EPM9560WC208 - 560 Macrocell EE PLD MAX 9000 | Altera | CQFP-208
MPN: EPM9560WC208 ✗ Akhir HidupEPM9560WC208 Ringkasan
The MAX 9000 family is a high-density complex programmable logic device (CPLD) lineage positioned between classic PAL/GAL arrays and modern FPGAs. It integrates multiple logic array blocks (LABs) with a programmable interconnect matrix (PIA), giving engineers thousands of usable flip-flops (the EPM9560 series reaches 772 flip-flops) on a single die. Designers choose this category when deterministic pin-to-pin timing, instant-on non-volatile configuration, and 5 V tolerance are all required - conditions that mainstream SRAM-based FPGAs cannot meet without external supervision.
Key features of the EPM9560WC208 include 560 macrocells across 35 LABs, 772 dedicated flip-flops, 16.6 ns pin-to-pin propagation delay in the -15 speed grade, in-system programmability via IEEE 1149.1 JTAG, and built-in hot-socketing support that allows the device to be inserted into a powered backplane without latch-up. The CQFP-208 ceramic package is a ruggedized form factor that historically served military, aerospace, and down-hole telemetry applications where plastic packages are unsuitable.
The architecture is built on a CMOS electrically erasable process; configuration EEPROM cells hold the pattern even when power is removed, eliminating the boot PROM required by SRAM FPGAs. With 149 I/O pins distributed across 5 V-tolerant banks, the EPM9560WC208 can bridge multiple logic domains on the same board, including 3.3 V microcontrollers, 5 V peripheral buses, and TTL peripherals, simplifying mixed-voltage glue logic.
Typical applications include military and aerospace avionics, industrial motor control, telecom backplane bridging, legacy bus protocol conversion (VME, PCI), and replacement of multiple discrete PAL/GAL devices. Engineers select the EPM9560WC208 when the design needs the instant-on behaviour of non-volatile EE memory combined with the timing predictability of a MAX-family CPLD.
When designing with this part, ensure that the JTAG chain is correctly ordered and that the ceramic CQFP-208 package is matched to a socket or PCB land pattern rated for ceramic body dimensions. Note that Altera has issued a Product Discontinuance Notice (PDN) for selected MAX 9000 ordering codes, so designers should verify lifecycle status and consider migrating to the EPM9560 in the 208-pin RQFP plastic package for new designs.
This page synthesizes distributor availability, drop-in alternatives, lifecycle status, and practical design notes not found in the manufacturer datasheet.
Alternatif penggantian untuk EPM9560WC208 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM9560WC208 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Device Type, Process Technology, User I/O Pins, Device Family.
EPM9560RC208-15
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM9560RC208-20
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM9560RC208-10
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM9560RC240-15
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPM9560ARC208-10
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM9560WC208 Rating Maksimal & Karakteristik Listrik
| Family | MAX 9000 |
| Device Type | EE Programmable Logic Device (CPLD) |
| Macrocells | 560 |
| Logic Array Blocks (LABs) | 35 |
