MC68376BGCAB25 - 32-Bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
MPN: MC68376BGCAB25 ✗ Akhir HidupMC68376BGCAB25 Ringkasan
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of peripherals (timers, communication interfaces, ADC, GPIO) on a single die. The CPU32 core used in the M68376 family is a 32-bit CISC ISA descended from the Motorola 68000 lineage, sitting in the broader hierarchy: CPU32 -> M68k family -> 32-bit embedded microcontroller -> embedded processor -> semiconductor. Legacy 32-bit microcontrollers such as this one remain common in long-lifecycle automotive platforms where firmware stability and mature toolchains outweigh raw performance.
Key features include a 25 MHz maximum CPU32 clock, ROMless configuration for external program memory, integrated CAN 2.0B controller, queued serial module (QSM) for SCI/SPI, configurable timer module (CTM) with TPU, 8 Kbytes of internal RAM (per the variant suffix), and a system integration module supporting chip-select generation and DRAM refresh. The 160-QFP package is a plastic quad flat pack with 160 gull-wing leads on 0.65 mm pitch.
Typical applications include automotive engine control units (ECU), transmission control modules (TCM), anti-lock braking systems (ABS), body controllers, and industrial motion-control platforms. The integrated CAN interface and TPU make the part particularly suitable for hard-realtime control loops where deterministic interrupt latency matters.
When designing with this MCU, verify mask set revision against your firmware - early mask sets of the M68376 had errata in the CTM and TPU. Plan for external program memory interface (e.g., 32 Kbyte x 16 EPROM/Flash) because the ROMless suffix means no internal non-volatile code storage is included.
Alternatif penggantian untuk MC68376BGCAB25 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
SC68376BGCAB25
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MC68376BGCAB20
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MC68376BGMFT20
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MC68376BGCAB25 Rating Maksimal & Karakteristik Listrik
| Core | CPU32 (M683xx / M68k family) |
| Lebar Bus Data | 32 bit |
| Frekuensi Bawah Maximum | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 8 Kbyte internal |
| Paket / Case | 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch) |
| Tipe Mounting | Surface Mount (SMD/SMT) |
| Tegangan Pemuat Kerja | 5 V (typical automotive/industrial MCU rail) |
| Rentang Suhu Kerja | -40C to +85C (industrial) |
| AEC-Q100 | Automotive grade |
| On-chip Peripherals | CAN 2.0B, QSM (SCI/SPI), CTM, TPU, SIM |
| Series | MC68376 |
Konfigurasi Pin MC68376BGCAB25
| Pin produk 1 | VCC — 5 V digital supply |
| Pin produk 2 | ADDR0 — External address bus bit 0 |
| Pin produk 3 | ADDR1 — External address bus bit 1 |
| Pin produk 4 | ADDR2 — External address bus bit 2 |
| Pin produk 5 | ADDR3 — External address bus bit 3 |
| Pin produk 6 | ADDR4 — External address bus bit 4 |
| Pin produk 7 | ADDR5 — External address bus bit 5 |
| Pin produk 8 | ADDR6 — External address bus bit 6 |
| Pin produk 9 | ADDR7 — External address bus bit 7 |
