Intel

EPM240M100C4N - 192 Macrocell MAX II CPLD, 100-MBGA | Intel / Altera

MPN: EPM240M100C4N ✓ Aktif

2.5 V / 3.3 V Vdss 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL Rds(on) 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch Package 247.5 MHz Speed 8 Kbit Memory

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EPM240M100C4N Ringkasan

The Intel / Altera EPM240M100C4N is a 192-macrocell non-volatile Complex Programmable Logic Device (CPLD) from the MAX II family, housed in a 100-pin Micro FineLine BGA (MBGA) package with a 6 x 6 mm body and 0.5 mm ball pitch. It delivers in-system programmability via JTAG, instant-on operation from on-chip flash configuration memory, and a worst-case pin-to-pin propagation delay (tPD) of 4.7 ns, supporting internal toggle frequencies up to 247.5 MHz across the supported 2.5 V / 3.3 V I/O standards.

A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on digital IC that combines multiple PAL-like logic blocks with a programmable interconnect fabric. Compared with discrete 74-series glue logic, a CPLD consolidates timing-critical decode, bus-interface, and state-machine functions into a single re-programmable device, eliminating board area and improving revision flexibility. Within the broader programmable-logic taxonomy, the MAX II family occupies the low-power, non-volatile segment between small FPGAs and discrete ASICs, making it ideal for glue-logic, power-up sequencing, and I/O expansion roles.

Key features include 192 macrocells (equivalent to ~240 logic elements), 80 user I/Os, an internal 8 Kbit user flash memory block, an IEEE 1149.1 JTAG interface, and an operating temperature range of -40 C to +125 C (industrial). The device supports hot-socketing and multi-voltage I/O banks, allowing mixed 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing on a single die. Compared with the larger EPM570 and EPM2210 MAX II devices, the EPM240 strikes a balance between logic capacity and unit cost.

Architecturally, the EPM240 uses a 0.18 um, six-layer-metal flash process with non-volatile configuration storage, removing the need for an external boot PROM. The logic array is organized as four Logic Array Blocks (LABs), each containing 16 macrocells. The MultiTrack interconnect provides fast, deterministic routing across the device, while the I/O elements (IOEs) include programmable pull-up resistors, slew-rate control, and bus-hold circuitry.

Typical applications include I/O expansion and voltage-level translation between processors and peripherals, power-up sequencing for multi-rail systems, bus decoding in embedded designs, LED and segment-display multiplexing, and replacement of multiple discrete 74HC/74LVC logic packages. Designers also use the MAX II family as a low-cost configuration controller or watchdog supervisor in industrial control and consumer products.

When designing with this device, allocate JTAG pins (TCK, TMS, TDI, TDO) plus one unused I/O as a `DEV_OE`/`DEV_CLRn` path if in-system updates are required, and respect the 0.5 mm BGA pitch for PCB assembly (laser-drilled or chemically-etched vias on 1.0 mm pitch with 0.25 mm capture pad are typical).

This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cross-reference to MAX II G, MAX V, and EPM240 TQFP-package derivatives that share the 100-ball footprint in different formats.

Alternatif penggantian untuk EPM240M100C4N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM240M100C4N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Process Technology, Configuration Memory, RoHS Status.

EPM240GF100C5N

Intel

Package: 100-ball FBGA (11 x 11 mm, 1.0 mm pitch)

Operating Temperature: -40 C to +125 C

Process Technology: 0.18 um