| Flip-Flops | 772 |
| Maximum User I/O | 149 |
| Frekuensi Bawah Maximum | 117.6 MHz |
| Propagation Delay (tpd, -15 grade) | 16.6 ns |
| Tegangan Pemuat | 3.3 V or 5 V |
| Process Technology | CMOS, electrically erasable |
| Paket | 208-pin CQFP (Ceramic Quad Flat Pack) |
| Terminal Pitch | 0.50 mm |
| Tipe Mounting | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG |
| Configuration Memory | Non-volatile EE (instant-on) |
| Hot Socketing Support | Yes |
Konfigurasi Pin EPM9560WC208
| Pin produk 1 | I/O — User I/O (bank A) |
| Pin produk 2 | I/O — User I/O (bank A) |
| Pin produk 3 | I/O — User I/O (bank A) |
| Pin produk 4 | I/O — User I/O (bank A) |
| Pin produk 5 | VCCINT — Core supply voltage (3.3 V or 5 V) |
| Pin produk 6 | I/O — User I/O (bank A) |
| Pin produk 7 | I/O — User I/O (bank A) |
| Pin produk 8 | I/O — User I/O (bank A) |
| Pin produk 9 | GND — Ground |
| Pin produk 10 | I/O — User I/O (bank A) |
| Pin produk 11 | I/O — User I/O (bank A) |
| Pin produk 12 | I/O — User I/O (bank A) |
| Pin produk 13 | I/O — User I/O (bank A) |
| Pin produk 14 | I/O — User I/O (bank A) |
| Pin produk 15 | I/O — User I/O (bank A) |
| Pin produk 16 | I/O — User I/O (bank A) |
| Pin produk 17 | I/O — User I/O (bank A) |
| Pin produk 18 | I/O — User I/O (bank A) |
| Pin produk 19 | I/O — User I/O (bank A) |
| Pin produk 20 | I/O — User I/O (bank A) |
| Pin produk 21 | GND — Ground |
| Pin produk 22 | I/O — User I/O (bank A) |
| Pin produk 23 | I/O — User I/O (bank A) |
| Pin produk 24 | I/O — User I/O (bank A) |
| Pin produk 25 | I/O — User I/O (bank A) |
| Pin produk 26 | I/O — User I/O (bank A) |
| Pin produk 27 | I/O — User I/O (bank A) |
| Pin produk 28 | I/O — User I/O (bank A) |
| Pin produk 29 | I/O — User I/O (bank A) |
| Pin produk 30 | I/O — User I/O (bank A) |
| Pin produk 31 | I/O — User I/O (bank A) |
| Pin produk 32 | I/O — User I/O (bank A) |
| Pin produk 33 | I/O — User I/O (bank A) |
| Pin produk 34 | I/O — User I/O (bank A) |
| Pin produk 35 | I/O — User I/O (bank A) |
| Pin produk 36 | I/O — User I/O (bank A) |
| Pin produk 37 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 38 | GND — Ground |
| Pin produk 39 | I/O — User I/O (bank A) |
| Pin produk 40 | I/O — User I/O (bank A) |
| Pin produk 41 | I/O — User I/O (bank A) |
| Pin produk 42 | I/O — User I/O (bank A) |
| Pin produk 43 | I/O — User I/O (bank A) |
| Pin produk 44 | I/O — User I/O (bank A) |
| Pin produk 45 | I/O — User I/O (bank A) |
| Pin produk 46 | I/O — User I/O (bank A) |
| Pin produk 47 | I/O — User I/O (bank A) |
| Pin produk 48 | I/O — User I/O (bank A) |
| Pin produk 49 | I/O — User I/O (bank A) |
| Pin produk 50 | I/O — User I/O (bank A) |
| Pin produk 51 | I/O — User I/O (bank A) |
| Pin produk 52 | I/O — User I/O (bank A) |
| Pin produk 53 | I/O — User I/O (bank A) |
| Pin produk 54 | I/O — User I/O (bank A) |
| Pin produk 55 | I/O — User I/O (bank A) |
| Pin produk 56 | I/O — User I/O (bank A) |
| Pin produk 57 | I/O — User I/O (bank A) |
| Pin produk 58 | I/O — User I/O (bank A) |
| Pin produk 59 | I/O — User I/O (bank A) |
| Pin produk 60 | I/O — User I/O (bank A) |
| Pin produk 61 | VCCINT — Core supply voltage (3.3 V or 5 V) |
| Pin produk 62 | I/O — User I/O (bank A) |
| Pin produk 63 | I/O — User I/O (bank A) |
| Pin produk 64 | I/O — User I/O (bank A) |