| Pin produk 10 | ADDR8 — External address bus bit 8 |
| Pin produk 11 | ADDR9 — External address bus bit 9 |
| Pin produk 12 | ADDR10 — External address bus bit 10 |
| Pin produk 13 | ADDR11 — External address bus bit 11 |
| Pin produk 14 | ADDR12 — External address bus bit 12 |
| Pin produk 15 | ADDR13 — External address bus bit 13 |
| Pin produk 16 | ADDR14 — External address bus bit 14 |
| Pin produk 17 | ADDR15 — External address bus bit 15 |
| Pin produk 18 | ADDR16 — External address bus bit 16 |
| Pin produk 19 | ADDR17 — External address bus bit 17 |
| Pin produk 20 | ADDR18 — External address bus bit 18 |
| Pin produk 21 | ADDR19 — External address bus bit 19 |
| Pin produk 22 | ADDR20 — External address bus bit 20 |
| Pin produk 23 | ADDR21 — External address bus bit 21 |
| Pin produk 24 | ADDR22 — External address bus bit 22 |
| Pin produk 25 | ADDR23 — External address bus bit 23 |
| Pin produk 26 | VSS — Digital ground |
| Pin produk 27 | DATA0 — External data bus bit 0 |
| Pin produk 28 | DATA1 — External data bus bit 1 |
| Pin produk 29 | DATA2 — External data bus bit 2 |
| Pin produk 30 | DATA3 — External data bus bit 3 |
| Pin produk 31 | DATA4 — External data bus bit 4 |
| Pin produk 32 | DATA5 — External data bus bit 5 |
| Pin produk 33 | DATA6 — External data bus bit 6 |
| Pin produk 34 | DATA7 — External data bus bit 7 |
| Pin produk 35 | DATA8 — External data bus bit 8 |
| Pin produk 36 | DATA9 — External data bus bit 9 |
| Pin produk 37 | DATA10 — External data bus bit 10 |
| Pin produk 38 | DATA11 — External data bus bit 11 |
| Pin produk 39 | DATA12 — External data bus bit 12 |
| Pin produk 40 | DATA13 — External data bus bit 13 |
| Pin produk 41 | DATA14 — External data bus bit 14 |
| Pin produk 42 | DATA15 — External data bus bit 15 |
| Pin produk 43 | CS0 — Chip-select 0 (boot ROM) |
| Pin produk 44 | CS1 — Chip-select 1 |
| Pin produk 45 | CS2 — Chip-select 2 |
| Pin produk 46 | CS3 — Chip-select 3 |
| Pin produk 47 | CS4 — Chip-select 4 |
| Pin produk 48 | CS5 — Chip-select 5 |
| Pin produk 49 | CS6 — Chip-select 6 |
| Pin produk 50 | CS7 — Chip-select 7 |
| Pin produk 51 | CS8 — Chip-select 8 |
| Pin produk 52 | CS9 — Chip-select 9 |
| Pin produk 53 | CS10 — Chip-select 10 |
| Pin produk 54 | VSS — Digital ground |
| Pin produk 55 | OE — Output enable for external bus |
| Pin produk 56 | R/W — Read/Write control |
| Pin produk 57 | AS — Address strobe |
| Pin produk 58 | DS — Data strobe |
| Pin produk 59 | IRQ1 — Interrupt request 1 |
| Pin produk 60 | IRQ2 — Interrupt request 2 |
| Pin produk 61 | IRQ3 — Interrupt request 3 |
| Pin produk 62 | IRQ4 — Interrupt request 4 |
| Pin produk 63 | IRQ5 — Interrupt request 5 |
| Pin produk 64 | IRQ6 — Interrupt request 6 |
| Pin produk 65 | IRQ7 — Interrupt request 7 |
| Pin produk 66 | VCC — 5 V digital supply |
| Pin produk 67 | RESET — External reset (active low) |
| Pin produk 68 | XTAL — Crystal oscillator input |
| Pin produk 69 | EXTAL — Crystal oscillator / external clock |
| Pin produk 70 | CLKOUT — System clock output |
| Pin produk 71 | VSS — Digital ground |
| Pin produk 72 | TCLK — Timer clock input |
| Pin produk 73 | TPUCH0 — TPU channel 0 |
