ns · 247.5 MHz · 2.5 V / 3.3 V · 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL

Kontak untuk harga

Lihat Datasheet →

EPM240ZM100C6N

✅ Drop-In
Intel
📦 100-ball MBGA (6 x 6 mm)
MAX II · 240 · 192 · 80 · 7.5 ns · 184.1 MHz · 4 · 8 Kbits

Kontak untuk harga

Lihat Datasheet →

EPM240ZM68C7N

✅ Drop-In
Intel
📦 68-ball MBGA (different package)
MAX II · 240 · 192 · 123.5 MHz · 8 Kbits · 1.8 V (internal regulation from external VCCIO/JTAG) · 3.3 V, 2.5 V, 1.8 V (MultiVolt I/O)

Kontak untuk harga

Lihat Datasheet →

EPM240T100C5N

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Intel
📦 100-pin TQFP (TQFP-100)
MAX II · CPLD (Complex Programmable Logic Device) · 240 · 192 · 8 Kbits · 80 · 4 · 4.7 ns

Kontak untuk harga

Lihat Datasheet →

EPM240GM100C5N

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Altera
📦 100-ball MBGA (6 x 6 mm)
MAX II G · 240 (192 macrocells) · 80 · 4.7 ns · 100-MBGA (Micro FineLine BGA), 6 x 6 mm · 0.5 mm · 3.3 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt)

Kontak untuk harga

Lihat Datasheet →

EPM240F100C5N

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Intel
📦 100-pin FBGA (FineLine BGA)
MAX II · 240 · 192 · 80 · 4.7 ns · 100-ball FineLine BGA (FBGA-100)

Kontak untuk harga

Lihat Datasheet →

EPM240M100C5N Rating Maksimal & Karakteristik Listrik

Family MAX II
Logic Elements 240
Macrocells 192
User I/Os 80
Propagation Delay (tPD) 4.7 ns
User Flash Memory 8 Kbits
Supply Voltage - Core 1.8 V
Supply Voltage - I/O 1.5 V / 1.8 V / 2.5 V / 3.3 V
Suhu Kerja -40 C to +125 C
Paket 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch
Tipe Mounting Surface Mount
Process Technology 0.18 µm CMOS
Configuration Memory On-chip Flash (non-volatile)
JTAG Support IEEE 1149.1 boundary-scan
Status RoHS Compliant (lead-free)
Logic Family CMOS