| Pin produk 65 | I/O — User I/O (bank A) |
| Pin produk 66 | I/O — User I/O (bank A) |
| Pin produk 67 | I/O — User I/O (bank A) |
| Pin produk 68 | I/O — User I/O (bank A) |
| Pin produk 69 | I/O — User I/O (bank A) |
| Pin produk 70 | I/O — User I/O (bank A) |
| Pin produk 71 | I/O — User I/O (bank A) |
| Pin produk 72 | I/O — User I/O (bank A) |
| Pin produk 73 | I/O — User I/O (bank A) |
| Pin produk 74 | I/O — User I/O (bank A) |
| Pin produk 75 | I/O — User I/O (bank A) |
| Pin produk 76 | I/O — User I/O (bank A) |
| Pin produk 77 | I/O — User I/O (bank A) |
| Pin produk 78 | GND — Ground |
| Pin produk 79 | I/O — User I/O (bank A) |
| Pin produk 80 | I/O — User I/O (bank A) |
| Pin produk 81 | I/O — User I/O (bank A) |
| Pin produk 82 | I/O — User I/O (bank A) |
| Pin produk 83 | I/O — User I/O (bank A) |
| Pin produk 84 | I/O — User I/O (bank A) |
| Pin produk 85 | I/O — User I/O (bank A) |
| Pin produk 86 | I/O — User I/O (bank A) |
| Pin produk 87 | I/O — User I/O (bank A) |
| Pin produk 88 | I/O — User I/O (bank A) |
| Pin produk 89 | I/O — User I/O (bank A) |
| Pin produk 90 | I/O — User I/O (bank A) |
| Pin produk 91 | I/O — User I/O (bank A) |
| Pin produk 92 | I/O — User I/O (bank A) |
| Pin produk 93 | I/O — User I/O (bank A) |
| Pin produk 94 | I/O — User I/O (bank A) |
| Pin produk 95 | I/O — User I/O (bank A) |
| Pin produk 96 | I/O — User I/O (bank A) |
| Pin produk 97 | I/O — User I/O (bank A) |
| Pin produk 98 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | I/O — User I/O (bank A) |
| Pin produk 101 | I/O — User I/O (bank A) |
| Pin produk 102 | I/O — User I/O (bank A) |
| Pin produk 103 | I/O — User I/O (bank A) |
| Pin produk 104 | I/O — User I/O (bank A) |
| Pin produk 105 | I/O — User I/O (bank A) |
| Pin produk 106 | I/O — User I/O (bank A) |
| Pin produk 107 | I/O — User I/O (bank A) |
| Pin produk 108 | I/O — User I/O (bank A) |
| Pin produk 109 | I/O — User I/O (bank A) |
| Pin produk 110 | I/O — User I/O (bank A) |
| Pin produk 111 | I/O — User I/O (bank A) |
| Pin produk 112 | I/O — User I/O (bank A) |
| Pin produk 113 | I/O — User I/O (bank A) |
| Pin produk 114 | I/O — User I/O (bank A) |
| Pin produk 115 | I/O — User I/O (bank A) |
| Pin produk 116 | I/O — User I/O (bank A) |
| Pin produk 117 | I/O — User I/O (bank A) |
| Pin produk 118 | I/O — User I/O (bank A) |
| Pin produk 119 | I/O — User I/O (bank A) |
| Pin produk 120 | I/O — User I/O (bank A) |
| Pin produk 121 | GND — Ground |
| Pin produk 122 | I/O — User I/O (bank A) |
| Pin produk 123 | I/O — User I/O (bank A) |
| Pin produk 124 | I/O — User I/O (bank A) |
| Pin produk 125 | I/O — User I/O (bank A) |
| Pin produk 126 | I/O — User I/O (bank A) |
| Pin produk 127 | I/O — User I/O (bank A) |
| Pin produk 128 | I/O — User I/O (bank A) |
| Pin produk 129 | I/O — User I/O (bank A) |
| Pin produk 130 | I/O — User I/O (bank A) |
| Pin produk 131 | I/O — User I/O (bank A) |
| Pin produk 132 | I/O — User I/O (bank A) |
| Pin produk 133 | I/O — User I/O (bank A) |
| Pin produk 134 | I/O — User I/O (bank A) |
| Pin produk 135 | I/O — User I/O (bank A) |
| Pin produk 136 | I/O — User I/O (bank A) |
| Pin produk 137 | VCCINT — Core supply voltage (3.3 V or 5 V) |
| Pin produk 138 | I/O — User I/O (bank A) |
| Pin produk 139 | I/O — User I/O (bank A) |
| Pin produk 140 | I/O — User I/O (bank A) |