| Pin produk 74 | TPUCH1 — TPU channel 1 |
| Pin produk 75 | TPUCH2 — TPU channel 2 |
| Pin produk 76 | TPUCH3 — TPU channel 3 |
| Pin produk 77 | TPUCH4 — TPU channel 4 |
| Pin produk 78 | TPUCH5 — TPU channel 5 |
| Pin produk 79 | TPUCH6 — TPU channel 6 |
| Pin produk 80 | TPUCH7 — TPU channel 7 |
| Pin produk 81 | TPUCH8 — TPU channel 8 |
| Pin produk 82 | TPUCH9 — TPU channel 9 |
| Pin produk 83 | TPUCH10 — TPU channel 10 |
| Pin produk 84 | TPUCH11 — TPU channel 11 |
| Pin produk 85 | TPUCH12 — TPU channel 12 |
| Pin produk 86 | TPUCH13 — TPU channel 13 |
| Pin produk 87 | TPUCH14 — TPU channel 14 |
| Pin produk 88 | TPUCH15 — TPU channel 15 |
| Pin produk 89 | VSS — Digital ground |
| Pin produk 90 | PWM0 — CTM PWM output 0 |
| Pin produk 91 | PWM1 — CTM PWM output 1 |
| Pin produk 92 | PWM2 — CTM PWM output 2 |
| Pin produk 93 | PWM3 — CTM PWM output 3 |
| Pin produk 94 | PWM4 — CTM PWM output 4 |
| Pin produk 95 | PWM5 — CTM PWM output 5 |
| Pin produk 96 | IOC0 — I/O capture channel 0 |
| Pin produk 97 | IOC1 — I/O capture channel 1 |
| Pin produk 98 | IOC2 — I/O capture channel 2 |
| Pin produk 99 | IOC3 — I/O capture channel 3 |
| Pin produk 100 | IOC4 — I/O capture channel 4 |
| Pin produk 101 | IOC5 — I/O capture channel 5 |
| Pin produk 102 | IOC6 — I/O capture channel 6 |
| Pin produk 103 | IOC7 — I/O capture channel 7 |
| Pin produk 104 | VCC — 5 V digital supply |
| Pin produk 105 | CAN_TX — CAN 2.0B transmit output |
| Pin produk 106 | CAN_RX — CAN 2.0B receive input |
| Pin produk 107 | TXD0 — SCI0 transmit |
| Pin produk 108 | RXD0 — SCI0 receive |
| Pin produk 109 | TXD1 — SCI1 transmit |
| Pin produk 110 | RXD1 — SCI1 receive |
| Pin produk 111 | SCK — SPI clock |
| Pin produk 112 | MOSI — SPI master-out slave-in |
| Pin produk 113 | MISO — SPI master-in slave-out |
| Pin produk 114 | PCS0 — SPI peripheral chip-select 0 |
| Pin produk 115 | PCS1 — SPI peripheral chip-select 1 |
| Pin produk 116 | PCS2 — SPI peripheral chip-select 2 |
| Pin produk 117 | PCS3 — SPI peripheral chip-select 3 |
| Pin produk 118 | VSS — Digital ground |
| Pin produk 119 | PA0 — GPIO port A bit 0 |
| Pin produk 120 | PA1 — GPIO port A bit 1 |
| Pin produk 121 | PA2 — GPIO port A bit 2 |
| Pin produk 122 | PA3 — GPIO port A bit 3 |
| Pin produk 123 | PA4 — GPIO port A bit 4 |
| Pin produk 124 | PA5 — GPIO port A bit 5 |
| Pin produk 125 | PA6 — GPIO port A bit 6 |
| Pin produk 126 | PA7 — GPIO port A bit 7 |
| Pin produk 127 | PB0 — GPIO port B bit 0 |
| Pin produk 128 | PB1 — GPIO port B bit 1 |
| Pin produk 129 | PB2 — GPIO port B bit 2 |
| Pin produk 130 | PB3 — GPIO port B bit 3 |
| Pin produk 131 | PB4 — GPIO port B bit 4 |
| Pin produk 132 | PB5 — GPIO port B bit 5 |
| Pin produk 133 | PB6 — GPIO port B bit 6 |
| Pin produk 134 | PB7 — GPIO port B bit 7 |
| Pin produk 135 | PC0 — GPIO port C bit 0 |
| Pin produk 136 | PC1 — GPIO port C bit 1 |
| Pin produk 137 | PC2 — GPIO port C bit 2 |
| Pin produk 138 | PC3 — GPIO port C bit 3 |
| Pin produk 139 | VCC — 5 V digital supply |
| Pin produk 140 | PC4 — GPIO port C bit 4 |
| Pin produk 141 | PC5 — GPIO port C bit 5 |
| Pin produk 142 | PC6 — GPIO port C bit 6 |