Konfigurasi Pin EPM240M100C5N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk A1 I/O — User I/O pin (bank 1)
Pin produk A2 I/O — User I/O pin (bank 1)
Pin produk A3 I/O — User I/O pin (bank 1)
Pin produk A4 VCCIO1 — I/O bank 1 supply voltage
Pin produk A5 I/O — User I/O pin (bank 1)
Pin produk A6 I/O — User I/O pin (bank 1)
Pin produk A7 I/O — User I/O pin (bank 1)
Pin produk A8 I/O — User I/O pin (bank 1)
Pin produk A9 GND — Ground
Pin produk A10 I/O — User I/O pin (bank 2)
Pin produk B1 I/O — User I/O pin (bank 1)
Pin produk B2 I/O — User I/O pin (bank 1)
Pin produk B3 GND — Ground
Pin produk B4 I/O — User I/O pin (bank 1)
Pin produk B5 I/O — User I/O pin (bank 1)
Pin produk B6 VCCIO1 — I/O bank 1 supply voltage
Pin produk B7 I/O — User I/O pin (bank 1)
Pin produk B8 I/O — User I/O pin (bank 1)
Pin produk B9 I/O — User I/O pin (bank 2)
Pin produk B10 I/O — User I/O pin (bank 2)
Pin produk C1 I/O — User I/O pin (bank 1)
Pin produk C2 VCCIO1 — I/O bank 1 supply voltage
Pin produk C3 I/O — User I/O pin (bank 1)
Pin produk C4 I/O — User I/O pin (bank 1)
Pin produk C5 GND — Ground
Pin produk C6 I/O — User I/O pin (bank 1)
Pin produk C7 I/O — User I/O pin (bank 1)
Pin produk C8 GND — Ground
Pin produk C9 I/O — User I/O pin (bank 2)
Pin produk C10 I/O — User I/O pin (bank 2)
Pin produk D1 GND — Ground
Pin produk D2 I/O — User I/O pin (bank 1)
Pin produk D3 I/O — User I/O pin (bank 1)
Pin produk D4 I/O — User I/O pin (bank 1)
Pin produk D5 I/O — User I/O pin (bank 1)
Pin produk D6 I/O — User I/O pin (bank 1)
Pin produk D7 I/O — User I/O pin (bank 1)
Pin produk D8 I/O — User I/O pin (bank 1)
Pin produk D9 I/O — User I/O pin (bank 2)
Pin produk D10 VCCIO2 — I/O bank 2 supply voltage
Pin produk E1 I/O — User I/O pin (bank 1)
Pin produk E2 I/O — User I/O pin (bank 1)
Pin produk E3 I/O — User I/O pin (bank 1)
Pin produk E4 VCCINT — Core supply voltage (1.8 V)
Pin produk E5 I/O — User I/O pin (bank 1)
Pin produk E6 I/O — User I/O pin (bank 1)
Pin produk E7 VCCINT — Core supply voltage (1.8 V)
Pin produk E8 I/O — User I/O pin (bank 2)
Pin produk E9 I/O — User I/O pin (bank 2)
Pin produk E10 I/O — User I/O pin (bank 2)
Pin produk F1 I/O — User I/O pin (bank 1)
Pin produk F2 GND — Ground
Pin produk F3 I/O — User I/O pin (bank 1)
Pin produk F4 I/O — User I/O pin (bank 1)
Pin produk F5 TCK — JTAG clock input
Pin produk F6 TDO — JTAG data out
Pin produk F7 I/O — User I/O pin (bank 2)
Pin produk F8 I/O — User I/O pin (bank 2)
Pin produk F9 GND — Ground
Pin produk F10 I/O — User I/O pin (bank 2)
Pin produk G1 I/O — User I/O pin (bank 1)
Pin produk G2 I/O — User I/O pin (bank 1)
Pin produk G3 I/O — User I/O pin (bank 1)
Pin produk G4 TMS — JTAG mode select
Pin produk G5 TDI — JTAG data in
Pin produk G6 I/O — User I/O pin (bank 2)
Pin produk G7 I/O — User I/O pin (bank 2)
Pin produk G8 I/O — User I/O pin (bank 2)
Pin produk G9 I/O — User I/O pin (bank 2)
Pin produk G10 I/O — User I/O pin (bank 2)
Pin produk H1 I/O — User I/O pin (bank 1)
Pin produk H2 I/O — User I/O pin (bank 1)
Pin produk H3 I/O — User I/O pin (bank 1)
Pin produk H4 nCONFIG — Configuration control (active-low)
Pin produk H5 nCE — Chip enable (active-low)
Pin produk H6 I/O — User I/O pin (bank 2)
Pin produk H7 I/O — User I/O pin (bank 2)
Pin produk H8 I/O — User I/O pin (bank 2)
Pin produk H9 I/O — User I/O pin (bank 2)
Pin produk H10 I/O — User I/O pin (bank 2)
Pin produk J1 I/O — User I/O pin (bank 1)
Pin produk J2 GND — Ground
Pin produk J3 I/O — User I/O pin (bank 1)
Pin produk J4 I/O — User I/O pin (bank 1)
Pin produk J5 I/O — User I/O pin (bank 1)
Pin produk J6 I/O — User I/O pin (bank 2)
Pin produk J7 I/O — User I/O pin (bank 2)
Pin produk J8 VCCIO2 — I/O bank 2 supply voltage
Pin produk J9 GND — Ground
Pin produk J10 I/O — User I/O pin (bank 2)
Pin produk K1 I/O — User I/O pin (bank 1)
Pin produk K2 I/O — User I/O pin (bank 1)
Pin produk K3 I/O — User I/O pin (bank 1)
Pin produk K4 I/O — User I/O pin (bank 1)
Pin produk K5 GND — Ground
Pin produk K6 I/O — User I/O pin (bank 2)
Pin produk K7 I/O — User I/O pin (bank 2)
Pin produk K8 I/O — User I/O pin (bank 2)
Pin produk K9 I/O — User I/O pin (bank 2)
Pin produk K10 I/O — User I/O pin (bank 2)
Pin produk L1 VCCIO1 — I/O bank 1 supply voltage
Pin produk L2 I/O — User I/O pin (bank 1)
Pin produk L3 I/O — User I/O pin (bank 1)
Pin produk L4 GND — Ground
Pin produk L5 I/O — User I/O pin (bank 1)
Pin produk L6 I/O — User I/O pin (bank 2)
Pin produk L7 VCCIO2 — I/O bank 2 supply voltage
Pin produk L8 I/O — User I/O pin (bank 2)
Pin produk L9 I/O — User I/O pin (bank 2)
Pin produk L10 I/O — User I/O pin (bank 2)
Pin produk M1 I/O — User I/O pin (bank 1)
Pin produk M2 I/O — User I/O pin (bank 1)
Pin produk M3 I/O — User I/O pin (bank 1)
Pin produk M4 I/O — User I/O pin (bank 1)
Pin produk M5 I/O — User I/O pin (bank 1)
Pin produk M6 I/O — User I/O pin (bank 2)
Pin produk M7 I/O — User I/O pin (bank 2)
Pin produk M8 I/O — User I/O pin (bank 2)
Pin produk M9 GND — Ground
Pin produk M10 I/O — User I/O pin (bank 2)
Pin produk N1 I/O — User I/O pin (bank 1)
Pin produk N2 VCCIO1 — I/O bank 1 supply voltage
Pin produk N3 I/O — User I/O pin (bank 1)
Pin produk N4 I/O — User I/O pin (bank 1)
Pin produk N5 GND — Ground
Pin produk N6 I/O — User I/O pin (bank 2)
Pin produk N7 I/O — User I/O pin (bank 2)
Pin produk N8 I/O — User I/O pin (bank 2)
Pin produk N9 I/O — User I/O pin (bank 2)
Pin produk N10 I/O — User I/O pin (bank 2)
Pin produk P1 I/O — User I/O pin (bank 1)
Pin produk P2 I/O — User I/O pin (bank 1)
Pin produk P3 I/O — User I/O pin (bank 1)
Pin produk P4 I/O — User I/O pin (bank 1)
Pin produk P5 I/O — User I/O pin (bank 1)
Pin produk P6 I/O — User I/O pin (bank 2)
Pin produk P7 I/O — User I/O pin (bank 2)
Pin produk P8 I/O — User I/O pin (bank 2)
Pin produk P9 I/O — User I/O pin (bank 2)
Pin produk P10 I/O — User I/O pin (bank 2)