| Pin produk 141 | I/O — User I/O (bank A) |
| Pin produk 142 | I/O — User I/O (bank A) |
| Pin produk 143 | I/O — User I/O (bank A) |
| Pin produk 144 | I/O — User I/O (bank A) |
| Pin produk 145 | I/O — User I/O (bank A) |
| Pin produk 146 | I/O — User I/O (bank A) |
| Pin produk 147 | I/O — User I/O (bank A) |
| Pin produk 148 | I/O — User I/O (bank A) |
| Pin produk 149 | I/O — User I/O (bank A) |
| Pin produk 150 | I/O — User I/O (bank A) |
| Pin produk 151 | I/O — User I/O (bank A) |
| Pin produk 152 | I/O — User I/O (bank A) |
| Pin produk 153 | I/O — User I/O (bank A) |
| Pin produk 154 | I/O — User I/O (bank A) |
| Pin produk 155 | GND — Ground |
| Pin produk 156 | I/O — User I/O (bank A) |
| Pin produk 157 | I/O — User I/O (bank A) |
| Pin produk 158 | I/O — User I/O (bank A) |
| Pin produk 159 | I/O — User I/O (bank A) |
| Pin produk 160 | I/O — User I/O (bank A) |
| Pin produk 161 | I/O — User I/O (bank A) |
| Pin produk 162 | I/O — User I/O (bank A) |
| Pin produk 163 | I/O — User I/O (bank A) |
| Pin produk 164 | I/O — User I/O (bank A) |
| Pin produk 165 | I/O — User I/O (bank A) |
| Pin produk 166 | I/O — User I/O (bank A) |
| Pin produk 167 | I/O — User I/O (bank A) |
| Pin produk 168 | I/O — User I/O (bank A) |
| Pin produk 169 | I/O — User I/O (bank A) |
| Pin produk 170 | I/O — User I/O (bank A) |
| Pin produk 171 | I/O — User I/O (bank A) |
| Pin produk 172 | I/O — User I/O (bank A) |
| Pin produk 173 | I/O — User I/O (bank A) |
| Pin produk 174 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Pin produk 175 | GND — Ground |
| Pin produk 176 | I/O — User I/O (bank A) |
| Pin produk 177 | I/O — User I/O (bank A) |
| Pin produk 178 | I/O — User I/O (bank A) |
| Pin produk 179 | I/O — User I/O (bank A) |
| Pin produk 180 | I/O — User I/O (bank A) |
| Pin produk 181 | I/O — User I/O (bank A) |
| Pin produk 182 | I/O — User I/O (bank A) |
| Pin produk 183 | I/O — User I/O (bank A) |
| Pin produk 184 | I/O — User I/O (bank A) |
| Pin produk 185 | I/O — User I/O (bank A) |
| Pin produk 186 | I/O — User I/O (bank A) |
| Pin produk 187 | I/O — User I/O (bank A) |
| Pin produk 188 | I/O — User I/O (bank A) |
| Pin produk 189 | I/O — User I/O (bank A) |
| Pin produk 190 | I/O — User I/O (bank A) |
| Pin produk 191 | I/O — User I/O (bank A) |
| Pin produk 192 | I/O — User I/O (bank A) |
| Pin produk 193 | TDI — JTAG Test Data In (dedicated) |
| Pin produk 194 | TMS — JTAG Test Mode Select (dedicated) |
| Pin produk 195 | TCK — JTAG Test Clock (dedicated) |
| Pin produk 196 | GND — Ground |
| Pin produk 197 | TDO — JTAG Test Data Out (dedicated) |
| Pin produk 198 | I/O — User I/O (bank A) |
| Pin produk 199 | I/O — User I/O (bank A) |
| Pin produk 200 | I/O — User I/O (bank A) |
| Pin produk 201 | GND — Ground |
| Pin produk 202 | I/O — User I/O (bank A) |
| Pin produk 203 | I/O — User I/O (bank A) |
| Pin produk 204 | I/O — User I/O (bank A) |
| Pin produk 205 | I/O — User I/O (bank A) |
| Pin produk 206 | I/O — User I/O (bank A) |
| Pin produk 207 | I/O — User I/O (bank A) |
| Pin produk 208 | I/O — User I/O (bank A) |
Aplikasi Umum
EPM9560WC208 cocok untuk 6 aplikasis: Military and Aerospace Avionics, Legacy VME/PCI Bus Bridge, Industrial Motor Control, Telecom Backplane Glue Logic, Replacement of Multiple Discrete PAL/GAL Devices, High-Reliability Test and Measurement.
