Intel

EPM570GT144C4 - 570 LEs, 5.4ns CPLD, 144-TQFP | Intel MAX II

MPN: EPM570GT144C4 ✓ Aktif

1.8 V Vdss LVCMOS / LVTTL 1.5/1.8/2.5/3.3/5 V (MultiVolt) Rds(on) TQFP-144 (GT) Package 247.5 MHz Speed 8 Kbits Memory

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EPM570GT144C4 Ringkasan

The Intel (formerly Altera) EPM570GT144C4 is a non-volatile CPLD from the MAX II family featuring 570 logic elements (440 macrocells equivalent), 8 Kbits of internal Flash memory, and a maximum pin-to-pin propagation delay of 5.4 ns, housed in a 144-pin TQFP (GT) package. It is fabricated on a 0.18 µm, 6-layer-metal flash process and operates from a 1.8 V core supply with 3.3 V LVCMOS/LVTTL I/O, targeting instant-on, low-cost glue-logic applications.

A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-configurable digital logic IC that sits between discrete logic gates and FPGAs in the programmable logic hierarchy. The MAX II family pioneered instant-on, flash-based configuration that eliminates the external configuration memory required by SRAM FPGAs, while still offering JTAG-based in-system programmability (ISP) and IEEE 1532 support for boundary-scan testing. Within this hierarchy, MAX II occupies the position: programmable logic -> CPLD -> non-volatile CPLD -> instant-on glue logic.

Key features of the EPM570GT144C4 include 8 Kbits of embedded Flash user memory, an internal oscillator, JTAG support via IEEE 1149.1, and a MultiVolt I/O core that interfaces directly with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic. The device offers enhanced ISP capabilities that allow real-time programming while the device is operating in-system, plus built-in JTAG pull-ups and Schmitt-trigger action on inputs for noise immunity in industrial environments. Speed grade C4 places it in the mid-range of the MAX II performance envelope.

Architecturally, the device uses a Logic Array Block (LAB) topology with each LAB containing 16 logic elements, an interconnect switch matrix called the MultiTrack interconnect, and a shared user Flash memory block. The 0.18 µm flash process means the configuration is non-volatile and the device powers up ready to operate in microseconds, eliminating boot-time wait states common in SRAM FPGAs. The 5.4 ns worst-case pin-to-pin delay supports high-speed glue-logic duties up to approximately 175 MHz.

Typical applications include I/O expansion and bus bridging in industrial controllers, power-sequencing logic in telecom line cards, address decoding in legacy microprocessor systems, and high-speed glue logic in consumer devices. Designers also use it as a low-cost re-programmable alternative to discrete 74-series logic for prototype-to-production transitions.

A key design consideration is the device's 8 Kbit user Flash memory block which can be partitioned between logic configuration and user data storage, enabling on-board EEPROM-like functionality without an external memory chip. Vertical migration within the MAX II family is supported: EPM570, EPM1270, and EPM2210 share the same 256-pin FineLine BGA footprint, simplifying board scalability.

This page synthesizes distributor pricing from DigiKey and Octopart, drop-in same-family alternatives sourced from XAIPART's internal MPN catalog, and practical MAX II design notes not found in the manufacturer datasheet alone.

Alternatif penggantian untuk EPM570GT144C4 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM570GT144C4 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Process Technology, Programming Interface, Mounting Type.

EPM570GF256C4N

Altera

Package: 256-ball FineLine BGA (FBGA-256)

Operating Temperature: -40 °C to +125 °C (industrial)

Programming Interface: JTAG (IEEE 1149.1), in-system programmable