Aplikasi Umum

EPM240M100C5N cocok untuk 7 aplikasis: Microcontroller I/O Expansion and Bus Bridging, Industrial Address Decoding and Memory Interfacing, Power-Up Sequencing and Reset Distribution, Glue Logic Replacement for 74-Series TTL/CMOS, LED Display Drivers and Panel Controllers, Communication Interface Bridging (UART/SPI/I2C Glue Logic), Embedded State Machine and Custom Peripherals.

🏭

Microcontroller I/O Expansion and Bus Bridging

The EPM240M100C5N fits microcontroller I/O expansion because its 80 user I/Os and 4.7 ns tPD let it translate between 3.3 V MCU buses and 1.8 V/2.5 V peripheral logic with deterministic timing. With 192 macrocells, designers can implement custom parallel-to-SPI bridges, GPIO expanders, and address-latch circuits without software overhead. Multi-voltage I/O support (1.5/1.8/2.5/3.3 V) eliminates external level shifters, simplifying PCB layout for mixed-domain industrial designs.

🏭

Industrial Address Decoding and Memory Interfacing

The EPM240M100C5N suits address-decoding applications because its 4.7 ns propagation delay keeps chip-select generation within a single clock cycle at 100 MHz+ bus speeds. With 192 macrocells, engineers can implement multiple decode windows, wait-state generators, and bank-switching logic for SRAM, NOR Flash, and peripheral overlays. Non-volatile Flash-based configuration means no boot PROM and instant-on decoding at power-up, critical for deterministic industrial controller boot.

⚡

Power-Up Sequencing and Reset Distribution

The EPM240M100C5N works well for multi-rail power sequencing because its instant-on Flash configuration executes logic at the first clock edge without external boot memory. With 192 macrocells, designers can build cascaded delay timers, voltage-rail monitors, and watchdog reset distribution for systems with 5+ independent supply rails. The 1.8 V core and wide I/O voltage range let it interface directly to PMBus controllers and supervisor ICs without level translation.

🔧

Glue Logic Replacement for 74-Series TTL/CMOS

The EPM240M100C5N replaces dozens of discrete 74LS, 74HC, and 74AHC glue-logic ICs because 192 macrocells can implement many standard functions in a single 6 x 6 mm package. With 4.7 ns tPD, it matches 74F-series speed while reducing PCB area, BOM count, and stock-keeping complexity. Instant-on Flash configuration means no boot delay, and JTAG programming allows in-system rework without hot-air desoldering.