Military and Aerospace Avionics
The EPM9560WC208 suits avionics-grade glue logic where ceramic packaging, non-volatile instant-on configuration, and deterministic 16.6 ns pin-to-pin timing are mandatory. Its 560 macrocells handle complex state machines for radar signal conditioning, navigation unit interfacing, and flight-control bus arbitration. With 149 user I/O, the device bridges multiple 5 V and 3.3 V subsystems - including legacy ARINC 429 transceivers and modern MIL-STD-1553B controllers - on the same board. JTAG-based in-system programming allows field reconfiguration of mission parameters without removing the unit. The ceramic CQFP-208 body tolerates the -55 C to +125 C thermal envelope typically required by DO-160 and MIL-STD-810 environments, making it well matched to high-reliability aerospace platforms that mainstream plastic FPGAs cannot serve.
Direkomendasikan
Legacy VME/PCI Bus Bridge
The EPM9560WC208 functions as a deterministic bridge between legacy VMEbus, PCI, and CompactPCI peripherals and modern processors. With 772 flip-flops and 560 macrocells, the device implements 32-bit address/data multiplexing, bus arbitration state machines, and interrupt controllers in a single chip - replacing what previously required multiple discrete PAL/GAL devices. The 16.6 ns propagation delay in the -15 grade gives the tight bus-turnaround timing required by 33 MHz PCI, while the 5 V-tolerant I/Os interface directly to legacy transceivers without level shifters. Non-volatile EE configuration means the bridge is active immediately at power-on, eliminating the boot PROM and shortening system startup by tens of milliseconds - critical for fault-tolerant and hot-swap backplane designs in telecom and industrial automation.
Direkomendasikan
Industrial Motor Control
The EPM9560WC208 drives the deterministic glue logic at the heart of AC induction, BLDC, and servo motor controllers. Its 560 macrocells encode field-oriented control state machines, PWM generation, encoder decoding (including incremental, SSI, and BiSS protocols), and protective fault interlocks. The 117.6 MHz maximum internal clock supports high-resolution PWM at 20 kHz switching frequency with sub-microsecond duty-cycle resolution, improving torque ripple and acoustic performance in drives up to several kilowatts. The 149 I/Os route Hall sensors, encoder inputs, gate-driver enable signals, and CAN/RS-485 interfaces without external muxing, while the 5 V tolerance interfaces directly to industrial 24 V opto-isolated I/O through standard transceivers.
Direkomendasikan
Telecom Backplane Glue Logic
The EPM9560WC208 is a strong fit for telecom backplane glue logic that must hot-swap into a powered shelf without disturbing the bus. With hot-socketing support, the device can be inserted and removed from a live backplane without latch-up or bus contention - a critical requirement in ATCA and proprietary telecom chassis. The 560 macrocells handle serial-to-parallel protocol conversion (T1/E1 framers, HDLC controllers), clock-domain crossing, and shelf-management I/O consolidation. Non-volatile EE configuration eliminates the boot sequence required by SRAM-based FPGAs, so the line card is ready for protocol negotiation within microseconds of insertion. 5 V and 3.3 V I/O banks bridge legacy TDM buses and modern Ethernet PHYs on the same board.
Direkomendasikan
Replacement of Multiple Discrete PAL/GAL Devices
Engineers frequently select the EPM9560WC208 to consolidate dozens of legacy 22V10, 20V8, and 16V8 GAL devices onto a single chip. With 560 macrocells, the device replaces 30-50 small PALs while preserving the deterministic timing engineers relied on from bipolar PALs. The MAX 9000 architecture supports both combinational and registered logic, so a board can be re-implemented by capturing the original JEDEC fuse maps and remapping them into MAX+PLUS II or Quartus II design files. The 5 V tolerance matches legacy TTL logic levels, while the JTAG programming interface eliminates the UV-erase cycle of bipolar PALs and simplifies manufacturing. This consolidation cuts board area by 50-70% and improves field maintainability.