| Pin produk 143 | PC7 — GPIO port C bit 7 |
| Pin produk 144 | PD0 — GPIO port D bit 0 |
| Pin produk 145 | PD1 — GPIO port D bit 1 |
| Pin produk 146 | PD2 — GPIO port D bit 2 |
| Pin produk 147 | PD3 — GPIO port D bit 3 |
| Pin produk 148 | PD4 — GPIO port D bit 4 |
| Pin produk 149 | PD5 — GPIO port D bit 5 |
| Pin produk 150 | PD6 — GPIO port D bit 6 |
| Pin produk 151 | PD7 — GPIO port D bit 7 |
| Pin produk 152 | VSS — Digital ground |
| Pin produk 153 | TDI — JTAG test data in |
| Pin produk 154 | TDO — JTAG test data out |
| Pin produk 155 | TMS — JTAG test mode select |
| Pin produk 156 | TCK — JTAG test clock |
| Pin produk 157 | TRST — JTAG test reset |
| Pin produk 158 | BKPT — Background debug breakpoint |
| Pin produk 159 | DSCLK — Development serial clock (BDM) |
| Pin produk 160 | DSEI — Development serial data in/out (BDM) |
Aplikasi Umum
MC68376BGCAB25 cocok untuk 6 aplikasis: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Anti-lock Braking System (ABS) Controller, Body and Chassis Controller, Industrial Motion Controller, Automotive Instrument Cluster.
Automotive Engine Control Unit (ECU)
The MC68376BGCAB25 is well-suited to automotive engine control units where deterministic interrupt response and on-chip CAN 2.0B are essential. The CPU32 core's 25 MHz instruction rate supports closed-loop fuel and ignition calculations within typical 10 ms crank-angle event windows, while the integrated CAN module handles OBD-II communication with other ECUs. The TPU (Time Processor Unit) offloads crank and cam shaft decoding from the CPU, freeing the core for control-law math, and the 160-QFP package's mature reflow profile suits high-volume automotive SMT lines. Designers should verify mask set errata for the CTM and TPU before production release.
Direkomendasikan
Transmission Control Module (TCM)
The MC68376BGCAB25 is a classic choice for electronic automatic transmission control modules. The 32-bit CPU32 core performs shift scheduling, torque converter slip control, and line-pressure management, while the 8 Kbyte internal RAM provides working memory for adaptive learning tables and the ROMless configuration allows the firmware to be updated via external flash without a costly mask ROM spin. The on-chip SCI/SPI interfaces talk to pressure sensors and solenoid drivers, and the CAN module communicates with the engine ECU and ABS controller. The 160-QFP package's thermal envelope accommodates the under-hood thermal load with adequate copper area.
Direkomendasikan
Anti-lock Braking System (ABS) Controller
The MC68376BGCAB25 supports anti-lock braking system controllers where 100 us-class wheel-deceleration control loops must be serviced deterministically. The TPU captures wheel-speed sensor pulses and triggers wheel-slip interrupts on a fixed schedule, offloading the most time-critical tasks from the CPU32 core. The integrated CAN 2.0B controller streams ABS status to the vehicle network, while the SCI/SPI interfaces drive the hydraulic modulator valves. The 5 V supply rail and -40C to +85C operating range suit under-hood ABS environments, and the ROMless configuration lets OEMs keep firmware upgradeable across model years.