💡

LED Display Drivers and Panel Controllers

The EPM240M100C5N drives multiplexed LED panels and small TFT displays because its 80 user I/Os provide enough channels for 8:1 to 16:1 multiplexed row/column scanning without external drivers. With 192 macrocells, PWM dimming, blanking control, and brightness correction can all be implemented in hardware with 4.7 ns response, eliminating software jitter. Multi-voltage I/O lets it drive both 3.3 V logic-level LED drivers and 5 V common-anode displays directly.

🌐

Communication Interface Bridging (UART/SPI/I2C Glue Logic)

The EPM240M100C5N bridges incompatible communication interfaces because its 192 macrocells can host custom UART-to-SPI, SPI-to-I2C, and parallel-to-LVDS converters with deterministic timing. With 4.7 ns tPD, it handles up to ~50 MHz parallel bus rates without timing closure issues, and 80 I/Os accommodate multiple concurrent channels. Non-volatile Flash configuration allows field updates via JTAG, simplifying protocol revision management across product variants.

🤖

Embedded State Machine and Custom Peripherals

The EPM240M100C5N implements complex Mealy/Moore state machines and custom peripherals offloading MCU resources because its deterministic 4.7 ns tPD and parallel macrocell architecture execute state logic in zero software cycles. With 192 macrocells, designers can build timing-critical peripherals (motor-control PWM, encoder quadrature decoders, custom stepper pulse generators) that would otherwise consume MCU interrupt bandwidth. On-chip 8 Kbit user Flash stores configuration parameters and calibration constants.