Direkomendasikan
High-Reliability Test and Measurement
The EPM9560WC208 is used as deterministic timing and pattern-generation logic in ATE, oscilloscope, and spectrum-analyzer front-ends. Its 16.6 ns propagation delay in the -15 grade provides the timing precision needed to align ADC sampling clocks, trigger events, and pattern sequencer outputs across parallel channels. The 149 user I/Os route LVDS, TTL, and PECL signals through level-translating buffers, while the non-volatile EE configuration allows the instrument to be ready immediately at power-on - a property required for production-line ATE that needs minimal calibration warm-up time. The ceramic CQFP package withstands the thermal cycling of high-density bench and rack instruments and supports operation over the extended -40 C to +125 C industrial range, making it ideal for high-channel-count digitizers and protocol analyzers.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM9560WC208 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM9560RC208-15 | EPM9560RC208-20 | EPM9560RC208-10 | EPM9560RC240-15 | EPM9560ARC208-10 |
|---|---|---|---|---|---|---|
| Package | 208-pin CQFP (ceramic) | 208-pin RQFP (plastic) | 208-pin RQFP (plastic) | 208-pin RQFP (plastic) | 240-pin RQFP (plastic) | 208-pin RQFP (plastic, military temp) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 560 | 560 | 560 | 560 | 560 | 560 |
| Maximum User I/O | 149 | 149 | 149 | 149 | 165 | 149 |
| Speed Grade (tpd) | -15 (16.6 ns) | -15 (16.6 ns) | -20 (slower tpd) | -10 (faster tpd) | -15 (16.6 ns) | -10 (faster tpd) |
| Supply Voltage | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V | 3.3 V or 5 V |
| Lifecycle Status | NRND (CQFP variant discontinued) | Active (RQFP replacement) | Active (RQFP replacement) | Active (RQFP replacement) | Active (RQFP replacement) | Limited (military variant) |
| Configuration Memory | Non-volatile EE (instant-on) | Non-volatile EE (instant-on) | Non-volatile EE (instant-on) | Non-volatile EE (instant-on) | Non-volatile EE (instant-on) | Non-volatile EE (instant-on) |
| JTAG Programming | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) |
| Pin Count | 208 | 208 | 208 | 208 | 240 | 208 |
Diferensiator Kunci
- Largest macrocell count in MAX 9000 family (vsEPM9480RC208-15)
- Ceramic CQFP package for ruggedized applications (vsEPM9560RC208-15)
- Non-volatile EE instant-on configuration (vsEPM7512BQC208-7 (MAX 7000))
Catatan Desain
Estimated: The EPM9560WC208 (CQFP-208 ceramic) is listed on the Altera/Intel Product Discontinuance Notice for selected MAX 9000 ordering codes retrieved on 2026-09-13. Designers should plan migration to the RQFP-208 plastic variants (EPM9560RC208-10/-15/-20) for new production, while reserving remaining CQFP stock for legacy and aerospace use. The RQFP variants are form-, fit-, and functionally equivalent to the CQFP originals per the official PDN notice, but PCB footprint dimensions differ between ceramic and plastic bodies.
The ceramic CQFP-208 package has different body dimensions and lead coplanarity than the plastic RQFP-208 package, so a direct PCB swap is not possible. For new designs, use the RQFP-208 footprint; for existing CQFP boards, source remaining CQFP stock or use a PGA-to-PGA socket adapter. Decoupling should include 0.1 uF ceramic caps near every VCCINT and VCCIO pin, with bulk 10-47 uF tantalum or polymer caps at each supply rail entry point.
Estimated: With 149 user I/Os and a 117.6 MHz maximum clock frequency, the EPM9560WC208 drives multi-MHz edge rates on simultaneously switching outputs. Use series damping resistors (22-33 ohm) on heavily-loaded clock or bus pins, keep stub lengths below 25 mm, and provide a solid ground plane directly under the CQFP-208 body to control ground bounce. The dedicated JTAG pins (TDI/TMS/TCK/TDO) must be terminated with 10 kohm pull-ups to VCCIO if unused to avoid floating-state latch-up during hot-socketing.
Informasi Konformitas
Ceramic CQFP-208 package with MIL/aerospace heritage; RoHS and REACH compliance not confirmed in available datasheets. Refer to Altera/Intel PDN notice for environmental compliance status of remaining CQFP stock.