Direkomendasikan
Body and Chassis Controller
The MC68376BGCAB25 powers body controllers that orchestrate lighting, wipers, door locks, HVAC blend doors, and instrument-cluster communication. Its SCI/SPI ports drive stepper motors and LED drivers, while the CAN module links to powertrain and chassis ECUs and the LIN-capable QSM (with external LIN transceiver) handles low-speed body bus nodes. The 32-bit CPU32 provides comfortable headroom for body-control state machines, and the 160-QFP package's 28 mm body fits typical PCB behind-dash real estate. Verify that GPIO count matches your switch and load matrix before committing to layout.
Direkomendasikan
Industrial Motion Controller
The MC68376BGCAB25 is also a fit for industrial motion controllers such as CNC spindle drives, servo amplifiers, and programmable logic controllers. The TPU generates precise PWM outputs for servo loops, while the CTM captures quadrature encoder feedback from brushless DC and stepper motors. The on-chip CAN 2.0B controller integrates cleanly with industrial CANopen or DeviceNet fieldbuses, and the SCI/SPI interfaces connect to gate drivers and ADC converters. The wide -40C to +85C industrial temperature range and 5 V supply suit factory-floor cabinets, and the ROMless configuration supports field firmware updates via external flash.
Direkomendasikan
Automotive Instrument Cluster
The MC68376BGCAB25 drives older automotive instrument clusters, where it scans analog gauges, manages telltale LEDs, and refreshes the LCD/VFD display. The CPU32 core handles the periodic cluster refresh task and runs the trip computer logic, while the SCI/SPI interfaces talk to stepper-motor pointer drivers and the CAN module receives vehicle data from the powertrain network. The 160-QFP package's 28 mm body fits behind the cluster's relatively large PCB, and the integrated timers generate the backlight PWM and dimming curves. The ROMless configuration supports multiple vehicle variants via external flash image selection.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk MC68376BGCAB25 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | SC68376BGCAB25 | MC68376BGCAB20 | MC68376BGMFT20 |
|---|---|---|---|---|
| Package | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Max Clock Frequency | 25 MHz | 25 MHz | 20 MHz | 20 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | 8 Kbyte internal mask ROM |
| AEC-Q100 | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Diferensiator Kunci
- Refreshed NXP part number with identical die (vsMC68376BGCAB20)
- Internal mask ROM for high-volume cost-down (vsMC68376BGMFT20)
- Automotive AEC-Q100 qualified (vsGeneric industrial 32-bit MCU)
Catatan Desain
The MC68376BGCAB25 operates from a single 5 V supply rail with multiple VCC/VSS pin pairs distributed across the 160-QFP package. Decouple each VCC pin with a 100 nF ceramic capacitor placed as close as possible (within 5 mm) to the lead, plus a bulk 10 uF tantalum or ceramic capacitor near the package. Estimated: at 25 MHz CPU clock and full peripheral activity, core current draw is approximately 80-120 mA; verify against the NXP MC68376 data sheet electrical characteristics table before sizing the 5 V regulator. Add a 100 uF bulk capacitor on the supply input for transient load handling during CAN transmit bursts.
ROMless variants of the MC68376 require external program memory (typically a 32 Kbyte x 16 EPROM or flash on CS0). The CS0 chip-select must be configured in the System Integration Module (SIM) before reset deassertion; otherwise the CPU fetches from an unconfigured region and locks up. The BERR (bus error) signal must be properly terminated with a pull-up because external bus faults otherwise trigger unpredictable address exceptions. Early mask sets have documented errata in the CTM and TPU - always check the NXP MC68376 mask set errata sheet for the exact date code on your parts.
The 160-QFP (28x28) package has a theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board with 1 oz copper. At 120 mA x 5 V (estimated worst-case core current), the device dissipates approximately 0.6 W, yielding a junction temperature rise of 21-24 C above ambient - well within the 125 C junction limit. For automotive under-hood applications at 85 C ambient, plan additional copper pour on the PCB or use thermal vias to keep the junction below 110 C for margin.
Informasi Konformitas
AEC-Q100 qualified per NXP automotive catalog. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not explicitly stated in the provided web data - mark as unknown and request the latest material declaration from NXP for production qualification.