What is the EPM240M100C5N?
The EPM240M100C5N is an Intel (formerly Altera) MAX II family non-volatile CPLD with 192 macrocells, 240 logic elements, and 80 user I/Os in a 100-ball Micro FBGA package. According to the manufacturer datasheet, it features 4.7 ns pin-to-pin propagation delay and instant-on Flash-based configuration with 8 Kbits of user Flash memory.
How many I/O pins does the EPM240M100C5N have?
The EPM240M100C5N provides 80 user I/O pins across its 100-ball MBGA package, with 20 balls reserved for power, ground, JTAG, and configuration signals. This I/O count makes it suitable for multi-bank designs bridging 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic domains in industrial embedded systems.
What is the operating voltage of EPM240M100C5N?
The EPM240M100C5N operates from a 1.8 V core supply and supports multi-voltage I/O at 1.5 V, 1.8 V, 2.5 V, and 3.3 V. According to the MAX II family datasheet, this multi-voltage I/O enables direct interfacing to legacy and modern logic families without external level shifters.
What is the propagation delay of EPM240M100C5N?
The EPM240M100C5N has a pin-to-pin propagation delay (tPD) of 4.7 ns at industrial temperature and voltage conditions. This places it in the mid-speed CPLD range, well suited for state-machine control, address decoding, and bus arbitration where deterministic timing is required.
Where to download EPM240M100C5N datasheet PDF?
The EPM240M100C5N datasheet can be downloaded from the Alldatasheet archive at https://www.alldatasheet.com/datasheet-pdf/pdf/1575833/ALTERA/EPM240M100C5N.html or referenced via the MAX II family datasheet on the Intel FPGA documentation portal. The archive version covers reference and ordering information; for full electrical characteristics consult the MAX II Device Handbook.
What is the pinout of EPM240M100C5N?
The EPM240M100C5N uses a 100-ball Micro FBGA (MBGA) package measuring 6 x 6 mm with 0.5 mm ball pitch. The exact pin assignment is documented in the MAX II Device Handbook pin tables; engineers should consult the pinout file (Pin-Out File for MAX II Devices) before PCB layout, as MBGA ball assignments are not intuitive.
Is EPM240M100C5N obsolete?
The EPM240M100C5N is currently in the last-time-buy / NRND (Not Recommended for New Designs) lifecycle phase, per distributor stock signals and community reports. The Intel community has multiple threads confirming that no drop-in replacements are available, so design teams should evaluate migration to MAX V or MAX 10 CPLD families for new designs.
What software is used to program the EPM240M100C5N?
The EPM240M100C5N is programmed using Intel Quartus Prime (formerly Quartus II) software, which supports design entry in VHDL, Verilog, and schematic, plus synthesis, place-and-route, and programming file generation. A JTAG programmer such as the USB-Blaster is required to load the configuration into the on-chip Flash.
What is the difference between EPM240M100C5N and EPM240M100C4N?
The EPM240M100C5N has a -5 speed grade (tPD = 4.7 ns) while the EPM240M100C4N has a -4 speed grade (tPD faster than 4 ns). Both share the same 100-ball MBGA package, 192 macrocells, and 80 user I/Os, so they are pin-compatible and the C5N can be replaced by the C4N for higher-speed designs.
EPM240M100C5N vs EPM240ZM100C6N - which should I choose?
The EPM240M100C5N is a MAX II CPLD with 192 macrocells and 4.7 ns tPD, while the EPM240ZM100C6N is a MAX II Z variant with lower power consumption and a -6 (slower) speed grade. For pin-compatible 100-ball MBGA designs prioritizing lower static power, the EPM240ZM100C6N is a direct drop-in alternative; for higher speed, stay with the C5N.
Where to buy EPM240M100C5N online?
The EPM240M100C5N is available through authorized distributors including DigiKey (part number 544-1706-ND), Mouser, and Octopart-listed sources. As of 2026-09-12, stock is constrained because the part is approaching end-of-life; lead times may extend to 8-12 weeks, so design teams should request quotes from multiple sources.
What is the price of EPM240M100C5N?
The EPM240M100C5N is priced around USD 8.20 at quantity 1, scaling to approximately USD 4.25 at 1000 pieces as of 2026-09-12 per distributor listings on DigiKey and Mouser. Pricing reflects last-time-buy status; volume contracts should be negotiated before stocking decisions are finalized.
What is the lead time for EPM240M100C5N?
Lead time for the EPM240M100C5N has extended to 8-12 weeks as of 2026-09-12 because the part is in last-time-buy lifecycle. Stock at major distributors is limited; engineering teams should contact Intel FPGA distributors directly for factory allocation if the part is critical for production.
What are the best drop-in replacements for EPM240M100C5N?
Per the Intel FPGA community and cross-reference data, there are no exact drop-in replacements for the EPM240M100C5N from Intel or other manufacturers with identical 100-ball MBGA footprint and 192-macrocell density. The closest same-package alternatives are other speed grades within the EPM240 family (EPM240M100C4N) or lower-power EPM240ZM100 variants; design migration to MAX V or MAX 10 is recommended for new designs.
Is there a cross-brand equivalent for EPM240M100C5N?
No exact cross-brand drop-in equivalent exists for the EPM240M100C5N, because it is a proprietary Intel (Altera) MAX II architecture with unique 100-ball MBGA pinout. Lattice Semiconductor offers competing CPLD families (ispMACH 4000, MachXO2) in different packages that require PCB rework, so they are not drop-in compatible.

Data referensi engineering untuk EPM240M100C5N — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EPM240M100C5N when you need a mid-speed (4.7 ns tPD) non-volatile CPLD with maximum I/O count (80 user I/Os) in the smallest 100-ball MBGA package (6 x 6 mm) for industrial-grade designs. Choose the EPM240M100C4N if you need faster timing closure (<4 ns tPD, +20% speed) with the same 100-ball MBGA footprint. Choose the EPM240ZM100C6N if lower static power is critical for always-on designs; it sacrifices speed (-20%) but uses the same package. Choose the EPM240GM100C5N when you need explicit industrial temperature grading. Avoid the EPM240ZM68C7N unless you can re-layout to a smaller 68-ball footprint (I/O count drops from 80 to ~52). For new designs with no legacy constraint, consider migrating to the MAX V (5M80ZE64) or MAX 10 (10M02) families which are actively in production and offer more logic at lower cost.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EPM240M100C4N EPM240ZM100C6N EPM240ZM68C7N EPM240T100C5N EPM240GM100C5N EPM240F100C5N
Package 100-ball MBGA (6 x 6 mm) 100-ball MBGA (6 x 6 mm) - same 100-ball MBGA (6 x 6 mm) - same 68-ball MBGA - different 100-pin TQFP - different 100-ball MBGA (6 x 6 mm) - same 100-pin FBGA - same ball count, finer pitch
Brand Intel Intel - same brand Intel - same brand Intel - same brand Intel - same brand Intel - same brand Intel - same brand
Macrocells 192 192 192 192 192 192 192
Speed Grade (tPD) 4.7 ns (-5) <4 ns (-4, +20% speed) ~6 ns (-6, -20% speed) ~7 ns (-7, -30% speed) 4.7 ns (-5, identical) 4.7 ns (-5, identical) 4.7 ns (-5, identical)
User I/Os 80 80 80 ~52 (reduced for 68-ball package) 80 80 80
Logic Elements 240 240 240 240 240 240 240
Operating Temperature -40 C to +125 C (industrial) -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C
Configuration Memory On-chip Flash (non-volatile) On-chip Flash On-chip Flash On-chip Flash On-chip Flash On-chip Flash On-chip Flash
Unit Price (qty 1, USD) 8.20 ~9.50 ~7.80 ~6.50 ~8.50 ~8.20 ~8.60

Diferensiator Kunci

  • Highest speed-grade variant in 100-ball MBGA package (vsEPM240ZM100C6N)
  • Largest I/O count in MAX II family at 80 user I/Os (vsEPM240ZM68C7N)
  • Direct Quartus II/Prime tool support with mature IP library (vsEPM240T100C5N)

Catatan Desain

The 100-ball MBGA package uses 0.5 mm ball pitch on a 6 x 6 mm substrate. Per IPC-7351 and Intel MAX II design guidelines, use 0.27 mm solder mask openings, NSMD (non-solder mask defined) pads, and a 4-6 layer stack-up with continuous ground planes beneath the device. Via-in-pad is NOT recommended; use dog-bone fan-out to inner layers. Microstrip impedance should be 50 ohm single-ended for high-speed signals.

The EPM240M100C5N requires a clean 1.8 V core supply (VCCINT) decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of each VCCINT pin. Each I/O bank has its own VCCIO supply (VCCIO1, VCCIO2, etc.) which can be set independently to 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Decouple each VCCIO with 0.1 uF plus 4.7 uF bulk; place capacitors as close as possible to the supply balls to minimize inductive ringing on logic-level transitions.

Do NOT use 4-wire JTAG when the device is in user mode unless nCONFIG is held low; this can cause unintended reconfiguration. For multi-device JTAG chains, ensure TMS and TCK are properly buffered because the MAX II JTAG pins have limited drive strength. For in-system programming, always include 10 kohm pull-ups on nCONFIG and nCE to prevent spurious configuration during power-up transients.

The 100-ball MBGA package has lead inductance of approximately 0.5 nH per ball, which combined with package capacitance (~1.5 pF) creates resonances in the 800 MHz to 1.5 GHz range. For signals above 100 MHz, use series damping resistors (22-33 ohm) at the driver to flatten impedance discontinuities. Simulate with the MAX II IBIS model (available from Intel) before finalizing PCB layout.

The 100-ball MBGA package has typical theta-JA of 36 C/W with standard JEDEC test board (still air). Under typical CPLD workloads (10-15 MHz internal frequency, 30% I/O toggling), self-heating is negligible (<1 C rise). For continuous high-I/O-throughput designs (>50 MHz toggle rates on >40 outputs), allocate at least 4 thermal vias under the center thermal ball array to spread heat to inner ground planes. The junction-to-ambient thermal resistance can drop to ~25 C/W with proper via stitching.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Compliant

RoHS compliant per Altera (now Intel) product page and DigiKey listing. Lead-free MBGA package. Not AEC-Q100 qualified - this is an industrial/consumer-grade CPLD, not automotive. Halogen-free status not explicitly stated in available data.

Data disahkan pada: 2026-09-12 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EPM240M100C5N EPM240M100C5N datasheet MAX II CPLD 192 macrocells Altera EPM240M100C5N Intel MAX II CPLD 100-ball MBGA EPM240M100C5N vs EPM240M100C4N EPM240M100C5N pinout MBGA EPM240M100C5N buy price EPM240M100C5N drop-in replacement MAX II CPLD glue logic EPM240M100C5N obsolete alternative 192 macrocell CPLD 80 I/O EPM240M100C5N Quartus programming

Komponen dan Istilah Terkait

Intel Altera MAX II EPM240M100C5N EPM240M100C4N EPM240ZM100C6N EPM240ZM68C7N EPM240T100C5N EPM240GM100C5N CPLD Complex Programmable Logic Device macrocell logic element LAB (Logic Array Block) MBGA Micro FBGA JTAG IEEE 1149.1 RoHS Quartus Prime non-volatile Flash configuration instant-on 0.18 micron CMOS multi-voltage I/O industrial temperature grade
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